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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU7EV-L2FFVF1517E: Zynq UltraScale+ MPSoC FPGA with Video Codec

Product Details

The AMD XCZU7EV-L2FFVF1517E is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) that combines a powerful 64-bit quad-core ARM processor with advanced programmable logic and an integrated H.264/H.265 video codec unit. This EV-series device delivers exceptional processing capabilities for demanding embedded vision, video processing, and industrial automation applications in a 1517-pin FCBGA package.

Key Features of the XCZU7EV-L2FFVF1517E

The XCZU7EV-L2FFVF1517E belongs to the Zynq UltraScale+ MPSoC EV family, specifically designed for applications requiring real-time video encoding and decoding alongside heterogeneous processing capabilities. The “L2” speed grade designation indicates a low-power variant that maintains full speed grade 2 performance while achieving up to 30% reduction in static power consumption.

Processing System (PS) Architecture

The processing system integrates a feature-rich combination of application and real-time processors:

Component Specification
Application Processor Quad-core ARM Cortex-A53 @ 1.5 GHz
Real-Time Processor Dual-core ARM Cortex-R5F @ 533 MHz
Graphics Processing Unit ARM Mali-400 MP2 @ 677 MHz
Video Codec Unit (VCU) H.264/H.265 Encoder & Decoder
VCU Performance 4K @ 60fps encode/decode

Programmable Logic (PL) Resources

The XCZU7EV-L2FFVF1517E offers substantial programmable logic resources built on 16nm FinFET+ technology:

Resource Quantity
System Logic Cells 504,000
Look-Up Tables (LUTs) 230,400
Flip-Flops 460,800
DSP Slices 1,728
Block RAM 11 Mb
Distributed RAM 6.2 Mb
UltraRAM 27 Mb
Total On-Chip Memory 44.2 Mb

Technical Specifications and Package Information

XCZU7EV-L2FFVF1517E Package Details

Parameter Value
Package Type FCBGA (Fine-Pitch Ball Grid Array)
Pin Count 1517
Package Dimensions 40 × 40 mm
Ball Pitch 1.0 mm
Technology Node 16nm FinFET+

Operating Conditions and Speed Grade

Parameter Specification
Speed Grade L2 (Low-Power, Speed Grade 2)
Temperature Grade E (Extended: -40°C to +100°C)
Core Voltage (VCCINT) 0.85V or 0.72V
Power Domain Control 4 Independent Domains

High-Speed Connectivity Options

The XCZU7EV-L2FFVF1517E provides extensive high-speed serial connectivity through GTH transceivers and integrated hard IP blocks.

GTH Transceiver Specifications

Feature Specification
GTH Transceivers 16 Channels
Maximum Data Rate 16.3 Gb/s per channel
Total Bandwidth 260.8 Gb/s aggregate
Parallel Width Options 16, 32, or 64 bits

Integrated Hard IP Blocks

Interface Capability
PCI Express Gen3 x8 (Hard Block)
USB 2× USB 3.0, 2× USB 2.0
SATA SATA 3.1
DisplayPort 4K @ 30Hz Output
Ethernet 4× Tri-mode Gigabit

I/O Configuration for FFVF1517 Package

Programmable Logic I/O Banks

I/O Type Quantity Voltage Range
High-Performance (HP) I/O 312 1.0V – 1.8V
High-Density (HD) I/O 48 1.2V – 3.3V
Multiplexed I/O (MIO) 78 PS Peripherals

Video Codec Unit (VCU) Capabilities

The integrated VCU in the XCZU7EV-L2FFVF1517E provides hardware-accelerated video processing that eliminates the need for external video encoder/decoder chips.

Supported Video Standards

Codec Encoding Decoding
H.265 (HEVC) Yes Yes
H.264 (AVC) Yes Yes

VCU Performance Metrics

Resolution Frame Rate Operation
4K (4096 × 2160) 60 fps Encode or Decode
8K (7680 × 4320) 15 fps Encode or Decode
1080p 240 fps Encode or Decode
Throughput 600 Mpixels/sec Maximum

Target Applications for XCZU7EV-L2FFVF1517E

The combination of high-performance processing, video codec capabilities, and extensive programmable logic makes the XCZU7EV-L2FFVF1517E ideal for:

Industrial and Embedded Vision

  • Machine vision inspection systems
  • Industrial camera interfaces
  • Real-time image processing
  • Quality control automation

