The AMD XCZU5CG-L2FBVB900E is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family. This advanced multiprocessor device combines the power of dual ARM Cortex-A53 application processors with flexible programmable logic, making it an ideal solution for industrial automation, edge AI, motor control, and sensor fusion applications.
Built on AMD’s industry-leading 20nm FinFET+ technology, the XCZU5CG-L2FBVB900E delivers exceptional performance while maintaining low power consumption. The “-L2” speed grade designation indicates optimized power efficiency, perfect for applications where thermal management and energy savings are critical design requirements.
XCZU5CG-L2FBVB900E Key Features and Benefits
Powerful Dual-Core ARM Processing System
The processing system (PS) of the XCZU5CG-L2FBVB900E includes a dual-core ARM Cortex-A53 MPCore running up to 1.5 GHz, delivering robust 64-bit application processing capability. Additionally, a dual-core ARM Cortex-R5 real-time processing unit operates at up to 500 MHz, enabling deterministic real-time control for time-critical operations.
High-Capacity Programmable Logic Resources
With over 256,000 logic cells, the programmable logic (PL) section provides substantial resources for implementing custom hardware accelerators, digital signal processing algorithms, and high-speed interfaces. The UltraScale architecture delivers up to 2x performance improvement compared to previous-generation devices.
Advanced Low-Power Architecture
The “-L2” variant operates at VCCINT voltages of 0.85V or 0.72V, specifically screened for lower maximum static power. When operated at 0.85V, the device maintains the same speed specification as the -2I speed grade. At 0.72V operation, both static and dynamic power consumption are significantly reduced, extending battery life in portable applications.
XCZU5CG-L2FBVB900E Technical Specifications
| Parameter |
Specification |
| Part Number |
XCZU5CG-L2FBVB900E |
| Device Family |
Zynq UltraScale+ MPSoC CG |
| Logic Cells |
256,200 (256K+) |
| CLB Flip-Flops |
234,240 |
| CLB LUTs |
117,120 |
| Distributed RAM |
3.5 Mb |
| Block RAM |
5.1 Mb (144 Blocks) |
| DSP Slices |
240 |
| Process Technology |
20nm FinFET+ |
Processor System Specifications
| Parameter |
Specification |
| Application Processor |
Dual ARM Cortex-A53 MPCore with CoreSight |
| APU Clock Speed |
Up to 1.5 GHz |
| Real-Time Processor |
Dual ARM Cortex-R5 with CoreSight |
| RPU Clock Speed |
Up to 500 MHz |
| On-Chip RAM |
256 KB |
| Architecture |
64-bit Processing |
Package and Electrical Specifications
| Parameter |
Specification |
| Package Type |
900-FCBGA (Flip-Chip Ball Grid Array) |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0 mm |
| Speed Grade |
-L2 (Low Power) |
| Temperature Grade |
Extended (E): 0°C to +100°C (TJ) |
| Core Voltage (VCCINT) |
0.85V or 0.72V |
| RoHS Compliance |
Yes (RoHS3) |
Connectivity and Interface Options
High-Speed Serial Interfaces
The XCZU5CG-L2FBVB900E supports multiple high-speed serial connectivity options including PCIe Gen2/Gen3, USB 3.0, SATA 3.1, and DisplayPort interfaces. GTH transceivers enable data rates suitable for demanding communication protocols.
Memory Interface Support
| Memory Type |
Support |
| DDR4 |
Yes |
| DDR3/DDR3L |
Yes |
| LPDDR4 |
Yes |
| QDRII+ |
Yes |
| Quad SPI Flash |
Yes |
| eMMC/SD/SDIO |
Yes |
General Connectivity Peripherals
The device includes comprehensive peripheral connectivity with CANbus 2.0B (ISO11898-1 compliant), Gigabit Ethernet MACs, I²C controllers, UART/USART interfaces, SPI controllers, and USB 2.0 OTG capability. GPIO support provides up to 78 bits through MIO and 96 bits through EMIO.
XCZU5CG-L2FBVB900E Target Applications
Industrial Motor Control and Automation
The dual-core real-time processing capability combined with programmable logic makes this device ideal for sophisticated motor control algorithms, multi-axis servo drives, and industrial robotics applications requiring precise timing and low latency.
Sensor Fusion and Edge AI
The CG variant of the Zynq UltraScale+ MPSoC family excels in sensor fusion applications where multiple sensor inputs must be processed simultaneously. The combination of ARM processors and FPGA fabric enables efficient implementation of machine learning inference at the edge.
Wireless Communications Infrastructure
High-performance signal processing capabilities support implementation of advanced wireless communication systems, software-defined radio (SDR), and 5G infrastructure components.
Medical Imaging and Instrumentation
The device’s high-bandwidth data processing capabilities and deterministic timing characteristics make it suitable for medical imaging equipment, diagnostic instruments, and patient monitoring systems.
Design Development Resources
Software Development Tools
The AMD Vivado Design Suite provides comprehensive support for XCZU5CG-L2FBVB900E development, offering an intuitive environment for FPGA synthesis, implementation, and debugging. The Vitis unified software platform enables seamless hardware/software co-design workflows.
Documentation and Support
AMD provides extensive technical documentation including detailed datasheets (DS891, DS925), user guides for packaging and pinouts, and application notes covering common design scenarios.
Part Number Decoder: XCZU5CG-L2FBVB900E
Understanding the part number structure helps identify key device characteristics:
| Code |
Meaning |
| XC |
Xilinx Commercial |
| ZU5 |
Zynq UltraScale+ Size 5 |
| CG |
Dual-Core Cortex-A53 (No GPU) |
| L2 |
Low-Power, Speed Grade -2 Equivalent |
| FB |
Flip-Chip Package |
| VB |
Lead-Free BGA |
| 900 |
900-Ball Count |
| E |
Extended Temperature Range |
Why Choose the AMD XCZU5CG-L2FBVB900E?
The XCZU5CG-L2FBVB900E represents an optimal balance of processing performance, programmable logic resources, and power efficiency within the Zynq UltraScale+ MPSoC portfolio. Engineers seeking a heterogeneous computing platform for cost-sensitive yet high-performance applications will find this device offers compelling advantages over discrete processor and FPGA solutions.
The integrated approach reduces board complexity, lowers BOM costs, and enables faster time-to-market while providing the flexibility to adapt to evolving application requirements through firmware updates.
For engineers and procurement specialists searching for reliable Xilinx FPGA solutions, the XCZU5CG-L2FBVB900E delivers enterprise-grade reliability backed by AMD’s comprehensive support infrastructure and global distribution network.
Related Part Numbers and Cross-References
| Part Number |
Description |
| XCZU5CG-L1FBVB900I |
Industrial temp, -L1 speed grade |
| XCZU5CG-2FBVB900E |
Standard -2 speed grade, extended temp |
| XCZU5CG-2FBVB900I |
Standard -2 speed grade, industrial temp |
| XCZU5EG-L2FBVB900E |
Quad-core variant with GPU |
| XCZU5CG-L2SFVC784E |
784-ball package option |
