The AMD XCZU6CG-L1FFVC900I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family. This industrial-grade device combines powerful ARM processors with advanced programmable logic, making it an excellent choice for demanding embedded applications in communications, industrial automation, aerospace, and defense sectors.
XCZU6CG-L1FFVC900I Overview and Key Features
The XCZU6CG-L1FFVC900I integrates a feature-rich 64-bit dual-core ARM Cortex-A53 processing system with a dual-core ARM Cortex-R5F real-time processor. This combination delivers exceptional processing power while maintaining the flexibility that FPGA-based designs require.
Processing System Specifications
| Parameter |
Specification |
| Application Processing Unit (APU) |
Dual-core ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F with CoreSight |
| APU Operating Frequency |
Up to 1.2 GHz |
| Processing System Frequency |
Up to 500 MHz |
| Architecture |
64-bit processor scalability |
The ARM Cortex-A53 cores support virtualization and can operate in single processor, symmetric dual processor, or asymmetric dual-processor modes. Each processor includes Level-1 (L1) and Level-2 (L2) cache hierarchies for optimal performance.
Programmable Logic Resources
The XCZU6CG-L1FFVC900I features UltraScale+ FPGA architecture with substantial programmable logic resources that enable complex hardware implementations.
Logic and Memory Specifications
| Resource |
Value |
| System Logic Cells |
469,446+ (469K+) |
| CLB Flip-Flops |
548,160 |
| CLB LUTs |
274,080 |
| Maximum Distributed RAM |
8.8 Mb |
| Block RAM/FIFO with ECC (36Kb each) |
312 blocks |
| Total Block RAM |
11.0 Mb |
| UltraRAM Blocks |
96 |
| UltraRAM Capacity |
27.0 Mb |
| DSP Slices |
1,728 |
The configurable logic blocks (CLBs) contain 6-input look-up tables (LUTs) and flip-flops that can implement complex digital logic functions. The DSP slices feature 27×18 multipliers with 48-bit accumulators and pre-adders, ideal for high-performance digital signal processing applications.
Package and Electrical Characteristics
XCZU6CG-L1FFVC900I Package Information
| Specification |
Details |
| Package Type |
900-pin FCBGA (Flip Chip Ball Grid Array) |
| Package Code |
FFVC900 |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Core Voltage (VCCINT) |
0.85V |
| Technology Node |
16nm FinFET+ |
| Lead-Free |
Yes (RoHS Compliant) |
Speed Grade and Temperature Rating
The “L1” designation indicates this is a low-power variant with the following characteristics:
| Parameter |
Specification |
| Speed Grade |
-1 (L variant for low power) |
| Temperature Range |
Industrial (-40°C to +100°C junction) |
| Power Optimization |
Screened for lower maximum static power |
| Operating Voltage Options |
0.85V or 0.72V VCCINT |
When operated at VCCINT = 0.85V, the speed specification matches the standard -1I speed grade. Operating at 0.72V reduces both static and dynamic power consumption.
I/O and Connectivity Features
The XCZU6CG-L1FFVC900I provides extensive connectivity options for interfacing with external components and memories.
I/O Specifications
| I/O Type |
Count |
| Maximum HP I/O (High Performance) |
204 |
| PS MIO Pins |
78 |
| HP I/O Voltage Range |
1.0V to 1.8V |
| HD I/O Voltage Range |
1.2V to 3.3V |
Integrated Peripherals
The processing system includes numerous hardened peripherals:
- DDR Memory Controller supporting DDR3, DDR4, and LPDDR3/4 SDRAM with ECC
- Dual USB 2.0 controllers (host, device, or OTG configurable)
- Quad SPI Flash controller
- NAND Flash controller
- SD/eMMC controller
- Four triple-speed Gigabit Ethernet MACs
- I2C, SPI, UART, and CAN2.0B controllers
- 128-bit GPIO (78 MIO + 96 EMIO)
High-Speed Transceiver Support
For high-bandwidth serial communication, the XCZU6CG-L1FFVC900I includes GTH transceivers supporting data rates up to 16.3 Gb/s. The PS-GTR transceivers in the full-power domain support:
| Interface |
Specification |
| PS-GTR Transceivers |
4 channels |
| Maximum Data Rate |
Up to 6.0 Gb/s |
| Supported Protocols |
DisplayPort, USB 3.0, SATA 3.0, PCIe Gen2 |
Clock Management and Architecture
Clock Management Tiles (CMTs)
| Resource |
Quantity |
| Clock Management Tiles |
8 |
| MMCMs per CMT |
1 |
| PLLs per CMT |
2 |
The segmented clock region architecture provides flexible, high-performance, low-power clock distribution. Each clock region contains 60 CLBs in height, with vertical and horizontal clock routing that spans the full region.
