Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU7EV-L1FFVC1156I: Zynq UltraScale+ MPSoC FPGA for Industrial Applications

Product Details

The AMD XCZU7EV-L1FFVC1156I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family, engineered for demanding industrial applications requiring advanced video processing, real-time control, and programmable logic capabilities. This industrial-grade device combines a powerful multiprocessor architecture with integrated H.264/H.265 video codec functionality, making it the ideal choice for embedded vision, surveillance, ADAS, and multimedia applications.


Key Features of the AMD XCZU7EV-L1FFVC1156I

The XCZU7EV-L1FFVC1156I delivers exceptional performance through its heterogeneous processing architecture. This Xilinx FPGA device integrates multiple processing engines, programmable logic, and dedicated video acceleration hardware in a single chip solution.

Processing Architecture

The device features a comprehensive multiprocessor system that enables parallel processing and real-time control:

  • Application Processing Unit (APU): Quad-core ARM Cortex-A53 MPCore with CoreSight technology, operating at speeds up to 1.5GHz
  • Real-Time Processing Unit (RPU): Dual-core ARM Cortex-R5F processor with CoreSight for deterministic real-time applications
  • Graphics Processing Unit (GPU): ARM Mali-400 MP2 for video and graphics acceleration
  • Programmable Logic (PL): 504,000 logic cells with UltraScale+ architecture

H.264/H.265 Video Codec Unit (VCU)

As an EV-series device, the XCZU7EV-L1FFVC1156I includes a hardened video codec unit capable of:

  • Simultaneous encoding and decoding of video streams
  • Resolution support up to 4K UHD (3840×2160) at 60 frames per second
  • Multi-stream processing with up to eight 1080p@30Hz streams
  • H.264 (AVC) and H.265 (HEVC) codec support
  • JPEG decoder functionality

AMD XCZU7EV-L1FFVC1156I Technical Specifications

Specification Value
Part Number XCZU7EV-L1FFVC1156I
Manufacturer AMD (Xilinx)
Product Family Zynq UltraScale+ MPSoC EV Series
Logic Cells 504,000
DSP Slices 1,728
Block RAM 11 Mb
UltraRAM 13.5 Mb
Package Type FCBGA-1156 (Fine-pitch Ball Grid Array)
Package Dimensions 35mm × 35mm
Ball Pitch 1.0mm
Total I/O Pins 360
Process Technology 16nm FinFET+
Core Voltage 0.85V
Speed Grade -1 (Standard)
Temperature Grade Industrial (-40°C to +100°C Tj)
Power Designation L (Low Power)

Part Number Breakdown: Understanding XCZU7EV-L1FFVC1156I

Understanding the AMD part numbering system helps engineers select the right device variant:

Code Segment Meaning
XC Xilinx Commercial Product
ZU7 Zynq UltraScale+ Device Size (ZU7)
EV EV Family (Video Codec Enabled)
-L1 Low Power, Speed Grade 1
FF Flip-Chip Fine-pitch BGA Package
VC Package Variant Code
1156 1156 Total Balls
I Industrial Temperature Grade

Programmable Logic Resources

The XCZU7EV-L1FFVC1156I offers extensive programmable logic resources for custom hardware acceleration:

Resource Quantity
System Logic Cells 504,000
CLB Flip-Flops 461,000
CLB LUTs 230,000
Distributed RAM 3.7 Mb
Block RAM 11 Mb
UltraRAM 13.5 Mb
DSP Slices 1,728
GTH Transceivers 16 (up to 16.3 Gbps)
PCIe Gen3 x16 1

Memory and Interface Capabilities

External Memory Support

The processing system supports multiple memory types for high-bandwidth data storage:

  • DDR4: Up to 2400 MT/s with 64-bit data bus plus ECC
  • LPDDR4: Power-efficient option for portable applications
  • DDR3/DDR3L: Legacy support available
  • QSPI Flash: Configuration and boot storage
  • eMMC/SD: Mass storage options

