Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5EG-L2FBVB900E: Zynq UltraScale+ MPSoC FPGA for High-Performance Embedded Applications

Product Details

The AMD XCZU5EG-L2FBVB900E is a powerful System on Chip (SoC) from the Zynq UltraScale+ MPSoC family, combining a quad-core ARM Cortex-A53 processor with advanced programmable logic. This device delivers exceptional performance for demanding embedded applications including industrial automation, automotive systems, and edge computing solutions. If you’re looking for a versatile Xilinx FPGA, the XCZU5EG-L2FBVB900E offers an ideal balance of processing power and programmable flexibility.

Key Features of the AMD XCZU5EG-L2FBVB900E

The XCZU5EG-L2FBVB900E integrates heterogeneous processing capabilities with cutting-edge FPGA fabric. This architecture enables hardware acceleration alongside traditional software execution, making it suitable for complex signal processing, machine learning inference, and real-time control applications.

Processing System Specifications

The processing system (PS) of this Zynq UltraScale+ MPSoC includes multiple processor cores designed for different workloads:

Component Specification
Application Processor Quad ARM Cortex-A53 MPCore with CoreSight
Real-Time Processor Dual ARM Cortex-R5 with CoreSight
Graphics Processing Unit ARM Mali-400 MP2
Maximum APU Frequency 1.2 GHz
Maximum RPU Frequency 600 MHz
On-Chip Memory 256 KB

Programmable Logic Resources

The programmable logic (PL) section provides substantial resources for custom hardware implementations:

Resource Quantity
Logic Cells 256K+
CLB Flip-Flops 117,120
CLB LUTs 58,560
DSP Slices 1,248
Block RAM 144 (36Kb each)
UltraRAM 64 blocks
GTH Transceivers 16 (up to 12.5 Gb/s)

Technical Specifications and Package Details

Understanding the complete technical profile of the XCZU5EG-L2FBVB900E helps engineers make informed design decisions.

Package Information

Parameter Value
Part Number XCZU5EG-L2FBVB900E
Package Type 900-FCBGA (31×31 mm)
Package Code FBVB900
Pin Count 900 pins
Ball Pitch 0.8 mm
Mounting Type Surface Mount

Operating Characteristics

Parameter Value
Speed Grade -2LE (Low Power Extended)
Core Voltage (VCCINT) 0.85V or 0.72V
Temperature Range Extended (0°C to 100°C TJ)
Process Technology 16nm FinFET+
Packaging Tray

Connectivity and Interface Options

The XCZU5EG-L2FBVB900E provides comprehensive connectivity options for modern embedded systems.

Integrated Interfaces

Interface Type Details
Ethernet Gigabit Ethernet MAC
USB USB 3.0 and USB 2.0 OTG
PCIe Gen2 x4 or Gen3 x2
SATA SATA 3.1 support
Display DisplayPort 1.2a
Memory DDR4/DDR3/DDR3L/LPDDR3/LPDDR4
Serial UART/USART, SPI, I²C
Automotive CAN bus support
Storage MMC/SD/SDIO

High-Speed Serial Transceivers

The device includes 16 GTH transceivers capable of supporting line rates from 500 Mb/s to 12.5 Gb/s, enabling high-bandwidth applications such as 10G Ethernet, PCIe Gen3, and custom serial protocols.

XCZU5EG-L2FBVB900E Applications

This Zynq UltraScale+ MPSoC is designed for applications requiring both processing power and hardware acceleration:

Industrial Applications

  • Motor control and industrial automation
  • Machine vision and image processing
  • Programmable logic controllers (PLCs)
  • Industrial Internet of Things (IIoT) gateways

Automotive Systems

  • Advanced driver assistance systems (ADAS)
  • Infotainment systems
  • In-vehicle networking
  • Sensor fusion platforms

Communications and Networking

  • Software-defined radio (SDR)
  • 5G wireless infrastructure
  • Network packet processing
  • Protocol bridging and conversion

Edge Computing and AI

  • Machine learning inference at the edge
  • Real-time video analytics
  • Embedded vision systems
  • Data preprocessing and aggregation

Development Tools and Software Support

AMD provides comprehensive development support for the XCZU5EG-L2FBVB900E through the Vivado Design Suite. This integrated development environment includes synthesis, implementation, and debugging tools specifically optimized for UltraScale+ devices.

Software Development

Tool Purpose
Vivado Design Suite FPGA design, synthesis, and implementation
Vitis Unified Platform Application and accelerator development
PetaLinux Embedded Linux development
Vivado HLS High-level synthesis for C/C++

Part Number Breakdown

Understanding the AMD part numbering convention helps identify specific device configurations:

Segment Value Meaning
XC Xilinx Commercial
ZU5 Zynq UltraScale+ 5 series
EG EG variant (with GPU)
L2 -2LE speed grade (low power)
FBV Fine-pitch BGA
B900 900-ball package
E Extended temperature range

Ordering Information

Parameter Details
Manufacturer AMD (formerly Xilinx)
Part Number XCZU5EG-L2FBVB900E
Product Family Zynq UltraScale+ MPSoC
Sub-Family EG (with GPU)
Product Status Active
RoHS Status Compliant
Lead-Free Yes

Why Choose the AMD XCZU5EG-L2FBVB900E

The XCZU5EG-L2FBVB900E stands out among programmable SoC devices for several reasons:

Power Efficiency

The -2LE speed grade option allows operation at reduced VCCINT voltage (0.72V), significantly lowering static power consumption while maintaining excellent performance characteristics.

Heterogeneous Computing

The combination of ARM application processors, real-time processors, GPU, and programmable logic enables optimal task distribution across different compute domains.

Scalability

The Zynq UltraScale+ family shares common architecture and tools, allowing designs to scale up or down based on project requirements.

Long-Term Availability

AMD provides extended product lifecycle support for industrial and embedded applications, ensuring long-term supply for production programs.

Related Products in the Zynq UltraScale+ Family

Part Number Logic Cells GPU Key Difference
XCZU3EG 154K Yes Lower density
XCZU5EG 256K Yes Mid-range option
XCZU7EG 504K Yes Higher density
XCZU5CG 256K No Without GPU
XCZU5EV 256K Yes With video codec

Conclusion

The AMD XCZU5EG-L2FBVB900E represents an excellent choice for engineers developing high-performance embedded systems that require both software flexibility and hardware acceleration. With its quad-core ARM Cortex-A53 processor, extensive programmable logic resources, and comprehensive connectivity options, this Zynq UltraScale+ MPSoC delivers the capabilities needed for next-generation industrial, automotive, and edge computing applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.