Development Tools and Software Support
AMD Vitis Unified Software Platform
The AMD Vitis Unified Software Platform provides comprehensive embedded development support for the XCZU6CG-L1FFVC900I. Key features include:
- C/C++ application development for ARM processors
- Hardware acceleration using programmable logic
- System debugging and profiling tools
- Boot image creation and deployment
Vivado Design Suite
For FPGA design and implementation:
- Synthesis and implementation tools
- Timing analysis and closure
- Power analysis and optimization
- IP integrator for system design
Target Applications
The XCZU6CG-L1FFVC900I is optimized for demanding applications including:
Industrial and Automation
- Industrial Internet of Things (IIoT) gateways
- Machine vision systems
- Motor control and robotics
- Process automation controllers
Communications
- 5G wireless infrastructure
- Software-defined radio
- Network packet processing
- Baseband signal processing
Automotive and Aerospace
- Next-generation Advanced Driver Assistance Systems (ADAS)
- Autonomous vehicle computing
- Avionics systems
- Radar and sensor fusion
Medical and Scientific
- Medical imaging equipment
- Laboratory instrumentation
- Data acquisition systems
- High-performance computing
Ordering Information and Part Number Breakdown
Understanding the XCZU6CG-L1FFVC900I part number:
| Segment |
Meaning |
| XC |
Xilinx Commercial |
| ZU |
Zynq UltraScale+ |
| 6 |
Device size (mid-range) |
| CG |
CG variant (dual Cortex-A53, no GPU) |
| L1 |
Low-power -1 speed grade |
| FFVC |
Flip Chip Fine-pitch BGA |
| 900 |
900-pin package |
| I |
Industrial temperature range |
Technical Documentation
For complete specifications and design implementation, refer to:
- DS891: Zynq UltraScale+ MPSoC Data Sheet Overview
- DS925: Zynq UltraScale+ MPSoC DC and AC Switching Characteristics
- UG1075: Zynq UltraScale+ MPSoC Packaging and Pinouts
- UG571: UltraScale Architecture SelectIO Resources User Guide
Why Choose the XCZU6CG-L1FFVC900I
The XCZU6CG-L1FFVC900I offers several advantages for embedded system designers:
- Integrated Processing Power: Combines dual ARM Cortex-A53 and dual Cortex-R5F processors with programmable logic in a single device
- Low Power Operation: L-variant screening ensures optimal power efficiency for battery-powered and thermally constrained designs
- Industrial Reliability: -40°C to +100°C junction temperature support for harsh environment operation
- Extensive I/O Flexibility: 204 user I/Os with support for multiple voltage standards
- Long Product Lifecycle: AMD UltraScale+ devices supported through 2045
For more options in programmable logic devices, explore our complete Xilinx FPGA product catalog featuring the latest AMD adaptive SoCs and FPGAs.
Summary
The AMD XCZU6CG-L1FFVC900I represents a powerful solution for embedded applications requiring high-performance processing combined with hardware flexibility. With its dual ARM Cortex-A53 processors, 469K+ logic cells, 1,728 DSP slices, and comprehensive peripheral set, this Zynq UltraScale+ MPSoC delivers the performance and features necessary for next-generation industrial, automotive, and communications applications.
