Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5EG-3FBVB900E: High-Performance Zynq UltraScale+ MPSoC for Advanced Embedded Applications

Product Details

The AMD XCZU5EG-3FBVB900E is a powerful System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family, combining a feature-rich 64-bit quad-core ARM Cortex-A53 processor with high-performance programmable logic. This advanced Xilinx FPGA delivers exceptional processing power for demanding embedded applications including industrial automation, automotive systems, and AI-driven edge computing.


AMD XCZU5EG-3FBVB900E Key Specifications

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Part Number XCZU5EG-3FBVB900E
Family Zynq UltraScale+ MPSoC EG
Process Technology 16nm FinFET+
Package 900-FCBGA (31x31mm)
Ball Pitch 1.0mm
Speed Grade -3 (Highest Performance)
Temperature Range Extended (0°C to +100°C)
Operating Voltage (VCCINT) 0.90V

Zynq UltraScale+ MPSoC Processing System Architecture

The XCZU5EG-3FBVB900E integrates a comprehensive processing system (PS) that enables software-centric development approaches while maintaining hardware acceleration capabilities.

ARM Cortex-A53 Application Processing Unit (APU)

Feature Details
Core Configuration Quad-core ARM Cortex-A53 MPCore with CoreSight
Maximum Frequency Up to 1.5GHz
Architecture 64-bit ARMv8-A
L1 Cache 32KB I-Cache + 32KB D-Cache per core
L2 Cache 1MB shared
Operating Modes Single, symmetric, and asymmetric multiprocessing

ARM Cortex-R5F Real-Time Processing Unit (RPU)

Feature Details
Core Configuration Dual-core ARM Cortex-R5F with CoreSight
Maximum Frequency Up to 600MHz
Architecture 32-bit ARMv7-R
TCM (Tightly Coupled Memory) 256KB per core
Modes Lock-step or independent operation

Mali-400 MP2 Graphics Processing Unit

Feature Details
Configuration Dual pixel processors
Maximum Frequency Up to 667MHz
Supported Formats RGBA8888, RGB555, and more
OpenGL ES Support 1.1 and 2.0

XCZU5EG Programmable Logic (PL) Resources

The programmable logic section of the AMD XCZU5EG-3FBVB900E provides extensive resources for implementing custom hardware accelerators and high-speed interfaces.

Programmable Logic Specifications

Resource Quantity
System Logic Cells 256,200
CLB Flip-Flops 234,240
CLB LUTs 117,120
Block RAM 7.6 Mb (144 blocks)
UltraRAM 9 Mb (24 blocks)
DSP Slices 1,248

High-Speed Serial Transceivers

Parameter Specification
GTH Transceivers Up to 4
Maximum Data Rate 16.3 Gb/s
Protocol Support PCIe, SATA, DisplayPort, USB 3.0

XCZU5EG-3FBVB900E I/O Capabilities and Connectivity

Maximum I/O Configuration

I/O Type Count Voltage Support
HP (High-Performance) I/O Up to 156 1.0V to 1.8V
HD (High-Density) I/O Up to 72 1.2V to 3.3V
MIO (Multiplexed I/O) 78 Configurable
Total User I/O Up to 252

Integrated Peripheral Interfaces

The processing system includes numerous hard IP blocks for common interfaces:

Interface Specifications
DDR4/DDR3/LPDDR4 Memory Controller 64-bit with ECC, up to 2400 MT/s
USB 3.0 2 ports with integrated PHY
PCIe Gen2 x4 lanes
SATA 3.1 2 ports, 6 Gb/s
DisplayPort 1.2a, dual-lane
Gigabit Ethernet 4 controllers with IEEE 1588
CAN 2.0B 2 interfaces
UART 2 interfaces
SPI/I2C Multiple controllers

AMD XCZU5EG-3FBVB900E Part Number Decoder

Understanding the part number helps identify key device characteristics:

