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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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AMD XCZU7EV-L2FBVB900E Zynq UltraScale+ MPSoC FPGA | Complete Specifications & Features

Product Details

The AMD XCZU7EV-L2FBVB900E is a high-performance System-on-Chip (SoC) FPGA from the Zynq UltraScale+ MPSoC EV family. This advanced embedded processor combines powerful ARM processing cores, programmable logic, and integrated video codec capabilities, making it the ideal solution for 4K video processing, AI/machine learning, autonomous driving, and industrial IoT applications.


AMD XCZU7EV-L2FBVB900E Overview

The XCZU7EV-L2FBVB900E represents AMD’s (formerly Xilinx) cutting-edge 16nm FinFET+ technology, delivering exceptional performance with optimized power consumption. As part of the EV (Embedded Vision) variant, this MPSoC integrates hardware video codec support for simultaneous H.264 and H.265 encode/decode at 4K resolution.

This device features the -L2 speed grade designation, specifically optimized for low-power applications while maintaining excellent performance characteristics. The FBVB900E package offers 900 balls in a compact 31×31mm FCBGA footprint with 1.0mm ball pitch.


Key Technical Specifications

Processing System Architecture

Component Specification
Application Processor Quad-core ARM® Cortex®-A53 MPCore™ up to 1.5 GHz
Real-Time Processor Dual-core ARM® Cortex®-R5F up to 600 MHz
Graphics Processing Unit ARM Mali™-400 MP2
Video Codec H.264/H.265 encoder/decoder (4K @ 60fps)
L2 Cache 1MB shared among Cortex-A53 cores
On-Chip Memory 256KB OCM

Programmable Logic Resources

Resource Quantity
System Logic Cells 504,000+
CLB Flip-Flops 460,800
CLB LUTs 230,400
DSP Slices 1,728
Block RAM 11 Mb
UltraRAM 24.5 Mb
Maximum Distributed RAM 4.5 Mb

High-Speed Connectivity

Interface Specification
GTH Transceivers 16× (up to 16.3 Gb/s)
PCIe® Support Gen2 x4
USB USB 2.0/3.0
Gigabit Ethernet Up to 4× SGMII
DisplayPort 1.2a compliant

Package & Electrical Characteristics

AMD XCZU7EV-L2FBVB900E Package Information

Parameter Value
Package Type FCBGA (Flip Chip Ball Grid Array)
Package Code FBVB900
Pin Count 900 Balls
Package Dimensions 31mm × 31mm
Ball Pitch 1.0mm
Speed Grade -L2 (Low Power Extended)
Temperature Grade Commercial (0°C to 100°C TJ)

Operating Voltages

Supply Rail Voltage
VCCINT (Core) 0.85V / 0.72V (low power mode)
VCCAUX 1.8V
VCCO (HP I/O) 1.0V to 1.8V
VCCO (HD I/O) 1.2V to 3.3V

Zynq UltraScale+ EV Family Features

Integrated Video Codec Engine

The XCZU7EV-L2FBVB900E includes AMD’s dedicated video codec unit (VCU) supporting:

  • Simultaneous H.264 and H.265 (HEVC) encode and decode
  • Resolution support up to 4K UHD at 60 frames per second
  • 8-bit and 10-bit color depth processing
  • Multiple stream processing for surveillance and broadcast applications
  • Low latency video pipeline for real-time applications

Advanced Security Features

The Zynq UltraScale+ MPSoC platform provides robust security capabilities:

  • Secure boot with RSA-4096 authentication
  • AES-256 bitstream encryption
  • Physical Unclonable Function (PUF) for device unique keys
  • TrustZone technology support
  • Tamper detection and response

Power Management

AMD’s intelligent power management architecture enables:

  • Independent power domains for PS and PL
  • Dynamic voltage and frequency scaling
  • Power gating of unused logic blocks
  • Up to 30% static power reduction compared to previous generations

