Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU6CG-L2FFVC900E: High-Performance Zynq UltraScale+ MPSoC FPGA

Product Details

The AMD XCZU6CG-L2FFVC900E is a cutting-edge System-on-Chip (SoC) from the renowned Zynq UltraScale+ MPSoC family. This powerful FPGA combines the flexibility of programmable logic with the processing power of dual ARM Cortex-A53 cores. Designed for demanding embedded computing applications, the XCZU6CG-L2FFVC900E delivers exceptional performance in a compact 900-FCBGA package.

Whether you’re developing AI-powered edge devices, industrial automation systems, or next-generation embedded platforms, this Xilinx FPGA provides the perfect balance of processing power, programmable logic, and energy efficiency.


AMD XCZU6CG-L2FFVC900E Key Features and Benefits

The XCZU6CG-L2FFVC900E stands out in the Zynq UltraScale+ lineup for its optimized power consumption and robust processing capabilities. Here’s what makes this SoC FPGA a top choice for engineers and system designers.

Dual-Core ARM Cortex-A53 Application Processor

The integrated dual ARM Cortex-A53 MPCore with CoreSight technology delivers:

  • 64-bit processor scalability with AArch64 architecture
  • Operating frequency up to 1.2 GHz
  • Advanced power management features
  • Full hardware virtualization support

Dual ARM Cortex-R5 Real-Time Processor

For time-critical applications, the XCZU6CG-L2FFVC900E includes:

  • Dual ARM Cortex-R5F cores with CoreSight
  • Real-time processing at 533 MHz
  • Deterministic response for safety-critical systems
  • Lockstep mode for functional safety applications

High-Density Programmable Logic

The programmable logic section of this Zynq UltraScale+ device offers:

  • 469,446 Logic Cells (469K+ Logic Units)
  • Advanced 16nm FinFET+ process technology
  • Maximum operating frequency of 645 MHz
  • Flexible I/O configuration with 204 user I/O pins

XCZU6CG-L2FFVC900E Technical Specifications

Complete Specifications Table

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Part Number XCZU6CG-L2FFVC900E
Family Zynq UltraScale+ MPSoC CG
Device Type System On Chip (SoC) FPGA
Logic Cells 469,446
Logic Units 469,446
User I/O Pins 204
Package Type 900-FCBGA (Flip-Chip Fine-Pitch BGA)
Package Dimensions 31mm x 31mm
Pin Count 900
Process Technology 16nm FinFET+
Core Voltage (VCCINT) 0.85V
Speed Grade -2 (L2 – Low Power)
Temperature Grade Extended (E)
Operating Temperature -40°C to +100°C

Processor Subsystem Specifications

Component Details
Application Processing Unit (APU) Dual ARM Cortex-A53 MPCore
APU Frequency Up to 1.2 GHz
Real-Time Processing Unit (RPU) Dual ARM Cortex-R5F
RPU Frequency Up to 533 MHz
Architecture 64-bit ARMv8-A
Debug Interface CoreSight Technology

Memory and Connectivity Features

Feature Specification
DDR Support DDR3, DDR4, LPDDR3, LPDDR4 with ECC
On-Chip Memory UltraRAM and Block RAM
PCIe Support Gen2 x4
USB Support USB 3.0
Ethernet Gigabit Ethernet (GigE)
Additional Interfaces SATA 3.0, SPI, I2C, CAN, UART
Flash Controllers QSPI-NOR, SD, eMMC, ONFI NAND

Understanding the Part Number: XCZU6CG-L2FFVC900E

Breaking down the AMD part number helps you understand the exact device specifications:

Code Meaning
XC Xilinx Component
ZU6 Zynq UltraScale+ Device Size 6
CG Cost-optimized General Purpose (without Video Codec)
L2 Low Power, Speed Grade -2
FF Flip-Chip Package
VC Lead-Free (Pb-Free)
900 900-Pin BGA Package
E Extended Temperature Range

Ideal Applications for XCZU6CG-L2FFVC900E

The versatile architecture of the XCZU6CG-L2FFVC900E makes it suitable for numerous high-performance applications.

Industrial Automation and Control

  • Motor control and servo drives
  • Predictive maintenance systems
  • PLC and automation controllers
  • Industrial robotics

Artificial Intelligence and Machine Learning

  • Edge AI inference acceleration
  • CNN and DNN algorithm implementation
  • Computer vision processing
  • Real-time object detection

Embedded Computing Solutions

  • IoT gateway devices
  • Smart sensor fusion platforms
  • Autonomous systems
  • Medical imaging equipment

Communications Infrastructure

  • Software-defined radio (SDR)
  • Network processing
  • 5G infrastructure components
  • Base station equipment

Why Choose the Zynq UltraScale+ MPSoC CG Series?

