The AMD XCZU6CG-1FFVB1156E is a high-performance System on Chip (SoC) from the Zynq UltraScale+ MPSoC family. This advanced embedded processor combines a powerful dual-core ARM Cortex-A53 application processor with programmable logic in a single device. Engineers designing next-generation embedded systems will find this component ideal for industrial automation, wireless communications, and automotive applications.
Key Features of the XCZU6CG-1FFVB1156E
The XCZU6CG-1FFVB1156E delivers exceptional processing power and flexibility. This CG-series device integrates heterogeneous processing capabilities that enable both real-time control and high-performance computing in one package.
Processing System Specifications
| Parameter |
Specification |
| Application Processing Unit (APU) |
Dual-core ARM Cortex-A53 MPCore with CoreSight |
| APU Frequency |
Up to 1.2 GHz |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5 with CoreSight |
| RPU Frequency |
Up to 500 MHz |
| L1 Cache (per core) |
32KB Instruction / 32KB Data |
| L2 Cache (shared) |
1MB with ECC |
| On-Chip Memory |
256KB OCM with ECC |
Programmable Logic Resources
| Resource |
Quantity |
| System Logic Cells |
469,446 |
| CLB Flip-Flops |
429,208 |
| CLB LUTs |
214,604 |
| Distributed RAM |
6.9 Mb |
| Block RAM Blocks |
714 |
| Block RAM |
25.1 Mb |
| DSP Slices |
1,973 |
| Clock Management Tiles (CMT) |
4 |
Package and Electrical Specifications
The XCZU6CG-1FFVB1156E comes in a 1156-FCBGA package with a 35mm x 35mm footprint. This flip-chip BGA package uses 1.0mm ball pitch, making it compatible with standard PCB manufacturing processes.
I/O Configuration
| I/O Type |
Maximum Pins |
| High-Performance (HP) I/O |
208 |
| High-Density (HD) I/O |
120 |
| GTH Transceivers (16.3 Gb/s) |
24 |
| PS-GTR Transceivers |
4 |
| PS I/O |
214 |
Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-1 (Standard) |
| Temperature Grade |
E (Extended: 0°C to +100°C) |
| Operating Voltage Range (HP I/O) |
1.0V to 1.8V |
| Operating Voltage Range (HD I/O) |
1.2V to 3.3V |
Connectivity and Interface Options
The XCZU6CG-1FFVB1156E provides comprehensive connectivity options for modern embedded designs. The integrated PS-GTR transceivers support multiple high-speed protocols.
High-Speed Interfaces
- PCIe: Gen1/Gen2 support with x1, x2, or x4 lane configurations
- USB 3.0: Up to 5.0 Gb/s data rate with host, device, and OTG modes
- SATA 3.1: Support for 1.5, 3.0, and 6.0 Gb/s data rates
- DisplayPort 1.2a: Up to 5.4 Gb/s with dual TX lanes
- Gigabit Ethernet: Four 10/100/1000 tri-speed Ethernet MAC with IEEE 1588 support
- SGMII: Up to 4 channels at 1.25 Gb/s
Peripheral Interfaces
- 2x USB 2.0/3.0 controllers
- 2x SD/SDIO 3.0/eMMC 4.51 controllers
- 2x Full CAN 2.0B interfaces
- 2x SPI ports
- 2x I2C interfaces
- 2x UART (up to 1 Mb/s)
- Up to 78 MIO pins
Memory Interface Support
The integrated DDR controller supports multiple memory standards for flexible system design.
| Memory Type |
Bus Width |
Data Rate |
| DDR4 |
32/64-bit |
Up to 2400 Mb/s |
| DDR3/DDR3L |
32/64-bit |
Supported |
| LPDDR4 |
32-bit |
Supported |
| LPDDR3 |
32/64-bit |
Supported |
External memory capacity supports up to 32GB with ECC protection in both 64-bit and 32-bit modes.
Target Applications
The AMD XCZU6CG-1FFVB1156E excels in demanding embedded applications:
- Industrial Automation: Motor control, machine vision, and factory automation
- Wireless Communications: 5G infrastructure and software-defined radio
- Automotive Systems: ADAS, driver information, and infotainment
- Medical Equipment: Imaging systems and diagnostic equipment
- Aerospace and Defense: Radar processing and communications
- Data Center: Network acceleration and storage controllers
Part Number Breakdown
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU6 |
Zynq UltraScale+ Device Size |
| CG |
CG Series (Dual APU, Dual RPU) |
| -1 |
Speed Grade (Standard) |
| FFV |
Flip-chip Fine-pitch BGA |
| B1156 |
1156-pin Package |
| E |
Extended Temperature Grade |
Why Choose the XCZU6CG-1FFVB1156E?
This Zynq UltraScale+ MPSoC delivers the optimal balance of processing power, programmable logic resources, and power efficiency. The 16nm FinFET+ process technology ensures excellent performance per watt, while the extensive I/O options provide design flexibility.
For engineers seeking a versatile platform for embedded development, the XCZU6CG-1FFVB1156E offers comprehensive software support through AMD Vivado Design Suite, Vitis Unified Software Platform, and PetaLinux. This ecosystem enables rapid development from concept to production.
Explore our complete selection of Xilinx FPGA components for your embedded design projects.
Technical Documentation
For complete electrical specifications, timing parameters, and design guidelines, refer to the official AMD documentation:
- DS891: Zynq UltraScale+ MPSoC Data Sheet: Overview
- DS925: Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
- UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual
Related Part Numbers:
- XCZU6CG-1FFVB1156I (Industrial Temperature)
- XCZU6CG-2FFVB1156E (Higher Speed Grade)
- XCZU6EG-1FFVB1156E (EG Series with GPU)
- XCZU9CG-1FFVB1156E (Higher Logic Capacity)
