The AMD XCZU6CG-1FFVC900I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC CG family. This industrial-grade programmable device combines powerful ARM processors with flexible FPGA logic, making it an ideal choice for demanding embedded applications in industrial automation, communications, and advanced computing systems.
XCZU6CG-1FFVC900I Key Features and Overview
The XCZU6CG-1FFVC900I integrates a feature-rich 64-bit dual-core ARM Cortex-A53 application processing unit with a dual-core ARM Cortex-R5F real-time processing unit. This heterogeneous multiprocessing architecture delivers exceptional processing power combined with UltraScale+ programmable logic for maximum design flexibility.
This SoC FPGA is manufactured using advanced 16nm FinFET+ technology, providing an optimal balance between performance, power efficiency, and system integration capabilities.
XCZU6CG-1FFVC900I Technical Specifications
Processor Configuration
| Parameter |
Specification |
| Application Processing Unit (APU) |
Dual-core ARM Cortex-A53 MPCore with CoreSight |
| APU Frequency |
Up to 1.2GHz (1.5GHz capable) |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5F with CoreSight |
| RPU Frequency |
Up to 500MHz (600MHz capable) |
| L1 Cache (per core) |
32KB Instruction + 32KB Data |
| L2 Cache |
1MB shared (16-way set-associative with ECC) |
| Floating Point |
Single/Double Precision FPU |
| SIMD Engine |
NEON Advanced SIMD |
Programmable Logic Resources
| Resource |
Quantity |
| System Logic Cells |
469,446 |
| CLB Flip-Flops |
429,208 |
| CLB LUTs |
214,604 |
| Distributed RAM |
6.9 Mb |
| Block RAM Blocks |
714 |
| Block RAM (Total) |
25.1 Mb |
| DSP Slices |
1,973 |
| Clock Management Tiles (CMTs) |
4 |
I/O and Connectivity
| Interface |
Specification |
| Max HP I/O (High-Performance) |
208 |
| Max HD I/O (High-Density) |
120 |
| PS I/O |
214 |
| GTH Transceivers (16.3Gb/s) |
24 |
| PS-GTR Transceivers (6.0Gb/s) |
4 |
| Transceiver Fractional PLLs |
12 |
Package and Environmental Specifications
| Parameter |
Specification |
| Package Type |
900-FCBGA (Flip Chip Ball Grid Array) |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Operating Temperature |
-40°C to +100°C (TJ) Industrial Grade |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-1 (Industrial) |
| Process Technology |
16nm FinFET+ |
| Packaging |
Tray |
| RoHS Compliance |
Yes |
XCZU6CG-1FFVC900I Memory Interfaces and On-Chip Resources
On-Chip Memory
- OCM (On-Chip Memory): 256KB with ECC support
- Block RAM: 25.1 Mb with built-in FIFO and ECC support
- Distributed RAM: 6.9 Mb configurable within CLBs
- TCM (Tightly Coupled Memory): 128KB per RPU core with ECC
External Memory Support
| Memory Type |
Interface Width |
Data Rate |
| DDR4 |
32-bit / 64-bit |
Up to 2400 Mb/s |
| DDR3/DDR3L |
32-bit / 64-bit |
Supported |
| LPDDR3 |
32-bit / 64-bit |
Supported |
| LPDDR4 |
32-bit |
Supported |
| Quad-SPI |
x1/x2/x4/x8 |
Boot/Configuration |
| NAND (ONFI 3.1) |
8-bit |
24-bit ECC |
| eMMC 4.51 |
8-bit |
Supported |
XCZU6CG-1FFVC900I Connectivity and Peripheral Interfaces
High-Speed Serial Connectivity
| Interface |
Specification |
| PCIe |
Gen1/Gen2 (x1, x2, x4) via PS-GTR |
| USB 3.0 |
2 controllers (5.0 Gb/s) |
| USB 2.0 |
Host/Device/OTG modes |
| SATA |
3.1 compliant (up to 6.0 Gb/s) |
| DisplayPort |
1.2a (up to 5.4 Gb/s, 2 TX lanes) |
| Gigabit Ethernet |
4x 10/100/1000 MAC with IEEE 1588 |
| SGMII |
Up to 4 channels |
General Connectivity
| Peripheral |
Quantity/Details |
| UART |
2 (up to 1 Mb/s) |
| SPI |
2 full-duplex ports |
| I2C |
2 master/slave interfaces |
| CAN 2.0B |
2 controllers (ISO 11898-1) |
| GPIO |
Up to 78 MIO + 96 EMIO |
| SD/SDIO |
2 controllers (SD 3.0, eMMC 4.51) |
XCZU6CG-1FFVC900I DSP and Signal Processing Capabilities
The XCZU6CG-1FFVC900I features 1,973 DSP48E2 slices optimized for high-performance digital signal processing applications.
