The AMD XCZU5CG-L1FBVB900I is a high-performance System on Chip (SoC) from the Zynq UltraScale+ MPSoC family, combining powerful ARM Cortex processors with advanced programmable logic. This industrial-grade FPGA device delivers exceptional performance for embedded applications requiring both processing power and hardware acceleration capabilities.
XCZU5CG-L1FBVB900I Overview and Key Features
The XCZU5CG-L1FBVB900I integrates dual ARM Cortex-A53 application processors with dual ARM Cortex-R5 real-time processors, offering unmatched flexibility for complex embedded systems. Built on 20nm process technology, this Xilinx FPGA delivers superior power efficiency while maintaining exceptional computational performance.
Core Processing Architecture
The processing system features a heterogeneous computing platform that enables parallel workload distribution. The Cortex-A53 cores handle application-level processing at frequencies up to 1.2GHz, while the Cortex-R5 cores manage real-time tasks at up to 500MHz with deterministic response times.
XCZU5CG-L1FBVB900I Technical Specifications
Product Identification
| Parameter |
Specification |
| Manufacturer Part Number |
XCZU5CG-L1FBVB900I |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Zynq UltraScale+ MPSoC |
| Device Subfamily |
CG (Cost-Optimized) |
| RoHS Status |
Compliant |
| Lifecycle Status |
Production |
Programmable Logic Specifications
| Parameter |
Value |
| Logic Cells |
256,200 |
| CLB Flip-Flops |
234,240 |
| CLB LUTs |
117,120 |
| DSP Slices |
240 |
| Block RAM (36Kb) |
7.6 Mb Total |
| UltraRAM |
Available |
| Process Technology |
20nm |
Processing System (PS) Specifications
| Component |
Description |
| Application Processor Unit (APU) |
Dual ARM Cortex-A53 MPCore with CoreSight |
| APU Maximum Frequency |
1.2 GHz |
| Real-Time Processor Unit (RPU) |
Dual ARM Cortex-R5 with CoreSight |
| RPU Maximum Frequency |
500 MHz |
| L1 Cache |
32KB I-Cache + 32KB D-Cache per core |
| L2 Cache |
1MB Shared |
| Memory Controller |
DDR4/DDR3/DDR3L/LPDDR4/LPDDR3 |
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
0.85V (Standard) / 0.72V (Low Power) |
| Speed Grade |
-1LI (Industrial, Low Power) |
| Static Power |
Optimized for Low Power Operation |
| Power Modes |
Multiple Power Islands |
Package Information
| Parameter |
Specification |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Package Code |
FBVB900 |
| Pin Count |
900 Pins |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Maximum I/O |
204 User I/O |
| Mounting Type |
Surface Mount |
Operating Conditions
| Parameter |
Value |
| Temperature Grade |
Industrial (I) |
| Operating Temperature |
-40°C to +100°C (TJ) |
| Storage Temperature |
-65°C to +150°C |
| Moisture Sensitivity Level |
MSL-3 |
XCZU5CG-L1FBVB900I Advanced Features
High-Speed Connectivity
The XCZU5CG-L1FBVB900I includes integrated high-speed serial transceivers supporting multiple protocols. The device provides robust connectivity options for modern embedded applications including PCIe, USB 3.0, DisplayPort, SATA, and Gigabit Ethernet interfaces.
Memory Subsystem Architecture
The integrated memory controller supports various DDR memory standards with ECC protection. Block RAM modules feature built-in FIFO functionality and error correction capabilities. UltraRAM blocks provide additional high-bandwidth, low-latency memory resources for demanding applications.
Security Features
Hardware-based security includes AES-256 encryption for bitstream protection, SHA-384 authentication, and secure boot capabilities. The Configuration Security Unit (CSU) manages all security-related operations during device initialization.
DSP Slice Capabilities
Each DSP slice contains a 27×18-bit multiplier with 48-bit accumulator, pre-adder for symmetric filter optimization, SIMD arithmetic support, and 96-bit XOR functionality for error correction algorithms.
XCZU5CG-L1FBVB900I Application Areas
Industrial Automation and Control
This SoC FPGA excels in industrial applications requiring real-time processing with deterministic response times. The dual Cortex-R5 processors enable precise motor control, sensor fusion, and safety-critical operations.
Embedded Vision and Image Processing
The combination of programmable logic and ARM processors makes this device ideal for embedded vision systems. Hardware acceleration handles pixel-level processing while the application processors manage higher-level algorithms.
Wireless Communications Infrastructure
The XCZU5CG-L1FBVB900I supports 5G small cell, LTE baseband processing, and software-defined radio applications. DSP slices provide efficient signal processing for modulation and demodulation algorithms.
Aerospace and Defense Applications
Industrial temperature rating and low-power operation make this device suitable for avionics, radar signal processing, and electronic warfare systems requiring reliable performance in extreme conditions.
Edge Computing and AI Inference
Hardware acceleration capabilities enable efficient neural network inference at the edge. The programmable logic implements custom accelerators while processors handle pre/post-processing tasks.
XCZU5CG-L1FBVB900I Development Resources
Design Tools
The Vivado Design Suite provides comprehensive support for XCZU5CG-L1FBVB900I development. Features include synthesis, implementation, timing analysis, and hardware debugging capabilities. The Vitis unified software platform enables seamless hardware-software co-development.
Documentation and Support
Complete technical documentation includes the DS891 datasheet overview, DS925 DC/AC switching characteristics, UG1085 technical reference manual, and packaging specifications with pinout information.
XCZU5CG-L1FBVB900I Part Number Decoder
Understanding the AMD part numbering convention helps identify device specifications:
| Segment |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial |
| ZU |
ZU |
Zynq UltraScale+ |
| 5 |
5 |
Device Size (Mid-Range) |
| CG |
CG |
Cost-Optimized Graphics |
| -L1 |
L1 |
Speed Grade -1, Low Power |
| FBVB |
FBVB |
Package Type (FCBGA) |
| 900 |
900 |
Pin Count |
| I |
I |
Industrial Temperature |
Why Choose AMD XCZU5CG-L1FBVB900I
The XCZU5CG-L1FBVB900I offers an optimal balance of performance, power efficiency, and cost for industrial embedded applications. The -1LI speed grade provides reduced static power consumption without compromising functionality, making it ideal for thermally constrained or battery-powered designs. With over 256,000 logic cells and integrated ARM processors, this Zynq UltraScale+ MPSoC delivers the flexibility and computational capability required for next-generation embedded systems.
Ordering Information
| Part Number |
Description |
Package |
Temperature |
| XCZU5CG-L1FBVB900I |
Zynq UltraScale+ MPSoC, Low Power, Industrial |
900-FCBGA |
-40°C to +100°C |