Power Efficiency

The -L2 speed grade designation indicates this is a low-power variant. Operating at 0.85V core voltage, the XCZU6CG-L2FFVC900E provides excellent performance-per-watt ratios. This makes it ideal for thermally constrained or battery-powered applications.

Scalable Architecture

The Zynq UltraScale+ platform offers seamless migration paths. You can start development on the XCZU6CG and scale to larger devices like the XCZU9 or XCZU15 as your application demands grow.

Comprehensive Ecosystem

AMD provides extensive development support including:

  • Vivado Design Suite for FPGA development
  • Vitis Unified Software Platform
  • PetaLinux for embedded Linux deployment
  • Extensive reference designs and IP cores

Extended Temperature Operation

The “E” suffix indicates extended temperature range support (-40°C to +100°C). This makes the XCZU6CG-L2FFVC900E suitable for harsh industrial and outdoor environments.


XCZU6CG-L2FFVC900E Development Resources

Official Documentation

  • DS891 – Zynq UltraScale+ MPSoC Data Sheet Overview
  • DS925 – DC and AC Switching Characteristics
  • UG1075 – Packaging and Pinout User Guide
  • UG1085 – Zynq UltraScale+ MPSoC Technical Reference Manual

Development Tools

  • AMD Vivado Design Suite (Synthesis and Implementation)
  • AMD Vitis Unified Software Platform (Embedded Development)
  • PetaLinux Tools (Linux Deployment)
  • Model Composer (Model-Based Design)

Evaluation and Development Boards

Popular development platforms compatible with Zynq UltraScale+ devices include:

  • ZCU102 Evaluation Kit
  • ZCU104 Evaluation Kit
  • Ultra96-V2 Development Board
  • Third-party SoM (System-on-Module) solutions

Ordering Information and Availability

Package Options

Part Number Speed Grade Temperature Package
XCZU6CG-L2FFVC900E -2 (Low Power) Extended 900-FCBGA
XCZU6CG-L2FFVC900I -2 (Low Power) Industrial 900-FCBGA
XCZU6CG-1FFVC900E -1 Extended 900-FCBGA
XCZU6CG-2FFVC900I -2 Industrial 900-FCBGA

Related Devices in the XCZU6 Family

Part Number Logic Cells Package I/O Pins
XCZU6CG-L2FFVC900E 469,446 900-FCBGA 204
XCZU6CG-L2FFVB1156E 469,446 1156-FCBGA 360
XCZU6EG-L2FFVC900E 469,446 900-FCBGA 204

Frequently Asked Questions About XCZU6CG-L2FFVC900E

What is the difference between CG and EG variants?

The CG (Cost-optimized General) variant does not include the hardware video codec unit. The EG (Embedded Graphics) variant includes H.264/H.265 video codec hardware for video processing applications.

What speed grades are available?

The XCZU6CG is available in -1, -2, and -3 speed grades. The -3 devices offer the highest performance, while the L2 (Low Power -2) provides optimized power consumption.

Is the XCZU6CG-L2FFVC900E RoHS compliant?

Yes, this device is fully RoHS compliant. The “V” in the package code (FFVC) indicates it is a lead-free (Pb-Free) component.

What operating systems are supported?

The Zynq UltraScale+ MPSoC supports:

  • Bare-metal applications
  • FreeRTOS
  • Linux (via PetaLinux or Yocto)
  • VxWorks
  • QNX

Conclusion: XCZU6CG-L2FFVC900E for Next-Generation Embedded Systems

The AMD XCZU6CG-L2FFVC900E represents the pinnacle of embedded SoC FPGA technology. With its combination of dual ARM Cortex-A53 application processors, dual ARM Cortex-R5 real-time processors, and 469K+ programmable logic cells, this device enables unprecedented flexibility in embedded system design.

From industrial automation to AI edge computing, the XCZU6CG-L2FFVC900E provides the performance, programmability, and power efficiency needed for demanding applications. Its extended temperature range and low-power design make it suitable for a wide range of deployment environments.

For engineers seeking a powerful, versatile SoC FPGA solution, the XCZU6CG-L2FFVC900E delivers exceptional value and capabilities in the Zynq UltraScale+ MPSoC family.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.