DSP Slice Features
- 27 x 18-bit signed multiplier
- 48-bit adder/accumulator
- 27-bit pre-adder for symmetric filter optimization
- 96-bit XOR for forward error correction
- Pattern detector for convergent/symmetric rounding
- SIMD support (dual 24-bit or quad 12-bit operations)
XCZU6CG-1FFVC900I Security and System Features
Hardware Security
- AES-GCM: 256-bit hardware encryption
- SHA-3/384: Secure hash algorithm
- RSA: 4096-bit authentication
- Secure Boot: Supported via CSU
- TrustZone: ARM security extensions
System Management
- Platform Management Unit (PMU): Power and system state control
- Configuration Security Unit (CSU): Secure boot management
- System Monitor: On-chip voltage and temperature sensing
- Power Domains: FPD, LPD, BPD for independent power management
XCZU6CG-1FFVC900I Target Applications
The AMD XCZU6CG-1FFVC900I is designed for demanding applications including:
- Industrial Automation: Motor control, factory automation, robotics
- Wireless Communications: 5G baseband, small cells, radio units
- Wired Communications: Network processing, packet inspection
- Embedded Vision: Image processing, machine vision, object detection
- Automotive: ADAS, driver information systems, infotainment
- Data Centers: SDN, network acceleration, data pre-processing
- Test & Measurement: High-speed data acquisition, signal analysis
XCZU6CG-1FFVC900I Development Tools and Software Support
Hardware Development
- Vivado Design Suite: Complete FPGA design environment
- Vitis Unified Software Platform: Embedded software development
- PetaLinux: Linux-based embedded OS development
Operating System Support
- Linux (various distributions)
- FreeRTOS
- VxWorks
- Bare-metal applications
XCZU6CG-1FFVC900I Part Number Breakdown
| Code Segment |
Meaning |
| XC |
Xilinx Commercial |
| ZU6 |
Zynq UltraScale+ Device Size |
| CG |
CG Family (Dual APU, Dual RPU) |
| -1 |
Speed Grade (-1 Industrial) |
| FFVC900 |
900-pin FCBGA Package |
| I |
Industrial Temperature Grade |
Related Products and Footprint Compatibility
The XCZU6CG-1FFVC900I is footprint compatible with other Zynq UltraScale+ MPSoC devices in the FFVC900 package, enabling easy migration between devices for scalability:
- XCZU6EG-1FFVC900I (with GPU and Quad-core APU)
- XCZU9CG-1FFVC900I (higher logic capacity)
- XCZU9EG-1FFVC900I (higher capacity with GPU)
Where to Buy AMD XCZU6CG-1FFVC900I
Looking for high-quality AMD/Xilinx FPGA components? Explore our complete selection of Xilinx FPGA products for competitive pricing and reliable supply chain solutions.
XCZU6CG-1FFVC900I Documentation and Resources
- Datasheet: DS891 – Zynq UltraScale+ MPSoC Data Sheet Overview
- Technical Reference Manual: Complete hardware specifications
- Package Pinout: UG1075 – Zynq UltraScale+ MPSoC Packaging and Pinouts
- DC/AC Specifications: DS925 – Zynq UltraScale+ MPSoC DC and AC Switching Characteristics
