Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5EG-L1SFVC784I | Zynq UltraScale+ MPSoC FPGA Processor

Product Details

The AMD XCZU5EG-L1SFVC784I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC EG family. This industrial-grade programmable SoC integrates a quad-core ARM Cortex-A53 processor, dual-core ARM Cortex-R5F real-time processor, Mali-400 MP2 GPU, and 256K logic cells in a compact 784-ball FCBGA package. Designed for demanding embedded applications, this device delivers exceptional processing power with optimized power efficiency for industrial automation, automotive systems, aerospace, medical imaging, and advanced driver assistance systems (ADAS).


XCZU5EG-L1SFVC784I Key Specifications

Parameter Specification
Manufacturer AMD (Xilinx)
Part Number XCZU5EG-L1SFVC784I
Device Family Zynq UltraScale+ MPSoC EG
Process Technology 16nm FinFET+
System Logic Cells 256,200 (256K)
Package Type 784-Ball FCBGA
Package Dimensions 23mm x 23mm
Ball Pitch 0.8mm
Speed Grade -1 (Low Power)
Temperature Grade Industrial (-40°C to +100°C)
Core Voltage (VCCINT) 0.85V
Lifecycle Status Production

AMD Zynq UltraScale+ Processing System Architecture

The XCZU5EG-L1SFVC784I features a heterogeneous multiprocessing architecture that combines multiple processing engines for maximum application flexibility and performance optimization.

Application Processing Unit (APU)

Feature Specification
Processor Core Quad-core ARM Cortex-A53 MPCore with CoreSight
Maximum Frequency Up to 1.5 GHz
Architecture 64-bit ARMv8-A
L1 Cache 32KB Instruction / 32KB Data per core
L2 Cache 1MB Shared
Floating Point Single/Double Precision NEON SIMD

Real-Time Processing Unit (RPU)

Feature Specification
Processor Core Dual-core ARM Cortex-R5F with CoreSight
Maximum Frequency Up to 600 MHz
L1 Cache 32KB Instruction / 32KB Data per core
TCM Memory 128KB per core
Features Single/Double Precision Floating Point, Lock-step Mode

Graphics Processing Unit (GPU)

Feature Specification
GPU Core ARM Mali-400 MP2
Maximum Frequency Up to 667 MHz
L2 Cache 64KB
API Support OpenGL ES 1.1/2.0, OpenVG 1.1

Zynq UltraScale+ FPGA Programmable Logic Resources

The programmable logic (PL) section of the XCZU5EG provides extensive configurable resources for hardware acceleration and custom logic implementation.

Logic and Memory Resources

Resource Quantity
System Logic Cells 256,200
CLB Flip-Flops 234,240
CLB Look-Up Tables (LUTs) 117,120
Total Block RAM 16.9 Mb
UltraRAM 4.5 Mb
Maximum Distributed RAM 5.1 Mb
Total On-Chip Memory 26.6 Mb

DSP and Signal Processing

Feature Specification
DSP48E2 Slices 1,248
Peak DSP Performance 1,123 GMAC/s (INT8)
Applications Digital Signal Processing, AI/ML Inference, Video Processing

High-Speed Connectivity and I/O Interfaces

GTH Transceivers and Serial Connectivity

Interface Specification
GTH Transceivers 16 channels
Maximum Data Rate 12.5 Gb/s per channel
PCIe Support 2x Gen3 x8 or 1x Gen3 x16
Total Bandwidth 200 Gb/s aggregate

Processing System High-Speed Peripherals

Interface Specification
PS-GTR Transceivers 4 channels
USB USB 3.0 and USB 2.0
PCIe Gen1/Gen2
SATA SATA 3.1
DisplayPort DisplayPort 1.2a
Ethernet SGMII, Tri-mode Gigabit

General Purpose I/O

I/O Type Maximum Pins
High-Performance (HP) I/O 156
High-Density (HD) I/O 96
Total Maximum I/O 252
HP I/O Voltage Range 1.0V to 1.8V
HD I/O Voltage Range 1.2V to 3.3V
PS I/O Pins 214

XCZU5EG Memory Interface Support

External Memory Controllers

Memory Type Support
DDR4 Up to 2400 MT/s
DDR3/DDR3L Supported
LPDDR4 Supported
LPDDR3 Supported
Data Width Up to 64-bit with ECC

On-Chip Memory

Memory Size
On-Chip Memory (OCM) 256KB with ECC
Boot ROM 128KB
Battery-Backed RAM 256 bytes

Part Number Breakdown: XCZU5EG-L1SFVC784I

Understanding the AMD Xilinx part numbering convention helps identify exact device specifications:

Code Meaning
XC Xilinx Component
ZU5 Zynq UltraScale+ Size 5
EG Embedded Graphics (Quad A53 + Mali GPU)
L1 Low Power, Speed Grade -1
SF Package Type (FCBGA, 0.8mm pitch)
VC Lead-free
784 784 Ball Count
I Industrial Temperature (-40°C to +100°C)

Industrial Temperature Grade Benefits

The XCZU5EG-L1SFVC784I industrial-grade device is designed for demanding operating environments:

  • Extended Temperature Range: -40°C to +100°C junction temperature
  • Enhanced Reliability: Rigorous testing and characterization
  • Long Product Lifecycle: Extended availability through 2045
  • Harsh Environment Operation: Suitable for outdoor, automotive, and industrial applications
  • Quality Assurance: 100% tested at temperature extremes

Zynq UltraScale+ MPSoC EG Applications

The XCZU5EG-L1SFVC784I is ideal for applications requiring heterogeneous processing capabilities:

Industrial Automation

  • Programmable Logic Controllers (PLC)
  • Industrial IoT gateways
  • Machine vision systems
  • Robotics control

Automotive Systems

  • Advanced Driver Assistance Systems (ADAS)
  • Infotainment systems
  • Sensor fusion platforms
  • Vehicle networking

Aerospace and Defense

  • Software-defined radio (SDR)
  • Radar signal processing
  • Secure communications
  • Avionics systems

Medical and Healthcare

  • Medical imaging equipment
  • Portable diagnostic devices
  • Patient monitoring systems
  • Surgical robotics

Communications

  • 5G wireless infrastructure
  • Network acceleration
  • Protocol conversion
  • Edge computing nodes

Design and Development Tools

Software Development Environment

Tool Purpose
Vivado Design Suite FPGA synthesis, implementation, and programming
Vitis Unified Software Platform Application development and acceleration
Vitis AI Deep learning inference optimization
PetaLinux Embedded Linux development

Available Development Kits

  • ZCU102 Evaluation Kit
  • ZCU104 Evaluation Kit
  • ZCU106 Evaluation Kit
  • Third-party SoMs and carrier boards

Power Management Features

The XCZU5EG-L1SFVC784I offers advanced power management capabilities:

Feature Benefit
Multiple Power Domains Independent PS and PL power control
Deep Sleep Mode As low as 180 nW standby power
Dynamic Power Management Up to 30% static power reduction
Low-Power Speed Grade Optimized for power-sensitive applications
Voltage Scaling 0.85V core voltage operation

Security Features

Security Feature Description
Secure Boot RSA-4096 authentication
AES-256 Encryption Bitstream and data encryption
Anti-Tamper Physical attack detection
TrustZone Technology ARM hardware security
Device DNA Unique device identifier

Ordering Information

Part Number Description
XCZU5EG-L1SFVC784I Industrial temp, -1 low power speed grade
XCZU5EG-1SFVC784I Industrial temp, -1 speed grade
XCZU5EG-2SFVC784I Industrial temp, -2 speed grade
XCZU5EG-1SFVC784E Extended temp, -1 speed grade

Related Zynq UltraScale+ MPSoC Devices

Device Logic Cells Key Difference
XCZU3EG 154K Smaller logic capacity
XCZU5EG 256K Standard EG device
XCZU7EG 504K Higher logic capacity
XCZU9EG 600K Maximum EG capacity
XCZU5CG 256K Dual-core A53, no GPU
XCZU5EV 256K Includes H.264/H.265 video codec

Why Choose AMD XCZU5EG-L1SFVC784I?

The XCZU5EG-L1SFVC784I delivers an optimal balance of processing performance, programmable logic resources, and power efficiency for mid-range embedded applications. Key advantages include:

  1. Heterogeneous Processing: Combine ARM processors with FPGA fabric for optimized workload distribution
  2. Industrial Reliability: Qualified for -40°C to +100°C operation
  3. Integrated GPU: Mali-400 MP2 for graphics-intensive applications
  4. Extensive Connectivity: 16 GTH transceivers and comprehensive peripheral support
  5. Power Optimized: Low-power speed grade for battery and thermally constrained designs
  6. Long-Term Availability: Support extended through 2045

Technical Documentation and Resources

For complete technical specifications, design guidelines, and application notes, refer to:

  • DS891: Zynq UltraScale+ MPSoC Data Sheet: Overview
  • DS925: Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
  • UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual
  • UG1075: Zynq UltraScale+ MPSoC Packaging and Pinouts

Purchase XCZU5EG-L1SFVC784I

Looking for AMD Xilinx Zynq UltraScale+ MPSoC devices? Browse our complete selection of Xilinx FPGA products for competitive pricing, technical support, and fast delivery on XCZU5EG and other Zynq UltraScale+ family devices.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.