Ideal Applications for AMD XCZU7EV-L2FBVB900E

The versatile architecture of this Zynq UltraScale+ MPSoC EV device makes it suitable for demanding embedded applications:

Video & Vision Processing

  • 4K/8K video streaming and transcoding
  • Multi-camera video surveillance systems
  • Professional broadcast equipment
  • Medical imaging devices
  • Machine vision and industrial inspection

Automotive Systems

  • Advanced Driver Assistance Systems (ADAS)
  • Autonomous vehicle computing platforms
  • Electronic mirror systems (CMS)
  • In-vehicle infotainment
  • LiDAR and radar signal processing

Industrial & Communications

  • 5G wireless infrastructure
  • Industrial Internet of Things (IIoT) gateways
  • Edge computing platforms
  • Software-defined radio (SDR)
  • Test and measurement equipment

Artificial Intelligence & Machine Learning

  • Deep learning inference acceleration
  • Neural network edge deployment
  • Computer vision AI applications
  • Real-time object detection and classification

Development Tools & Support

AMD provides comprehensive development resources for the XCZU7EV-L2FBVB900E:

Software Development

  • Vivado® Design Suite: Complete FPGA development environment
  • Vitis™ Unified Software Platform: Embedded and acceleration development
  • PetaLinux Tools: Embedded Linux development kit
  • Xilinx Runtime (XRT): Runtime library for acceleration

Evaluation Hardware

  • ZCU106 Evaluation Kit: Full-featured development platform with XCZU7EV
  • ZCU104 Evaluation Kit: Video-focused development board
  • Third-party development boards from ALINX, Avnet, and others

Documentation

  • DS891: Zynq UltraScale+ MPSoC Data Sheet Overview
  • DS925: DC and AC Switching Characteristics
  • UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual
  • UG1209: Embedded Design Tutorial

Part Number Decoder

Understanding the XCZU7EV-L2FBVB900E part numbering:

Segment Meaning
XC Xilinx Commercial
ZU Zynq UltraScale
7 Device size/resources tier
EV EV variant (with Video Codec)
-L2 Low power speed grade (-L2)
FBV FCBGA package, 1.0mm pitch
B900 900 ball count
E Commercial temperature range

Ordering Information & Availability

The AMD XCZU7EV-L2FBVB900E is available through authorized electronic component distributors. This part is RoHS compliant and meets environmental standards including EU RoHS (2011/65/EU, 2015/863).

Export Control Classification: ECCN 5A002.A.4

For more Xilinx FPGA products, development boards, and technical support, explore our comprehensive selection of AMD programmable logic devices.


Related Products

Consider these alternative Zynq UltraScale+ MPSoC devices based on your requirements:

Part Number Logic Cells Video Codec Package
XCZU7EV-1FBVB900E 504K+ Yes FBVB900
XCZU7EV-2FBVB900E 504K+ Yes FBVB900
XCZU7EG-L2FBVB900E 504K+ No (GPU only) FBVB900
XCZU9EV-L2FFVC900E 599K+ Yes FFVC900

Frequently Asked Questions

What is the difference between XCZU7EV and XCZU7EG?

The XCZU7EV includes the integrated H.264/H.265 video codec unit (VCU) for hardware video encoding and decoding, while the XCZU7EG only includes the Mali GPU without the video codec. Choose EV variants for video-intensive applications.

What does the -L2 speed grade mean?

The -L2 designation indicates a low-power optimized speed grade that can operate at reduced core voltage (0.72V) for extended battery life in portable applications while maintaining good performance levels.

Is the XCZU7EV-L2FBVB900E suitable for industrial applications?

While the “E” suffix indicates commercial temperature range (0°C to 100°C TJ), AMD offers industrial (-I) variants of this device family for extended temperature operation requirements.

What development kit should I use for the XCZU7EV?

The ZCU106 Evaluation Kit features the XCZU7EV device and is the recommended platform for developing applications targeting this specific MPSoC.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.