Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5CG-L2SFVC784E: Zynq UltraScale+ MPSoC FPGA for High-Performance Embedded Applications

Product Details

The AMD XCZU5CG-L2SFVC784E is a powerful System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family, combining industry-leading programmable logic with dual-core ARM processors. Built on advanced 20nm technology, this device delivers exceptional performance, low power consumption, and unmatched flexibility for demanding embedded applications including industrial automation, edge computing, and next-generation wireless communications.


Key Features of the XCZU5CG-L2SFVC784E Zynq UltraScale+ MPSoC

The XCZU5CG-L2SFVC784E integrates heterogeneous processing power with adaptive hardware acceleration, making it ideal for applications requiring real-time control and high-throughput data processing.

Programmable Logic Resources

Specification Value
Logic Cells 256,200+
CLB LUTs 117,120
CLB Flip-Flops 234,240
DSP Slices 1,248
Block RAM 144 Blocks (5.1 Mb)
Distributed RAM 3.5 Mb

ARM Processor Subsystem

Processor Core Type Max Frequency
Application Processing Unit (APU) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ Up to 1.3 GHz
Real-Time Processing Unit (RPU) Dual ARM® Cortex®-R5 with CoreSight™ Up to 500 MHz

XCZU5CG-L2SFVC784E Technical Specifications

Package and Physical Characteristics

Parameter Specification
Package Type 784-Pin FC-FBGA (SFVC784)
Ball Pitch 0.8 mm
Package Dimensions 23 mm × 23 mm
Technology Node 20nm FinFET
Core Voltage (VCCINT) 0.85V / 0.72V (Low Power)
Speed Grade L2 (Low Power, Extended Performance)
Operating Temperature 0°C to +100°C (TJ)

I/O and Connectivity Features

Interface Type Specification
Max HP I/O (High-Performance) 156 Pins
Max HD I/O (High-Density) 96 Pins
GTH Transceivers 16 Channels (up to 12.5 Gb/s)
PS-GTR Transceivers 4 Channels (up to 6.0 Gb/s)
PS MIO Pins Up to 78 Multiplexed I/O
PS I/O 214 Pins

Memory and Storage Interface Support

The XCZU5CG-L2SFVC784E provides comprehensive memory interface options for diverse application requirements.

External Memory Controllers

Memory Type Support
DDR4 ✓ Supported
DDR3/DDR3L ✓ Supported
LPDDR4 ✓ Supported
LPDDR3 ✓ Supported
Quad-SPI Flash ✓ Supported
NAND Flash ✓ Supported
eMMC ✓ Supported

On-Chip Memory

Feature Specification
On-Chip RAM 256 KB with ECC
L1 Cache (APU) 32 KB I-Cache + 32 KB D-Cache per core
L2 Cache (APU) 1 MB Shared

High-Speed Interface Capabilities

PCIe and Serial Interfaces

Interface Specification
PCIe Gen2 (5.0 GT/s) – Root Complex or Endpoint
PCIe Lanes x1, x2, or x4 Configurations
SATA 1.5 / 3.0 / 6.0 Gb/s
USB 3.0 Up to 5.0 Gb/s
USB 2.0 Host, Device, or OTG
DisplayPort 1.62 / 2.7 / 5.4 Gb/s (up to 2 lanes)
SGMII ✓ Supported

Peripheral Connectivity

Peripheral Availability
Gigabit Ethernet ✓ Supported
CAN 2.0B ✓ Supported
UART ✓ Supported
I²C ✓ Supported
SPI ✓ Supported
GPIO 32-bit
SD/SDIO/MMC ✓ Supported

AMD Zynq UltraScale+ MPSoC CG Family Advantages

Why Choose the XCZU5CG-L2SFVC784E?

The CG variant of the Zynq UltraScale+ MPSoC family offers a cost-optimized solution with dual-core ARM Cortex-A53 processors, making it perfect for applications that require:

  • Real-time processing with deterministic ARM Cortex-R5 cores
  • Hardware acceleration through programmable FPGA fabric
  • Low power consumption with L-series voltage optimization
  • High-speed connectivity with integrated GTH transceivers
  • Flexible I/O supporting multiple voltage standards (1.0V to 3.3V)

Target Applications

Industry Application Examples
Industrial Automation Motor control, PLC, machine vision
Communications 5G wireless infrastructure, software-defined radio
Automotive ADAS, sensor fusion, in-vehicle networking
Medical Diagnostic imaging, patient monitoring
Aerospace & Defense Radar processing, secure communications
Edge Computing AI inference, IoT gateways

Part Number Breakdown: XCZU5CG-L2SFVC784E

Segment Meaning
XC Xilinx Commercial
ZU5 Zynq UltraScale+ Size 5
CG Dual-Core (No GPU, No Video Codec)
L2 Low Power Speed Grade 2
SFVC784 784-Pin FCBGA, 0.8mm Ball Pitch
E Extended Temperature (0°C to +100°C)

Development Tools and Software Ecosystem

The XCZU5CG-L2SFVC784E is fully supported by AMD’s comprehensive development ecosystem:

  • Vivado Design Suite – Complete FPGA development environment
  • Vitis Unified Software Platform – Application development and AI optimization
  • PetaLinux – Embedded Linux distribution for Zynq devices
  • Arm Development Studio – Professional debugging and profiling

Where to Buy AMD XCZU5CG-L2SFVC784E

For engineers and procurement teams seeking reliable sources for the AMD XCZU5CG-L2SFVC784E and other Zynq UltraScale+ MPSoC devices, authorized distributors and trusted suppliers offer competitive pricing and technical support.

Explore our complete selection of Xilinx FPGA solutions for your next embedded design project.


Frequently Asked Questions About XCZU5CG-L2SFVC784E

What is the difference between CG, EG, and EV variants?

The CG variant features dual-core ARM Cortex-A53 processors without a GPU or video codec. The EG variant adds a Mali-400 GPU, while the EV variant includes both the GPU and an integrated H.264/H.265 video codec for multimedia applications.

What speed grades are available for the XCZU5CG?

The XCZU5CG is available in -1, -2, and -3 speed grades for standard operation, plus L1 and L2 variants optimized for low-power operation at reduced voltage (0.72V or 0.85V VCCINT).

Is the XCZU5CG-L2SFVC784E footprint compatible with other devices?

Yes, the SFVC784 package is footprint compatible with other UltraScale architecture devices sharing the same package designation, enabling design flexibility and migration paths.


Summary: XCZU5CG-L2SFVC784E Specifications at a Glance

Category Specification
Family AMD Zynq UltraScale+ MPSoC
Logic Cells 256,200+
DSP Slices 1,248
Block RAM 5.1 Mb
ARM Cores 2× Cortex-A53 + 2× Cortex-R5
GTH Transceivers 16 (12.5 Gb/s)
Package 784-FCBGA
Technology 20nm
Temperature Range 0°C to +100°C

The AMD XCZU5CG-L2SFVC784E delivers the perfect balance of processing power, programmable logic, and power efficiency for next-generation embedded systems. Its combination of ARM processors and UltraScale+ FPGA fabric provides the flexibility to meet evolving application requirements while maintaining industry-leading performance.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.