Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5CG-L1SFVC784I: Zynq UltraScale+ MPSoC FPGA System-on-Chip

Product Details

The AMD XCZU5CG-L1SFVC784I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family, combining advanced ARM Cortex processors with powerful programmable logic. This industrial-grade Xilinx FPGA delivers exceptional processing capabilities for embedded systems, edge computing, and real-time applications requiring both hardware acceleration and software programmability.


XCZU5CG-L1SFVC784I Key Features and Benefits

The XCZU5CG-L1SFVC784I integrates dual-core ARM Cortex-A53 application processors with dual-core ARM Cortex-R5 real-time processors, providing a versatile heterogeneous computing platform. Built on advanced 20nm process technology, this MPSoC offers an optimal balance between high performance and low power consumption.

Dual ARM Cortex-A53 Application Processing Unit

The Application Processing Unit (APU) features dual ARM Cortex-A53 64-bit processors operating at up to 1.2 GHz. These cores deliver exceptional computational performance for running Linux, Android, or bare-metal applications. The integrated CoreSight debug technology enables comprehensive system debugging and trace capabilities.

Dual ARM Cortex-R5 Real-Time Processing Unit

The Real-Time Processing Unit (RPU) incorporates dual ARM Cortex-R5 32-bit processors running at up to 500 MHz. These deterministic, low-latency cores are ideal for safety-critical applications, motor control, and real-time signal processing tasks.

Programmable Logic Resources

The XCZU5CG-L1SFVC784I includes 256,200 logic cells within its UltraScale+ programmable logic fabric, enabling custom hardware acceleration and peripheral implementation. This programmable logic section supports high-speed interfaces and custom IP cores.


XCZU5CG-L1SFVC784I Technical Specifications

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Part Number XCZU5CG-L1SFVC784I
Product Family Zynq UltraScale+ MPSoC
Device Type System-on-Chip (SoC) FPGA
Application Processor Dual ARM Cortex-A53 MPCore with CoreSight
APU Clock Speed Up to 1.2 GHz
Real-Time Processor Dual ARM Cortex-R5 with CoreSight
RPU Clock Speed Up to 500 MHz
Logic Cells 256,200
Process Technology 20nm FinFET
Core Voltage (VCCINT) 0.85V (0.72V Low Power Mode)

XCZU5CG-L1SFVC784I Package and Electrical Specifications

Parameter Value
Package Type FCBGA (Flip-Chip Ball Grid Array)
Package Code SFVC784
Pin Count 784 Pins
Package Dimensions 23mm x 23mm
Ball Pitch 0.8mm
Temperature Grade Industrial (I)
Operating Temperature -40°C to +100°C
Speed Grade -1 (L1 Low Power Variant)
RoHS Compliance Yes
Moisture Sensitivity Level MSL-3

XCZU5CG-L1SFVC784I Speed Grade and Power Options

The XCZU5CG-L1SFVC784I utilizes the L1 speed grade designation, indicating it is optimized for low power operation while maintaining industrial temperature range qualification.

Low Power Operating Modes

Operating Mode VCCINT Voltage Performance Characteristic
Standard Mode 0.85V Full -1I speed grade performance
Low Power Mode 0.72V Reduced static and dynamic power

The L1 variant provides excellent power efficiency for battery-powered applications, IoT edge devices, and thermally constrained designs. When operated at 0.85V, the device delivers identical performance to standard -1I speed grade devices.


XCZU5CG-L1SFVC784I I/O and Connectivity Features

Multiplexed I/O (MIO) Interface

The Processing System includes up to 78 dedicated Multiplexed I/O (MIO) pins that can be software-configured to connect various peripheral interfaces. These pins support:

  • UART communication interfaces
  • SPI and I2C serial buses
  • GPIO functionality
  • SD/SDIO memory card interfaces
  • USB 2.0 and USB 3.0 controllers
  • Gigabit Ethernet MAC

Extended MIO (EMIO) Capabilities

When application requirements exceed the 78 MIO pins, additional I/O peripherals can be routed through the Programmable Logic using Extended MIO (EMIO). This architecture provides virtually unlimited I/O expansion possibilities.

