The AMD XCZU5EG-3SFVC784E is a cutting-edge System on Chip (SoC) from the Zynq UltraScale+ MPSoC EG family, combining powerful ARM processors with advanced FPGA programmable logic. This device delivers exceptional performance for demanding embedded applications including industrial automation, video processing, machine learning, and high-speed communications.
Key Features of the XCZU5EG-3SFVC784E Zynq UltraScale+ MPSoC
The XCZU5EG-3SFVC784E integrates a feature-rich 64-bit processing system with UltraScale programmable logic architecture on a single chip. Built on 16nm FinFET+ technology, this device offers industry-leading performance-per-watt efficiency for next-generation embedded designs.
Integrated Processing System Architecture
| Component |
Specification |
| Application Processor |
Quad-core ARM Cortex-A53 (64-bit) up to 1.5GHz |
| Real-Time Processor |
Dual-core ARM Cortex-R5F up to 600MHz |
| Graphics Processing Unit |
ARM Mali-400 MP2 |
| L1 Cache |
32KB/32KB per core |
| L2 Cache |
1MB shared (APU) |
| On-Chip Memory |
256KB OCM |
Programmable Logic Resources
| Resource |
Specification |
| System Logic Cells |
256,200+ |
| CLB Flip-Flops |
234,240 |
| CLB LUTs |
117,120 |
| Block RAM |
7.6Mb |
| UltraRAM |
1.8Mb |
| DSP Slices |
1,248 |
XCZU5EG-3SFVC784E Technical Specifications
Package and Physical Characteristics
| Parameter |
Value |
| Part Number |
XCZU5EG-3SFVC784E |
| Manufacturer |
AMD (formerly Xilinx) |
| Package Type |
784-FCBGA |
| Package Dimensions |
23mm x 23mm |
| Ball Pitch |
0.8mm |
| Speed Grade |
-3 (Highest Performance) |
| Temperature Grade |
Extended (E): 0°C to +100°C |
| Core Voltage (VCCINT) |
0.85V |
| Process Technology |
16nm FinFET+ |
High-Speed I/O and Transceiver Capabilities
The XCZU5EG-3SFVC784E features advanced I/O capabilities designed for high-bandwidth applications:
| I/O Type |
Specification |
| High-Performance (HP) I/O |
Up to 156 pins (1.0V to 1.8V) |
| High-Density (HD) I/O |
Up to 96 pins (1.2V to 3.3V) |
| PS-GTR Transceivers |
4 channels @ up to 6.0Gb/s |
| GTH Transceivers |
Up to 12.5Gb/s (SFVC784 package) |
| PS MIO Pins |
78 multiplexed I/O |
| Total PS I/O |
214 pins |
Connectivity and Peripheral Interfaces
Processing System Peripherals
The Zynq UltraScale+ XCZU5EG provides comprehensive connectivity options:
| Interface |
Capability |
| USB 3.0/2.0 |
2x controllers (Host/Device/OTG) |
| Gigabit Ethernet |
4x GEM with RGMII/SGMII support |
| PCIe |
Gen2 x1/x2/x4 lanes |
| SATA 3.1 |
2x ports |
| DisplayPort |
1.2a source-only |
| CAN 2.0B |
2x interfaces |
| I²C |
2x controllers |
| SPI |
2x controllers |
| UART |
2x interfaces |
| GPIO |
Up to 174 pins (78 MIO + 96 EMIO) |
| SD/SDIO/eMMC |
2x interfaces |
Memory Interface Support
| Memory Type |
Support |
| DDR4 |
Up to 2400Mbps |
| LPDDR4 |
Supported |
| DDR3/DDR3L |
Up to 1866Mbps |
| LPDDR3 |
Supported |
| ECC |
Built-in support |
Applications for AMD XCZU5EG-3SFVC784E
This Zynq UltraScale+ MPSoC is ideal for applications requiring heterogeneous processing capabilities:
Industrial and Automation
- Motor control and industrial drives
- Programmable Logic Controllers (PLC)
- Industrial IoT gateways
- Machine vision systems
Video and Imaging
- 4K/8K video processing
- Multi-camera systems
- Medical imaging equipment
- Broadcast and professional video
Communications
- 5G wireless infrastructure
- Software-defined radio (SDR)
- Network packet processing
- High-speed data acquisition
Advanced Computing
- Machine learning inference at the edge
- AI acceleration
- Automotive ADAS systems
- Aerospace and defense applications
Why Choose the XCZU5EG-3SFVC784E?
Superior Performance-Per-Watt
The 16nm FinFET+ process technology enables the XCZU5EG-3SFVC784E to deliver exceptional computational performance while maintaining low power consumption. The device supports multiple power domains allowing unused sections to be powered down for maximum efficiency.
Scalable and Flexible Architecture
Engineers benefit from footprint compatibility across the Zynq UltraScale+ family, enabling easy migration between devices as project requirements evolve. The SFVC784 package provides pin compatibility with other C784-packaged devices.
Comprehensive Development Ecosystem
AMD provides extensive development support including:
- Vivado Design Suite for FPGA development
- Vitis unified software platform
- PetaLinux embedded Linux tools
- Extensive IP library and reference designs
Part Number Decoder: XCZU5EG-3SFVC784E
| Segment |
Meaning |
| XC |
Xilinx Commercial |
| ZU5 |
Zynq UltraScale+ Device 5 |
| EG |
EG Family (with GPU) |
| -3 |
Speed Grade (Highest) |
| SF |
0.8mm ball pitch flip chip |
| VC |
Pb-free package |
| 784 |
784 balls |
| E |
Extended temperature (0°C to +100°C) |
Ordering Information and Availability
The AMD XCZU5EG-3SFVC784E is available through authorized distributors worldwide. For additional Xilinx FPGA products, development boards, and technical support resources, contact your preferred electronic components supplier.
Related Part Numbers
| Part Number |
Speed Grade |
Temperature Range |
| XCZU5EG-1SFVC784E |
-1 |
Extended |
| XCZU5EG-1SFVC784I |
-1 |
Industrial |
| XCZU5EG-2SFVC784E |
-2 |
Extended |
| XCZU5EG-2SFVC784I |
-2 |
Industrial |
| XCZU5EG-3SFVC784E |
-3 |
Extended |
| XCZU5EG-L1SFVC784I |
-1L (Low Power) |
Industrial |
Summary
The AMD XCZU5EG-3SFVC784E represents the pinnacle of programmable SoC technology, offering engineers a powerful combination of ARM processing cores, advanced FPGA fabric, and comprehensive I/O capabilities. With 256K+ logic cells, quad-core Cortex-A53 processors, and high-speed transceiver support up to 12.5Gb/s, this Zynq UltraScale+ MPSoC is the ideal choice for demanding embedded applications requiring flexibility, performance, and power efficiency.
