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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5EG-L2SFVC784E: Zynq UltraScale+ MPSoC EG Device

Product Details

The AMD XCZU5EG-L2SFVC784E is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC EG family. This advanced embedded processor combines a powerful quad-core ARM Cortex-A53 application processor with 16nm FinFET+ programmable logic, delivering exceptional performance for demanding industrial, automotive, and embedded vision applications.

Key Features of the XCZU5EG-L2SFVC784E

The XCZU5EG-L2SFVC784E offers an impressive combination of processing power and programmable flexibility. Engineers and system designers choose this device for applications requiring real-time control, advanced signal processing, and heterogeneous computing capabilities.

Processing System Specifications

Parameter Specification
Application Processor Quad-core ARM Cortex-A53 up to 1.5 GHz
Real-Time Processor Dual-core ARM Cortex-R5F up to 600 MHz
Graphics Processor ARM Mali-400 MP2 up to 667 MHz
Package Type 784-FCBGA (23x23mm)
Speed Grade -2L Extended (Low Power)
Temperature Range Extended (0°C to +100°C)
Core Voltage 0.85V / 0.72V

Programmable Logic Resources

Resource Value
System Logic Cells 256K+
DSP Slices 1,248
Total Block RAM 26.6 Mb
Maximum I/O Pins 252
GTH Transceivers (16.3 Gb/s) 16
PCIe Support 2x Gen3x8 or 1x Gen3x16

Why Choose the XCZU5EG-L2SFVC784E for Your Design?

Heterogeneous Processing Architecture

The XCZU5EG-L2SFVC784E integrates multiple processing domains within a single chip. The quad-core ARM Cortex-A53 handles complex application workloads, while the dual-core ARM Cortex-R5F manages real-time deterministic tasks. The ARM Mali-400 MP2 GPU enables 2D/3D graphics acceleration, making this device ideal for embedded vision and multimedia applications.

Advanced Programmable Logic

With over 256,000 logic cells and 1,248 DSP slices, the XCZU5EG provides substantial programmable logic resources. The DSP slices feature 27×18 multipliers with 48-bit accumulators, enabling high-performance digital signal processing for applications such as software-defined radio, radar systems, and machine learning inference.

High-Speed Connectivity Options

The device includes 16 GTH transceivers supporting data rates up to 16.3 Gb/s. Built-in PCIe Gen3 support (configurable as 2x Gen3x8 or 1x Gen3x16) enables seamless integration with host systems. Additional peripherals include USB 3.0, SATA 3.1, DisplayPort, and Gigabit Ethernet interfaces.

Memory Flexibility

The XCZU5EG-L2SFVC784E supports multiple memory standards including DDR4, LPDDR4, DDR3, DDR3L, and LPDDR3. The adaptable memory hierarchy with distributed on-chip memory (LUTRAM, Block RAM, UltraRAM) minimizes access latency and enables maximum accelerator performance.

Target Applications

The XCZU5EG-L2SFVC784E is optimized for demanding embedded applications across multiple industries:

  • 5G Wireless Infrastructure – Baseband processing and beamforming
  • Advanced Driver Assistance Systems (ADAS) – Sensor fusion and object detection
  • Industrial IoT – Edge computing and real-time control systems
  • Medical Imaging – Ultrasound and diagnostic equipment
  • Aerospace and Defense – Radar and electronic warfare systems
  • Video Surveillance – Multi-channel video analytics
  • Test and Measurement – High-speed data acquisition

Package and Ordering Information

Attribute Value
Manufacturer Part Number XCZU5EG-L2SFVC784E
Manufacturer AMD (formerly Xilinx)
Package 784-FCBGA (Flip Chip Ball Grid Array)
Package Dimensions 23mm x 23mm
Mounting Type Surface Mount
RoHS Status Compliant
Moisture Sensitivity Level MSL-3

Development Tools and Software Support

AMD provides comprehensive development tools for the XCZU5EG-L2SFVC784E:

  • Vivado Design Suite – FPGA development and implementation
  • Vitis Unified Software Platform – Application development and acceleration
  • Vitis AI – Deep learning inference optimization
  • PetaLinux – Embedded Linux development

Related Evaluation Kits

Engineers can evaluate the Zynq UltraScale+ MPSoC platform using official development kits such as the ZCU102 and ZCU104 evaluation boards. These kits provide access to all device features and include reference designs for rapid prototyping.

Where to Buy AMD Zynq UltraScale+ MPSoC Devices

Looking for reliable sourcing for your Xilinx FPGA and Zynq UltraScale+ components? Authorized distributors offer competitive pricing, technical support, and guaranteed authentic components for your production requirements.

Technical Documentation

For detailed specifications, consult the following AMD resources:

  • Zynq UltraScale+ MPSoC Data Sheet: Overview (DS891)
  • Zynq UltraScale+ MPSoC Technical Reference Manual (UG1085)
  • Zynq UltraScale+ MPSoC Packaging and Pinouts (UG1075)
  • UltraScale Architecture DSP48E2 Slice User Guide (UG579)

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.