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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5EG-2FBVB900I: Zynq UltraScale+ MPSoC FPGA System-on-Chip

Product Details

The AMD XCZU5EG-2FBVB900I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC EG family. This advanced embedded processor combines a powerful quad-core ARM Cortex-A53 processor with programmable FPGA logic, making it ideal for industrial automation, automotive systems, and edge computing applications.


Key Features of the XCZU5EG-2FBVB900I SoC FPGA

The XCZU5EG-2FBVB900I delivers exceptional processing power and flexibility for demanding embedded applications. This device integrates a feature-rich processing system with UltraScale architecture programmable logic in a single chip.

Integrated ARM Processor Architecture

The XCZU5EG-2FBVB900I features a heterogeneous multi-core processing system designed for maximum performance and real-time responsiveness:

  • Quad-Core ARM Cortex-A53 MPCore with CoreSight debug technology running at up to 1.3GHz
  • Dual-Core ARM Cortex-R5 real-time processors operating at 600MHz
  • ARM Mali-400 MP2 graphics processing unit for display and video applications

Programmable Logic Resources

The FPGA fabric provides extensive programmable logic resources for custom hardware acceleration:

  • 256,200+ Logic Cells for flexible digital design
  • 20nm FinFET Technology for optimal power efficiency
  • High-Speed I/O Interfaces supporting multiple communication protocols

XCZU5EG-2FBVB900I Technical Specifications

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Part Number XCZU5EG-2FBVB900I
Family Zynq UltraScale+ MPSoC EG
Logic Cells 256K+ (256,200)
Application Processor Quad ARM Cortex-A53 @ 1.3GHz
Real-Time Processor Dual ARM Cortex-R5 @ 600MHz
GPU ARM Mali-400 MP2 @ 533MHz
Process Technology 20nm
Core Voltage 0.85V
Speed Grade -2
Temperature Range Industrial (-40°C to +100°C)
Package Type 900-FCBGA (31mm x 31mm)
Ball Pitch 1.0mm
Mounting Type Surface Mount

Package and Ordering Information

Attribute Details
Package Code FBVB900
Pin Count 900 Pins
Package Dimensions 31mm x 31mm
Device Designation EG (with GPU)
Speed Grade Suffix -2 (Industrial)
RoHS Status Compliant
Packaging Tray

Zynq UltraScale+ MPSoC Architecture Overview

Processing System (PS) Features

The XCZU5EG-2FBVB900I processing system includes advanced capabilities for complex software applications:

  • 64-bit processing architecture with virtualization support
  • Integrated L1 and L2 cache memory hierarchy
  • TrustZone security technology for secure boot and runtime protection
  • Multiple DDR4/DDR3 memory controllers with ECC support
  • Up to 78 multiplexed I/O (MIO) pins for peripheral connectivity

Programmable Logic (PL) Features

The UltraScale+ programmable logic provides hardware acceleration capabilities:

  • Configurable Logic Blocks (CLBs) with 6-input LUTs
  • High-performance DSP slices for signal processing
  • Block RAM and UltraRAM for on-chip data storage
  • High-speed GTH transceivers for serial connectivity
  • Integrated PCIe Gen3/Gen4 support

Industrial Applications for XCZU5EG-2FBVB900I

The industrial temperature rating (-40°C to +100°C) makes this device suitable for demanding environments:

Embedded Vision and Image Processing

The combination of ARM processors and FPGA logic enables real-time image processing pipelines for machine vision, video analytics, and camera systems.

Industrial Automation and Control

Motor control, PLC replacement, and factory automation systems benefit from the real-time ARM Cortex-R5 processors combined with deterministic FPGA timing.

Automotive ADAS Systems

Advanced driver assistance systems leverage the XCZU5EG-2FBVB900I for sensor fusion, object detection, and vehicle control applications.

Wireless Communications Infrastructure

5G and LTE base stations utilize the high-bandwidth processing capabilities for baseband signal processing and protocol handling.


Development Tools and Software Support

AMD provides comprehensive development resources for the Zynq UltraScale+ platform:

  • Vivado Design Suite for FPGA synthesis and implementation
  • Vitis Unified Software Platform for embedded software development
  • PetaLinux Tools for Linux kernel and root filesystem customization
  • Xilinx Runtime (XRT) for accelerator management

Why Choose the XCZU5EG-2FBVB900I for Your Design

The XCZU5EG-2FBVB900I offers significant advantages for embedded system designers:

  1. Integrated Solution – Combines processor, FPGA, and GPU in a single device
  2. Industrial Grade – Qualified for extended temperature operation
  3. Power Efficient – 20nm FinFET technology reduces power consumption
  4. Scalable Architecture – Compatible with the broader Zynq UltraScale+ family
  5. Extensive Ecosystem – Comprehensive tools, IP cores, and reference designs

Related Zynq UltraScale+ MPSoC Devices

Part Number Logic Cells Features
XCZU5EG-1FBVB900I 256K+ Speed Grade -1, Industrial
XCZU5EG-2FBVB900E 256K+ Speed Grade -2, Extended
XCZU5CG-2FBVB900I 256K+ Without GPU, Industrial
XCZU5EV-2FBVB900I 256K+ With Video Codec, Industrial
XCZU7EG-2FBVB900I 504K+ Higher Logic Capacity

Order AMD XCZU5EG-2FBVB900I Today

Looking for reliable Xilinx FPGA components for your next embedded project? The XCZU5EG-2FBVB900I Zynq UltraScale+ MPSoC delivers the performance and flexibility needed for industrial, automotive, and communications applications. Contact us for pricing, availability, and technical support.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.