The AMD XCZU6CG-L1FFVB1156I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family. This industrial-grade embedded processor combines powerful ARM Cortex processors with advanced programmable logic, making it ideal for demanding applications in automation, telecommunications, and edge computing.
Key Features of the XCZU6CG-L1FFVB1156I
The XCZU6CG-L1FFVB1156I delivers exceptional performance through its heterogeneous architecture. This device integrates dual ARM Cortex-A53 application processors and dual ARM Cortex-R5F real-time processors with high-density FPGA fabric, enabling flexible hardware acceleration and real-time control in a single chip solution.
Processing System Specifications
The processing system of the XCZU6CG-L1FFVB1156I features a robust multi-core architecture designed for complex embedded applications:
| Parameter |
Specification |
| Application Processing Unit |
Dual ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processing Unit |
Dual ARM Cortex-R5F with CoreSight |
| L1 Cache |
32KB Instruction / 32KB Data per core |
| L2 Cache |
1MB shared (APU) |
| Floating Point |
Single & Double Precision |
| Maximum APU Frequency |
Up to 1.2 GHz |
Programmable Logic Resources
The FPGA fabric in this Zynq UltraScale+ device provides substantial resources for custom hardware acceleration:
| Resource |
Quantity |
| System Logic Cells |
469,446 |
| CLB Flip-Flops |
429,208 |
| CLB LUTs |
214,604 |
| Distributed RAM |
6.2 Mb |
| Block RAM |
11.0 Mb |
| DSP Slices |
1,728 |
| Clock Management Tiles |
8 |
High-Speed Connectivity Options
The XCZU6CG-L1FFVB1156I offers comprehensive connectivity for modern embedded systems:
| Interface |
Capability |
| GTH Transceivers |
24 channels @ 16.3 Gb/s |
| PS-GTR Transceivers |
4 channels @ 6.0 Gb/s |
| PCIe |
Gen1/Gen2 support |
| USB |
USB 3.0 and USB 2.0 |
| Ethernet |
Gigabit Ethernet |
| Display |
DisplayPort 1.2a |
| Storage |
SATA 3.1, QSPI, SD/eMMC |
Technical Specifications
Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
0.72V / 0.85V |
| Speed Grade |
-1L (Low Power Industrial) |
| Temperature Range |
Industrial (-40°C to +100°C) |
| Process Technology |
16nm FinFET+ |
Package Information
| Specification |
Detail |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Package Code |
FFVB1156 |
| Ball Count |
1156 |
| Ball Pitch |
1.0mm |
| Dimensions |
35mm x 35mm |
| Mounting Type |
Surface Mount |
Part Number Breakdown
Understanding the AMD part numbering system helps identify device capabilities:
- XC – Xilinx Component
- ZU6 – Zynq UltraScale+ device size (6)
- CG – CG variant (dual Cortex-A53, no GPU)
- -L1 – Speed grade (-1, Low power variant)
- FFV – Flip-chip, fine-pitch BGA
- B1156 – 1156-ball package
- I – Industrial temperature grade
Applications for the Zynq UltraScale+ MPSoC
The XCZU6CG-L1FFVB1156I excels in applications requiring both processing power and hardware flexibility:
Industrial Automation
This device supports advanced motor control, sensor fusion, and real-time industrial protocols. The combination of real-time processors and programmable logic enables deterministic response times critical for factory automation.
Edge Computing and AI Inference
With substantial DSP resources and configurable logic, the XCZU6CG-L1FFVB1156I accelerates machine learning inference at the edge. The ARM processors handle model management while FPGA fabric performs parallel computation.
Telecommunications Infrastructure
The high-speed transceivers and processing capabilities make this device suitable for 5G infrastructure, wireless base stations, and network packet processing applications.
Medical and Scientific Instrumentation
Real-time signal processing, image acquisition, and precise control algorithms benefit from the heterogeneous architecture of this Zynq UltraScale+ device.
Aerospace and Defense Systems
The industrial temperature rating and robust architecture support mission-critical applications requiring reliable performance in harsh environments.
Development Tools and Software Support
AMD provides comprehensive development resources for the XCZU6CG-L1FFVB1156I:
- Vivado Design Suite – Hardware design, synthesis, and implementation
- Vitis Unified Software Platform – Embedded software and AI development
- PetaLinux Tools – Linux-based embedded OS development
- Xilinx SDK – Standalone and RTOS application development
Comparison with Related Devices
The XCZU6CG-L1FFVB1156I belongs to the CG subfamily of Zynq UltraScale+ MPSoCs. For applications requiring a GPU, consider the EG variant. For integrated video codec capabilities, the EV variant provides hardware H.264/H.265 encoding and decoding.
| Variant |
Cortex-A53 |
Cortex-R5F |
GPU |
Video Codec |
| CG (This Device) |
Dual |
Dual |
No |
No |
| EG |
Quad |
Dual |
Mali-400 |
No |
| EV |
Quad |
Dual |
Mali-400 |
H.264/H.265 |
Why Choose the XCZU6CG-L1FFVB1156I
The XCZU6CG-L1FFVB1156I offers an optimal balance of processing power, programmable logic resources, and power efficiency. The -L1 speed grade provides reduced static power consumption while maintaining performance suitable for industrial applications. With its industrial temperature rating and comprehensive I/O options, this device serves as a robust platform for next-generation embedded systems.
For engineers designing complex embedded systems that require both software programmability and hardware acceleration, the Zynq UltraScale+ MPSoC architecture eliminates the need for separate processor and FPGA chips, reducing board complexity, power consumption, and system cost.
Explore our complete selection of Xilinx FPGA devices to find the right solution for your application requirements.
Ordering Information
| Attribute |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCZU6CG-L1FFVB1156I |
| Series |
Zynq UltraScale+ MPSoC |
| Packaging |
Tray |
| RoHS Status |
Compliant |
| Export Classification |
ECCN: 3A001.a.7 |