Code Segment Meaning
XC Xilinx Commercial grade
ZU5 Zynq UltraScale+ size 5
EG FPGA fabric with GPU (Graphics Processing)
-3 Speed grade (highest performance)
FB Package type (Fine-pitch BGA)
VB Package variant
900 Pin count (900 balls)
E Extended temperature range (0°C to +100°C)

Target Applications for Zynq UltraScale+ XCZU5EG MPSoC

The AMD XCZU5EG-3FBVB900E is ideal for demanding applications requiring both processing power and hardware acceleration:

Industrial and Automation

  • Motor control systems
  • Machine vision and inspection
  • Industrial robotics
  • Programmable logic controllers (PLCs)

Automotive Applications

  • Advanced driver assistance systems (ADAS)
  • In-vehicle infotainment
  • Autonomous driving compute platforms

Telecommunications and Networking

  • Software-defined radio (SDR)
  • 5G baseband processing
  • Network function virtualization

Artificial Intelligence and Machine Learning

  • Edge AI inference acceleration
  • Neural network implementation
  • Real-time video analytics

Medical and Scientific

  • Medical imaging systems
  • Laboratory instrumentation
  • Data acquisition systems

XCZU5EG Development and Design Resources

Vivado Design Suite Compatibility

The XCZU5EG-3FBVB900E is fully supported by AMD Vivado Design Suite, providing:

  • High-level synthesis (HLS)
  • IP Integrator for system design
  • Timing analysis and optimization
  • Power estimation tools

Available Development Boards

Engineers can accelerate development using evaluation platforms such as:

  • ZCU102 Evaluation Kit
  • ZCU104 Evaluation Kit
  • UltraZed-EG Starter Kit

XCZU5EG-3FBVB900E Power Management Features

Feature Description
Separate Power Domains PS and PL operate independently
Power Gating Individual blocks can be powered down
Dynamic Voltage Scaling Optimize power consumption
Low Power Modes Sleep and deep sleep states

Package Mechanical Specifications

Parameter Value
Package Type 900-Ball FCBGA
Body Size 31mm × 31mm
Ball Pitch 1.0mm
Ball Count 900
Maximum Height 4.18mm

Ordering Information and Availability

Order Code Description
XCZU5EG-3FBVB900E Commercial, Extended temp, -3 speed grade
XCZU5EG-2FBVB900E Commercial, Extended temp, -2 speed grade
XCZU5EG-2FBVB900I Commercial, Industrial temp, -2 speed grade
XCZU5EG-1FBVB900E Commercial, Extended temp, -1 speed grade

Why Choose AMD XCZU5EG-3FBVB900E Zynq UltraScale+ MPSoC?

The XCZU5EG-3FBVB900E offers significant advantages for embedded system designers:

  1. Highest Performance — The -3 speed grade delivers maximum throughput for demanding applications
  2. Heterogeneous Computing — Combines 64-bit application processors, real-time processors, and programmable logic
  3. Integrated GPU — Mali-400 MP2 graphics processor for display and video applications
  4. Advanced Security — Hardware root of trust, AES-256 encryption, and secure boot
  5. Extensive I/O — Multiple high-speed serial transceivers and memory interfaces
  6. Software-Centric Development — Boot-first processors enable familiar software development workflows
  7. Long-Term Availability — AMD commitment to extended product lifecycle

Related Zynq UltraScale+ MPSoC Devices

Part Number Logic Cells Transceivers Key Difference
XCZU3EG 154,350 4 GTH Smaller footprint
XCZU5EG 256,200 4 GTH Balanced resources
XCZU7EG 504,000 8 GTH More logic and transceivers
XCZU9EG 599,550 8 GTH Maximum logic density

Technical Documentation and Support

For complete specifications, refer to:

  • DS891: Zynq UltraScale+ MPSoC Data Sheet: Overview
  • DS925: Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics
  • UG1075: Zynq UltraScale+ MPSoC Packaging and Pinouts
  • UG1085: Zynq UltraScale+ MPSoC Technical Reference Manual

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.