Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU6CG-2FFVB1156I: Zynq UltraScale+ MPSoC FPGA System on Chip

Product Details

The AMD XCZU6CG-2FFVB1156I is a high-performance System on Chip (SoC) from the Zynq UltraScale+ MPSoC family, combining powerful ARM processors with advanced programmable logic. This industrial-grade device delivers exceptional processing capabilities for demanding embedded applications in aerospace, defense, industrial automation, and communications systems.


XCZU6CG-2FFVB1156I Key Features and Benefits

The XCZU6CG-2FFVB1156I integrates a heterogeneous multiprocessing architecture that combines the flexibility of an FPGA with the processing power of ARM cores. This combination enables real-time control, sensor fusion, and hardware acceleration within a single chip solution.

Dual ARM Cortex-A53 Application Processing Unit

The device features a Dual ARM Cortex-A53 MPCore with CoreSight debugging capability, operating at frequencies up to 1.3GHz. This 64-bit application processor delivers high-performance computing for complex software workloads while maintaining energy efficiency.

Dual ARM Cortex-R5F Real-Time Processing Unit

For deterministic real-time operations, the XCZU6CG-2FFVB1156I includes Dual ARM Cortex-R5F processors with CoreSight, operating at 533MHz. These cores handle time-critical tasks with predictable latency, making the device suitable for industrial control and safety-critical applications.


XCZU6CG-2FFVB1156I Technical Specifications

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Part Number XCZU6CG-2FFVB1156I
Family Zynq UltraScale+ MPSoC CG
Process Technology 16nm FinFET+
Speed Grade -2 (Industrial)
Package Type 1156-FCBGA (Flip Chip Ball Grid Array)
Package Dimensions 35mm x 35mm
Ball Pitch 1.0mm
Operating Temperature -40°C to +100°C (Industrial Grade)
Core Voltage (VCCINT) 0.85V

Programmable Logic Resources

The XCZU6CG-2FFVB1156I provides extensive programmable logic resources based on the UltraScale+ architecture, enabling custom hardware acceleration and peripheral implementation.

Logic Cell and CLB Configuration

Resource Quantity
System Logic Cells 469,446 (469K+)
CLB Flip-Flops 429K
CLB LUTs (6-input) 215K
Maximum Distributed RAM 6.9 Mb

DSP Slices and Digital Signal Processing

The device includes 1,973 DSP48E2 slices, each featuring a 27×18-bit multiplier with a 48-bit accumulator. These DSP slices support multiply-accumulate operations, making the XCZU6CG-2FFVB1156I ideal for signal processing applications including filtering, FFT computation, and image processing algorithms.

Block RAM and Memory Architecture

Memory Resource Specification
Total Block RAM 25.1 Mb
Block RAM Blocks 312 (36Kb each)
UltraRAM Not available in CG devices
Maximum Distributed RAM 6.9 Mb

High-Speed Connectivity and I/O

GTH Transceivers for Serial Communication

The XCZU6CG-2FFVB1156I incorporates 24 GTH transceivers supporting data rates up to 16.3 Gb/s. These transceivers enable implementation of high-speed serial protocols including PCIe, SATA, DisplayPort, and custom serial interfaces.

SelectIO Interface and User I/O

I/O Specification Value
Maximum User I/Os 256 (package dependent)
HP I/O Banks High-Performance 1.8V capable
HD I/O Banks High-Density 3.3V capable
Supported Standards LVCMOS, LVDS, HSTL, SSTL, POD

Integrated Peripheral Interfaces

The Processing System (PS) includes dedicated peripheral controllers for common interfaces:

  • DDR4/DDR3L Memory Controller (up to 2400 Mb/s)
  • USB 3.0 and USB 2.0 Controllers
  • Gigabit Ethernet MAC with IEEE 1588
  • PCIe Gen2 x4 Root Complex/Endpoint
  • SATA 3.1 Host Controller
  • SD/SDIO and eMMC Controller
  • SPI, I2C, UART, CAN, and GPIO

Clock Management and Timing

Clock Management Tiles (CMTs)

The XCZU6CG-2FFVB1156I features 4 Clock Management Tiles, each containing:

  • Mixed-Mode Clock Manager (MMCM)
  • Phase-Locked Loop (PLL)
  • Clock buffers with glitchless switching

These resources enable generation of multiple clock domains with precise frequency synthesis and phase alignment.


