The AMD XCZU5EV-2FBVB900E is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC EV family, combining powerful ARM processors with advanced FPGA programmable logic. This versatile device delivers exceptional performance for demanding applications in video processing, automotive ADAS, industrial IoT, 5G wireless, and embedded vision systems.
Key Features of the XCZU5EV-2FBVB900E MPSoC
The XCZU5EV-2FBVB900E integrates multiple processing engines on a single chip, providing unmatched flexibility and computational power for next-generation embedded designs.
Processing System Architecture
| Component |
Specification |
| Application Processing Unit (APU) |
Quad-core ARM Cortex-A53 MPCore with CoreSight, up to 1.3GHz |
| Real-Time Processing Unit (RPU) |
Dual-core ARM Cortex-R5 with CoreSight, up to 600MHz |
| Graphics Processing Unit (GPU) |
ARM Mali-400 MP2, up to 667MHz |
| Video Codec Unit (VCU) |
H.264/H.265, 4K @ 60fps encode/decode |
| On-Chip Memory |
256KB |
Programmable Logic Resources
| Resource |
Quantity |
| System Logic Cells |
256K (256,200) |
| CLB Flip-Flops |
234K |
| Look-Up Tables (LUTs) |
117K |
| Block RAM |
5.1 Mb |
| UltraRAM |
18.0 Mb |
| DSP48E2 Slices |
1,248 |
XCZU5EV-2FBVB900E Technical Specifications
Package and Electrical Characteristics
| Parameter |
Value |
| Part Number |
XCZU5EV-2FBVB900E |
| Manufacturer |
AMD (formerly Xilinx) |
| Series |
Zynq UltraScale+ MPSoC EV |
| Package Type |
900-FCBGA (31mm x 31mm) |
| Ball Pitch |
0.8mm |
| Speed Grade |
-2 (Standard) |
| Temperature Grade |
Commercial (0°C to +100°C) |
| Process Technology |
16nm FinFET+ |
| RoHS Status |
Compliant |
High-Speed Connectivity and I/O
| Interface |
Specification |
| PS-GTR Transceivers |
4x up to 6 Gbps |
| PL GTH Transceivers |
4x up to 12.5 Gbps |
| PCIe Support |
Gen2 x4 (PS), Gen3 x4 (PL) |
| USB Interface |
USB 3.0, USB 2.0 |
| Ethernet |
10/100/1000 Mbps |
| Display Interface |
DisplayPort 1.2a |
| SATA |
SATA 3.1 |
Zynq UltraScale+ MPSoC EV Benefits and Applications
Why Choose the XCZU5EV-2FBVB900E?
The XCZU5EV-2FBVB900E stands out in the embedded processing market due to its unique combination of heterogeneous processing capabilities. The integrated H.264/H.265 video codec enables real-time 4K video encoding and decoding, making this device ideal for multimedia and video processing applications without requiring external codec chips.
Target Applications
The XCZU5EV-2FBVB900E excels in numerous demanding applications:
- Automotive ADAS Systems – Advanced driver assistance with real-time video processing
- Embedded Vision – Machine vision, surveillance, and smart camera systems
- 5G Wireless Infrastructure – Base stations and network equipment
- Industrial IoT – Edge computing and real-time control systems
- Medical Imaging – Diagnostic equipment and imaging devices
- Aerospace and Defense – Radar systems and secure communications
- Broadcast and Pro Audio/Video – Live video production and streaming
Memory and External Interface Support
Dynamic Memory Controller
The XCZU5EV-2FBVB900E supports multiple memory standards for maximum design flexibility:
| Memory Type |
Support |
| DDR4 |
x32/x64 with ECC |
| LPDDR4 |
x32/x64 |
| DDR3/DDR3L |
x32/x64 with ECC |
| LPDDR3 |
Supported |
Peripheral Connectivity
| Peripheral |
Channels/Ports |
| UART |
2 |
| CAN |
2 |
| I2C |
2 |
| SPI |
2 |
| GPIO |
78 MIO pins |
| SD/SDIO/eMMC |
2 controllers |
| QSPI |
Quad-SPI Flash support |
Development Tools and Software Support
Vivado Design Suite Compatibility
The XCZU5EV-2FBVB900E is fully supported by AMD’s comprehensive development ecosystem:
- Vivado ML Standard Edition – Free WebPACK license available
- Vivado ML Enterprise Edition – Full feature support
- Vitis Unified Software Platform – Embedded software development
- PetaLinux Tools – Custom Linux deployment
AI and Machine Learning Acceleration
The device supports the Vitis AI platform for deploying deep learning inference, leveraging the DSP slices and programmable logic for efficient neural network acceleration. This makes the XCZU5EV-2FBVB900E suitable for AI-at-the-edge applications.
Power Management Features
Advanced Power Architecture
The XCZU5EV-2FBVB900E includes sophisticated power management capabilities:
- Deep Sleep Mode – As low as 180 nW power consumption when idle
- Dynamic Power Scaling – Up to 30% reduction in static power
- Power Domain Isolation – Independent power control for PS and PL
- Thermal Management – Integrated temperature monitoring
Ordering Information
| Attribute |
Detail |
| Manufacturer Part Number |
XCZU5EV-2FBVB900E |
| Product Status |
Active |
| Packaging |
Tray |
| Minimum Order Quantity |
Contact distributor |
| Lead Time |
Typically 20-25 weeks |
Related Products and Alternatives
For engineers seeking similar performance levels or exploring the Zynq UltraScale+ family, consider these related devices:
- XCZU4EV-2FBVB900E – Lower logic density option
- XCZU7EV-2FBVB900E – Higher logic density option
- XCZU5EV-2FBVB900I – Industrial temperature grade variant
For more information on the complete range of AMD programmable logic devices, visit our comprehensive Xilinx FPGA product catalog featuring the latest UltraScale+ and Versal families.
Conclusion
The AMD XCZU5EV-2FBVB900E represents the state-of-the-art in heterogeneous computing, combining powerful ARM processors, advanced programmable logic, and integrated video processing in a single 16nm FinFET+ device. Whether you’re developing next-generation ADAS systems, deploying AI at the edge, or building high-performance embedded systems, this Zynq UltraScale+ MPSoC EV device provides the processing power, flexibility, and connectivity required for success.