High-Speed Interfaces

Interface Specification
PCIe Gen3 x16 or Gen2 x4
USB 3.0 Dual controllers with PHY
SATA 3.1 Dual ports
DisplayPort Source and sink capable
Gigabit Ethernet Dual RGMII/SGMII
CAN 2.0B Dual controllers

Target Applications for AMD XCZU7EV-L1FFVC1156I

The XCZU7EV-L1FFVC1156I excels in applications requiring video processing combined with real-time control:

Video and Vision Applications

  • 4K video conferencing systems
  • Multi-channel surveillance and security
  • Professional broadcast equipment
  • Medical imaging systems
  • Industrial machine vision

Automotive Applications

  • Advanced Driver Assistance Systems (ADAS)
  • In-vehicle infotainment (IVI)
  • Surround-view camera systems
  • Driver monitoring systems

Industrial Applications

  • Factory automation and robotics
  • Industrial IoT edge processing
  • Motor control with vision feedback
  • Test and measurement equipment

Communications Applications

  • 5G wireless infrastructure
  • Software-defined radio (SDR)
  • Network packet processing
  • Video streaming servers

Development and Design Support

AMD provides comprehensive tools and resources for XCZU7EV-L1FFVC1156I development:

Software Tools

  • Vivado Design Suite: Synthesis, implementation, and timing analysis
  • Vitis Unified Software Platform: Embedded software and AI acceleration
  • PetaLinux Tools: Linux OS customization and BSP generation

Evaluation Platforms

  • ZCU106 Evaluation Kit featuring the XCZU7EV device
  • Third-party development boards from ALINX, Avnet, and others
  • Reference designs for video, networking, and motor control

Documentation Resources

  • DS891: Zynq UltraScale+ MPSoC Data Sheet Overview
  • DS925: DC and AC Switching Characteristics
  • UG1075: Package Files and Pinout Information
  • UG1209: Embedded Design Tutorial

Ordering Information

Attribute Details
Part Number XCZU7EV-L1FFVC1156I
Package FCBGA-1156
Packaging Tray
Lead-Free Status Lead-Free / RoHS Compliant
Moisture Sensitivity Level MSL-3
ECCN 3A001.a.7
NCNR Status Non-Cancellable / Non-Returnable

Why Choose AMD XCZU7EV-L1FFVC1156I for Your Design?

The AMD XCZU7EV-L1FFVC1156I represents the optimal balance of processing performance, video capabilities, and industrial reliability. Key advantages include:

  1. Integrated Video Codec: Hardened H.264/H.265 VCU eliminates the need for external codec ICs
  2. Industrial Temperature Range: Qualified for operation from -40°C to +100°C junction temperature
  3. Low Power Operation: The L1 designation indicates optimized static power consumption
  4. Heterogeneous Processing: Combine ARM processors with FPGA fabric for optimal workload distribution
  5. Single-Chip Solution: Reduces BOM cost, PCB area, and system complexity
  6. Scalable Platform: Pin-compatible options available for design migration

Related Part Numbers

Part Number Description
XCZU7EV-1FFVC1156I Standard power variant
XCZU7EV-2FFVC1156I Speed grade -2 variant
XCZU7EG-L1FFVC1156I Non-video codec variant
XCZU9EV-L1FFVC1156I Larger logic capacity
XCZU5EV-L1FFVC1156I Smaller logic capacity

Conclusion

The AMD XCZU7EV-L1FFVC1156I delivers a powerful combination of ARM processing, FPGA programmability, and integrated video codec technology in an industrial-grade package. With 504,000 logic cells, quad-core Cortex-A53 processors, and 4K@60fps video encoding/decoding capability, this Zynq UltraScale+ MPSoC device provides the performance and flexibility needed for next-generation embedded vision, automotive, industrial, and communications applications.

For engineers developing systems requiring real-time video processing with hardware acceleration, the XCZU7EV-L1FFVC1156I offers unmatched integration and performance in the Zynq UltraScale+ portfolio.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.