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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5EG-L1FBVB900I: High-Performance Zynq UltraScale+ MPSoC for Industrial Applications

Product Details

The AMD XCZU5EG-L1FBVB900I is a powerful Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) that combines a quad-core ARM Cortex-A53 processor with advanced programmable logic, delivering exceptional performance for industrial, aerospace, and communications applications. This industrial-grade SoC offers 256K+ logic cells, low-power operation, and extensive connectivity options in a compact 900-FCBGA package.


Key Features of AMD XCZU5EG-L1FBVB900I

The XCZU5EG-L1FBVB900I belongs to the Zynq UltraScale+ MPSoC EG family, designed for applications requiring high processing power combined with FPGA flexibility. Built on advanced 16nm FinFET+ technology, this device delivers superior performance-per-watt efficiency.

Processing Subsystem Specifications

Parameter Specification
Application Processor Quad-core ARM Cortex-A53 MPCore with CoreSight (up to 1.2GHz)
Real-Time Processor Dual-core ARM Cortex-R5 with CoreSight (up to 600MHz)
Graphics Processing Unit ARM Mali-400 MP2
On-Chip Memory 256KB RAM
Speed Grades 500MHz, 600MHz, 1.2GHz

Programmable Logic Resources

Resource Value
Logic Cells 256K+
DSP Slices 1,248
Block RAM 7.6Mb
UltraRAM 3Mb

Technical Specifications

Package and Electrical Characteristics

Specification Details
Part Number XCZU5EG-L1FBVB900I
Package Type 900-FCBGA (31mm x 31mm)
Core Voltage (VCCINT) 0.85V / 0.72V
Operating Temperature -40°C to +100°C (TJ)
Temperature Grade Industrial (I)
Speed Grade -1L (Low Power)
RoHS Compliance RoHS3 Compliant
ECCN 5A002.A.4

Comprehensive Connectivity Options

The AMD XCZU5EG-L1FBVB900I provides a rich set of integrated peripherals:

Interface Description
USB USB 2.0 and USB 3.0 OTG
Ethernet Gigabit Ethernet MAC with IEEE 1588
Serial UART, SPI, I²C
Memory MMC/SD/SDIO, DDR4 support
Automotive CAN bus interface
External Bus EBI/EMI for parallel interfaces

Applications for Zynq UltraScale+ XCZU5EG-L1FBVB900I

Industrial Automation and Control

The XCZU5EG-L1FBVB900I excels in industrial environments where real-time processing and deterministic performance are critical. The dual Cortex-R5 processors handle time-sensitive control loops while the Cortex-A53 cluster manages complex algorithms and networking.

Wired and Wireless Communications Infrastructure

For telecommunications applications, this MPSoC provides the processing power needed for baseband processing, protocol handling, and packet inspection with hardware acceleration through programmable logic.

Aerospace and Defense Systems

The industrial temperature range (-40°C to +100°C) and high reliability make the XCZU5EG-L1FBVB900I suitable for rugged aerospace and defense applications requiring long-term availability and environmental resilience.

Edge Computing and AI Inference

With extensive DSP resources and programmable logic, this SoC enables efficient neural network inference at the edge, combining software flexibility with hardware acceleration.


Development Tools and Software Support

Vivado Design Suite Integration

AMD provides comprehensive support through the Vivado Design Suite, offering:

  • Synthesis and implementation tools
  • IP Integrator for block-based design
  • Hardware debugging and analysis
  • Timing closure optimization

Vitis Unified Software Platform

The Vitis platform enables software developers to leverage:

  • Embedded software development for ARM cores
  • AI inference acceleration libraries
  • Hardware-aware application optimization
  • OpenCL and C/C++ based acceleration

Part Number Breakdown

Understanding the XCZU5EG-L1FBVB900I nomenclature:

Code Meaning
XC Commercial device
ZU5 Zynq UltraScale+ size 5
EG Quad-core A53 + GPU variant
L1 Low-power, speed grade 1
FBV Flip-chip BGA with lead-free bumps
B900 900-ball package
I Industrial temperature grade

Why Choose AMD XCZU5EG-L1FBVB900I?

Performance-Per-Watt Leadership

The L-variant (low-power) designation indicates optimized static power consumption, making this device ideal for thermally constrained applications while maintaining full -1 speed grade performance at 0.85V operation.

Heterogeneous Computing Architecture

By integrating application processors, real-time processors, GPU, and programmable logic on a single chip, the XCZU5EG-L1FBVB900I reduces system complexity, PCB footprint, and overall BOM cost.

Long-Term Availability

AMD’s commitment to product longevity ensures extended availability for industrial and defense programs requiring decade-long support.


Related Resources

For additional Xilinx FPGA products and technical resources, explore our comprehensive catalog of AMD programmable logic devices, development boards, and design services.


Ordering Information

Parameter Value
Manufacturer AMD (formerly Xilinx)
Part Number XCZU5EG-L1FBVB900I
Series Zynq® UltraScale+™ MPSoC EG
Packaging Tray
Product Status Active
Typical Lead Time 25 weeks

The AMD XCZU5EG-L1FBVB900I Zynq UltraScale+ MPSoC delivers the ideal combination of processing performance, programmable logic flexibility, and power efficiency for demanding industrial applications. Contact us today for pricing and availability.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.