The AMD XCZU6CG-1FFVC900E is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC CG family. This advanced device integrates dual ARM Cortex-A53 application processors with programmable logic, delivering exceptional performance for industrial motor control, sensor fusion, and embedded computing applications. Built on 16nm FinFET technology, the XCZU6CG-1FFVC900E offers an ideal balance of processing power, programmable flexibility, and power efficiency.
XCZU6CG-1FFVC900E Key Features and Benefits
Dual-Core ARM Cortex-A53 Processing System
The XCZU6CG-1FFVC900E features a powerful 64-bit processing system that includes dual ARM Cortex-A53 MPCore processors with CoreSight debugging capability. These application processors operate at frequencies up to 1.2 GHz and include NEON SIMD extensions with single and double-precision floating-point support. Each processor core has 32KB L1 instruction cache and 32KB L1 data cache, with a shared 1MB L2 cache for optimal performance.
Real-Time Processing Unit (RPU)
For time-critical applications, the device includes dual ARM Cortex-R5F real-time processors operating at up to 500 MHz. These processors feature single and double-precision floating-point units, 32KB L1 caches, and tightly coupled memory (TCM) for deterministic real-time response.
High-Capacity Programmable Logic
The programmable logic section of the XCZU6CG-1FFVC900E provides extensive resources for custom hardware acceleration:
| Resource |
Specification |
| System Logic Cells |
469,446 |
| CLB Flip-Flops |
429K |
| CLB LUTs |
214K |
| Distributed RAM |
5.3 Mb |
| Block RAM |
11.0 Mb |
| DSP Slices |
1,728 |
| Clock Management Tiles |
8 |
XCZU6CG-1FFVC900E Technical Specifications
Package and Electrical Characteristics
| Parameter |
Value |
| Part Number |
XCZU6CG-1FFVC900E |
| Package Type |
900-FCBGA (31x31mm) |
| Ball Pitch |
1.0mm |
| Pin Count |
900 |
| Core Voltage |
0.85V |
| Speed Grade |
-1 (Standard) |
| Temperature Grade |
Extended (0°C to +100°C Tj) |
| Process Technology |
16nm FinFET |
| RoHS Status |
RoHS Compliant |
Memory Interface Support
The XCZU6CG-1FFVC900E supports a comprehensive range of external memory standards:
- DDR4, DDR3, DDR3L memory interfaces
- LPDDR4 and LPDDR3 low-power memory
- 256KB on-chip memory with ECC
- Quad-SPI flash interface
- NAND flash controller
- eMMC storage support
High-Speed Connectivity Options
| Interface |
Specification |
| PCIe |
Gen2 x4 |
| USB |
USB 3.0 and USB 2.0 |
| SATA |
SATA 3.1 |
| DisplayPort |
1.2a |
| Gigabit Ethernet |
SGMII, RGMII |
| PS-GTR Transceivers |
Up to 6.0 Gb/s |
XCZU6CG-1FFVC900E I/O Configuration
Input/Output Resources
The FFVC900 package provides flexible I/O options for diverse application requirements:
| I/O Type |
Description |
| Max HP I/O |
156 (High-Performance, 1.0V-1.8V) |
| Max HD I/O |
48 (High-Density, 1.2V-3.3V) |
| PS MIO Pins |
78 (Multiplexed I/O) |
| PS GPIO |
32-bit General Purpose I/O |
General Connectivity Interfaces
The processing system includes comprehensive peripheral connectivity:
- 2x UART serial interfaces
- 2x CAN 2.0B bus controllers
- 2x I²C interfaces
- 2x SPI interfaces
- 2x SD/SDIO controllers
- Real-Time Clock (RTC)
- Watchdog Timers
- Triple Timer Counters
XCZU6CG-1FFVC900E Target Applications
Industrial Motor Control and Automation
The XCZU6CG-1FFVC900E CG-series devices are specifically optimized for industrial motor control applications. The combination of real-time ARM Cortex-R5F processors with high-speed programmable logic enables precise servo control, multi-axis motion control, and advanced power electronics management.