High-Performance and High-Density I/O Banks

I/O Type Pins Per Bank Voltage Range Characteristics
HP (High-Performance) 52 1.0V – 1.8V Optimized for high-speed interfaces
HD (High-Density) 24 1.2V – 3.3V Cost-effective general-purpose I/O

XCZU5CG-L1SFVC784I Application Areas

The AMD XCZU5CG-L1SFVC784I Zynq UltraScale+ MPSoC excels in demanding embedded applications across multiple industries:

Industrial Automation and Control

  • Programmable Logic Controllers (PLCs)
  • Industrial IoT gateways
  • Motor drive systems
  • Machine vision processing

Telecommunications and Networking

  • 5G wireless infrastructure
  • Software-defined radio (SDR)
  • Network packet processing
  • Protocol conversion bridges

Aerospace and Defense

  • Radar signal processing
  • Electronic warfare systems
  • Avionics computing platforms
  • Secure communications

Medical and Healthcare

  • Medical imaging systems
  • Patient monitoring devices
  • Diagnostic equipment
  • Surgical robotics

Automotive Applications

  • Advanced driver assistance systems (ADAS)
  • Infotainment systems
  • Vehicle networking gateways
  • Sensor fusion platforms

XCZU5CG-L1SFVC784I Development Tools and Software Support

Vivado Design Suite

AMD provides comprehensive development support through the Vivado Design Suite, offering:

  • RTL synthesis and implementation
  • Integrated IP catalog with AXI interconnects
  • Hardware debugging with ILA and VIO
  • Power analysis and optimization tools

Vitis Unified Software Platform

The Vitis platform enables software development for the ARM processors, including:

  • Embedded Linux development
  • Bare-metal application programming
  • Hardware acceleration library integration
  • AI/ML inference engine deployment

XCZU5CG-L1SFVC784I Part Number Breakdown

Understanding the AMD Xilinx part numbering convention helps identify device specifications:

Code Segment Value Meaning
XC XC Xilinx Commercial/Industrial
ZU5 ZU5 Zynq UltraScale+ Size 5
CG CG Cost-optimized General Purpose (No Video Codec)
L1 L1 Low Power, Speed Grade 1
SFVC SFVC Lead-free, Fine-pitch BGA, Very thin profile
784 784 784-pin package
I I Industrial Temperature Grade

Why Choose the XCZU5CG-L1SFVC784I for Your Design

The XCZU5CG-L1SFVC784I offers compelling advantages for embedded system designers:

  • Heterogeneous Processing Architecture: Combines application processing, real-time processing, and programmable logic in a single device
  • Power Efficiency: L1 low-power variant reduces energy consumption for portable and thermally constrained applications
  • Industrial Reliability: Qualified for -40°C to +100°C operation with extensive reliability testing
  • Scalable Platform: Pin-compatible with other Zynq UltraScale+ devices for easy design migration
  • Long-Term Availability: AMD commits to extended product lifecycle support for industrial applications

XCZU5CG-L1SFVC784I Ordering Information

Order Code Description
XCZU5CG-L1SFVC784I Zynq UltraScale+ MPSoC, CG Device, L1 Speed, 784-FCBGA, Industrial, Tray

Contact authorized distributors for current pricing, lead times, and volume availability. Request manufacturer datasheets for complete electrical specifications and design guidelines.


Related Zynq UltraScale+ MPSoC Devices

Part Number Logic Cells Package Temperature Key Difference
XCZU5CG-1SFVC784I 256,200 784-FCBGA Industrial Standard power
XCZU5CG-2SFVC784I 256,200 784-FCBGA Industrial Speed Grade 2
XCZU5EG-L1SFVC784I 256,200 784-FCBGA Industrial With GPU/VCU
XCZU4CG-L1SFVC784I 192,200 784-FCBGA Industrial Smaller logic
XCZU6CG-L1FFVC900I 331,000 900-FCBGA Industrial Larger logic

Conclusion

The AMD XCZU5CG-L1SFVC784I represents an exceptional choice for engineers seeking a powerful, low-power System-on-Chip solution. With its dual ARM Cortex-A53 and Cortex-R5 processors, 256,200 programmable logic cells, and industrial temperature rating, this Zynq UltraScale+ MPSoC delivers the performance and reliability required for demanding embedded applications. The L1 low-power variant makes it particularly suitable for energy-conscious designs without compromising processing capabilities.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.