Automotive and ADAS

  • Advanced Driver Assistance Systems
  • Surround-view camera systems
  • Electronic mirror (CMS) applications
  • Sensor fusion platforms

Broadcast and Professional Video

  • 4K/8K video production equipment
  • Live streaming encoders
  • Video conferencing systems
  • Medical imaging devices

Telecommunications and 5G

  • 5G wireless infrastructure
  • Network packet processing
  • Software-defined radio (SDR)
  • Base station applications

Artificial Intelligence and Machine Learning

  • Edge AI inference accelerators
  • Neural network processing
  • Deep learning platforms
  • Computer vision AI systems

Part Number Breakdown: XCZU7EV-L2FFVF1517E

Understanding the AMD Xilinx part numbering convention:

Segment Value Meaning
XC XC Xilinx Commercial
ZU ZU Zynq UltraScale+
7 7 Device Size (Mid-range)
EV EV Video Codec Variant
L2 L2 Low-Power Speed Grade 2
FF FF Flip-Chip Package
V V Lead-Free (RoHS)
F F Fine-Pitch
1517 1517 Pin Count
E E Extended Temperature

Power Management Features

The XCZU7EV-L2FFVF1517E implements advanced power management capabilities:

Power Domain Architecture

Domain Function Independent Control
Full Power Domain (FPD) APU, DDR, High-Speed Peripherals Yes
Low Power Domain (LPD) RPU, Low-Speed Peripherals Yes
Battery Power Domain (BPD) RTC, Security Monitoring Yes
Programmable Logic (PL) FPGA Fabric Yes

Low-Power Design Benefits

  • Up to 30% lower static power vs. standard speed grades
  • Dual voltage operation (0.85V / 0.72V)
  • Clock gating for unused peripherals
  • Power gating for inactive blocks

Memory Interface Support

DDR4 Memory Controller

Parameter Specification
Maximum Data Rate 2400 Mbps
Data Width 64-bit with ECC
Memory Types DDR4, LPDDR4
Controller Location PS (Processing System)

On-Chip Memory Summary

Memory Type Capacity Access
Block RAM 11 Mb Dual-Port
Distributed RAM 6.2 Mb LUT-Based
UltraRAM 27 Mb True Dual-Port
OCM (PS) 256 KB Tightly Coupled

Development Tools and Software Support

The XCZU7EV-L2FFVF1517E is fully supported by AMD’s comprehensive development ecosystem:

Design Tools

  • Vivado Design Suite (RTL to Bitstream)
  • Vitis Unified Software Platform
  • PetaLinux (Embedded Linux)
  • Vitis AI (Machine Learning)

Software Support

  • Linux kernel support
  • FreeRTOS for Cortex-R5F
  • Bare-metal applications
  • OpenCL acceleration

Why Choose the XCZU7EV-L2FFVF1517E?

The XCZU7EV-L2FFVF1517E offers a compelling combination of features for system designers:

  1. Integrated Video Codec: Hardware H.264/H.265 eliminates external chips and reduces BOM cost
  2. Heterogeneous Processing: Quad-core Cortex-A53 + dual-core Cortex-R5F covers application and real-time needs
  3. Low Power Operation: L2 speed grade delivers full performance with reduced power consumption
  4. Extended Temperature: -40°C to +100°C operation suits industrial and outdoor deployments
  5. High-Speed Connectivity: 16× GTH transceivers at 16.3 Gb/s enable advanced networking
  6. Large On-Chip Memory: 44.2 Mb total eliminates external SRAM requirements

Related Zynq UltraScale+ MPSoC Devices

Part Number Logic Cells VCU GTH Transceivers
XCZU5EV 256,200 Yes 4
XCZU7EV 504,000 Yes 16
XCZU9EG 599,550 No 24
XCZU11EG 649,800 No 32

For comprehensive Xilinx FPGA product selection and technical resources, explore our complete catalog of AMD Xilinx programmable devices.

Ordering Information

Part Number Description
XCZU7EV-L2FFVF1517E Zynq UltraScale+ MPSoC, 504K Logic Cells, VCU, L2 Speed, Extended Temp, 1517-FCBGA

Package Marking

The device package is marked with the full part number, date code, lot traceability code, and AMD logo for proper identification and quality tracking.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.