Security Features for Industrial Applications

The Zynq UltraScale+ MPSoC family includes comprehensive security features essential for industrial and defense applications:

  • AES-GCM 256-bit Encryption for secure boot and bitstream protection
  • SHA-3/384 Hash Authentication for firmware integrity verification
  • Secure Key Storage with tamper detection
  • ARM TrustZone Technology for software isolation

Development Tools and Software Support

Vivado Design Suite Compatibility

The XCZU6CG-2FFVB1156I is fully supported by AMD Vivado Design Suite, providing:

  • High-Level Synthesis (HLS) for C/C++ to RTL conversion
  • IP Integrator for system-level design
  • Power analysis and optimization tools
  • Timing closure and implementation flows

PetaLinux and Vitis Platform

Software development is supported through:

  • PetaLinux for embedded Linux development
  • Vitis Unified Software Platform for application acceleration
  • Bare-metal and RTOS support for real-time applications

XCZU6CG-2FFVB1156I Applications

The combination of heterogeneous processing and programmable logic makes the XCZU6CG-2FFVB1156I suitable for diverse industrial applications:

Industrial Motor Control and Automation

The dual Cortex-R5F processors provide deterministic real-time control for multi-axis motor drives, while the programmable logic implements custom PWM generation and sensor interfaces.

Aerospace and Defense Systems

With industrial temperature range operation and comprehensive security features, the device supports radar signal processing, electronic warfare systems, and secure communications equipment.

Test and Measurement Equipment

High-speed transceivers and extensive DSP resources enable implementation of protocol analyzers, oscilloscopes, and spectrum analyzers with real-time data processing.

Medical Imaging Systems

The processing power and I/O bandwidth support ultrasound imaging, CT scanner control, and patient monitoring systems requiring real-time image processing.


Package and Ordering Information

XCZU6CG-2FFVB1156I Part Number Breakdown

Code Meaning
XC Xilinx Commercial
ZU6 Zynq UltraScale+ Size 6
CG CG Variant (Dual Cortex-A53, No GPU)
-2 Speed Grade -2
FF Flip-Chip Fine-pitch
VB1156 1156-Ball BGA Package
I Industrial Temperature Range

Available Package Options

The XCZU6CG device is available in multiple packages for design flexibility:

Package Pin Count Dimensions
FFVC900 900 31mm x 31mm
FFVB1156 1156 35mm x 35mm

Why Choose the XCZU6CG-2FFVB1156I

The XCZU6CG-2FFVB1156I offers compelling advantages for embedded system designers:

  1. Heterogeneous Processing: Combine software flexibility with hardware acceleration
  2. Industrial Grade Reliability: Extended temperature operation for harsh environments
  3. Scalable Architecture: Footprint compatible with other Zynq UltraScale+ devices
  4. Comprehensive Security: Hardware-based protection for sensitive applications
  5. Extensive I/O: High-speed transceivers and flexible parallel interfaces

Related Products and Alternatives

For designers requiring different resource configurations, AMD offers related devices in the Zynq UltraScale+ family:

  • XCZU6CG-1FFVB1156I: Lower speed grade (-1) for cost optimization
  • XCZU6CG-2FFVB1156E: Extended temperature range variant
  • XCZU6EG-2FFVB1156I: EG variant with Mali GPU for graphics applications
  • XCZU9CG-2FFVB1156I: Higher logic capacity for complex designs

Where to Buy XCZU6CG-2FFVB1156I

Looking for AMD Xilinx Zynq UltraScale+ MPSoC devices and other FPGA components? Browse our complete selection of Xilinx FPGA products for competitive pricing and availability.


Frequently Asked Questions

What is the difference between XCZU6CG and XCZU6EG?

The XCZU6CG is the “CG” variant featuring dual Cortex-A53 processors without a GPU, optimized for industrial control and sensor fusion. The XCZU6EG “EG” variant adds a Mali-400 MP2 GPU for graphics-intensive applications.

What development boards support the XCZU6CG?

Several development platforms support XCZU6CG devices, including evaluation boards from AMD and third-party vendors. Contact manufacturers for specific board availability.

What is the typical power consumption?

Power consumption varies based on design utilization and operating conditions. Use the Xilinx Power Estimator (XPE) tool for accurate power analysis specific to your application.

Is the XCZU6CG-2FFVB1156I RoHS compliant?

Yes, the XCZU6CG-2FFVB1156I is RoHS compliant and lead-free, meeting environmental regulations for electronic components.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.