Sensor Fusion and IoT Edge Computing
With its powerful dual-core application processors and flexible programmable logic, the XCZU6CG-1FFVC900E excels at multi-sensor data processing and edge computing applications. The device can simultaneously process data from multiple sensor types while running sophisticated fusion algorithms.
Embedded Vision and Image Processing
The extensive DSP slice count (1,728 slices) and high block RAM capacity make this device ideal for real-time image processing, machine vision inspection systems, and video analytics applications.
Communications Infrastructure
High-speed connectivity options including PCIe Gen2, USB 3.0, and Gigabit Ethernet make the XCZU6CG-1FFVC900E suitable for network processing, base station applications, and industrial communications gateways.
Medical Device and Instrumentation
The device’s combination of real-time processing capabilities, programmable logic flexibility, and extensive I/O options makes it well-suited for medical instrumentation, diagnostic equipment, and patient monitoring systems.
XCZU6CG-1FFVC900E Development Tools and Software
Vivado Design Suite
AMD provides the Vivado Design Suite for FPGA development, offering comprehensive tools for design entry, synthesis, implementation, and debugging. The suite includes IP Integrator for system-level design and advanced timing analysis tools.
Vitis Unified Software Platform
For software development on the ARM processors, the Vitis Unified Software Platform provides embedded development tools, acceleration libraries, and debugging capabilities. The platform supports both bare-metal and Linux-based application development.
PetaLinux Tools
PetaLinux enables customized embedded Linux development for Zynq UltraScale+ devices, including BSP generation, kernel configuration, and rootfs customization.
XCZU6CG-1FFVC900E Part Number Breakdown
Understanding the part number nomenclature helps identify device specifications:
| Segment |
Value |
Meaning |
| XC |
– |
Xilinx Commercial |
| ZU6 |
6 |
Device Index (ZU6 family) |
| CG |
CG |
Dual APU, Dual RPU (no GPU) |
| -1 |
-1 |
Speed Grade (Standard) |
| FF |
FF |
Flip-chip, 1.0mm ball pitch |
| V |
V |
RoHS 6/6 Compliant |
| C900 |
900 |
Package Pin Count |
| E |
E |
Extended Temperature Grade |
Why Choose the AMD XCZU6CG-1FFVC900E?
The XCZU6CG-1FFVC900E offers a compelling combination of features for demanding embedded applications:
- Heterogeneous Processing: The integration of application processors, real-time processors, and programmable logic on a single chip enables hardware/software co-design for optimal system performance.
- Power Efficiency: Built on 16nm FinFET technology with 0.85V core voltage, the device delivers excellent performance per watt for power-constrained applications.
- Scalability: The Zynq UltraScale+ family provides footprint-compatible migration paths, allowing designs to scale from cost-optimized to performance-optimized devices.
- Long-Term Availability: AMD extends support for UltraScale+ FPGAs and adaptive SoCs through 2045, ensuring long product lifecycles for industrial applications.
- Comprehensive Ecosystem: Extensive development tools, IP libraries, and third-party support accelerate time-to-market for complex embedded systems.
Related Products and Resources
For additional Xilinx FPGA products and comprehensive technical resources, explore our complete product catalog featuring the full range of Zynq UltraScale+ MPSoC devices and development solutions.
XCZU6CG-1FFVC900E Ordering Information
| Part Number |
Description |
| XCZU6CG-1FFVC900E |
Zynq UltraScale+ MPSoC CG, -1 Speed, FFVC900, Extended Temp |
| XCZU6CG-1FFVC900I |
Zynq UltraScale+ MPSoC CG, -1 Speed, FFVC900, Industrial Temp |
| XCZU6CG-2FFVC900I |
Zynq UltraScale+ MPSoC CG, -2 Speed, FFVC900, Industrial Temp |
The AMD XCZU6CG-1FFVC900E represents the cutting edge of embedded processing technology, combining the flexibility of programmable logic with the performance of advanced ARM processors. Contact authorized distributors for current pricing, availability, and technical support.
