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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5CG-2SFVC784I: Zynq UltraScale+ MPSoC FPGA for High-Performance Embedded Applications

Product Details

The AMD XCZU5CG-2SFVC784I is a powerful Zynq UltraScale+ MPSoC (Multi-Processor System-on-Chip) that combines dual ARM Cortex-A53 processors with advanced FPGA programmable logic in a single device. This industrial-grade Xilinx FPGA delivers exceptional performance for demanding applications including edge computing, industrial automation, wireless communications, and real-time analytics.


XCZU5CG-2SFVC784I Key Features and Benefits

The XCZU5CG-2SFVC784I belongs to AMD’s Zynq UltraScale+ MPSoC CG (Cost-Optimized with GPU) device family. This advanced SoC integrates heterogeneous processing capabilities with programmable logic, enabling system-level differentiation through hardware, software, and I/O programmability.

Dual ARM Cortex-A53 Processing System

The processing system (PS) features a 64-bit quad-core ARM Cortex-A53 MPCore with CoreSight technology, operating at frequencies up to 1.3GHz. This high-performance application processor delivers the computational power required for complex software workloads.

Real-Time ARM Cortex-R5F Processors

Complementing the application processors, the XCZU5CG-2SFVC784I includes dual ARM Cortex-R5F real-time processors operating at up to 533MHz. These processors handle time-critical tasks with deterministic response times essential for industrial and safety-critical applications.

20nm UltraScale+ Programmable Logic

The programmable logic (PL) section is built on AMD’s advanced 20nm FinFET technology, delivering superior performance-per-watt compared to previous generations. The UltraScale architecture provides enhanced routing efficiency and improved timing closure.


XCZU5CG-2SFVC784I Technical Specifications

Programmable Logic Resources

Parameter Specification
Logic Cells 256,200
System Logic Cells 256K+
CLB Flip-Flops 234,240
CLB Look-Up Tables (LUTs) 117,120
Distributed RAM 3.5 Mb
DSP Slices (18×25 MACCs) 1,248
Block RAM Blocks 144
Block RAM Capacity 5.1 Mb

Processing System Specifications

Component Specification
Application Processor Dual ARM Cortex-A53 MPCore with CoreSight
APU Clock Speed Up to 1.3 GHz
Real-Time Processor Dual ARM Cortex-R5F with CoreSight
RPU Clock Speed Up to 533 MHz
Architecture 64-bit ARMv8-A
L1 Cache 32KB I-Cache, 32KB D-Cache per core
L2 Cache 1MB shared

I/O and Connectivity Features

Parameter Specification
Max High-Performance (HP) I/O 156
Max High-Density (HD) I/O 96
HP I/O Voltage Range 1.0V to 1.8V
HD I/O Voltage Range 1.2V to 3.3V
GTH Transceivers 4
Transceiver Data Rate Up to 12.5 Gb/s
PS I/O Pins 214

Package and Electrical Specifications

Parameter Specification
Package Type 784-FCBGA (Flip-Chip Ball Grid Array)
Package Dimensions 23mm x 23mm
Ball Pitch 0.8mm (SF package)
Speed Grade -2 (Standard Performance)
Temperature Grade Industrial (-40°C to +100°C)
Core Voltage (VCCINT) 0.85V
Process Technology 20nm FinFET

XCZU5CG-2SFVC784I Architecture Overview

Configurable Logic Block (CLB) Structure

Each CLB in the UltraScale architecture contains 8 LUTs and 16 flip-flops. The LUTs support flexible configuration as either one 6-input LUT with one output or two 5-input LUTs with separate outputs but common inputs. This architecture enables efficient implementation of complex logic functions.

Memory Interface Capabilities

The XCZU5CG-2SFVC784I includes dedicated physical interface (PHY) blocks supporting high-performance connections to external memories including DDR4, DDR3, DDR3L, LPDDR3, LPDDR4, QDRII+, and RLDRAM3. The PHY blocks generate address/control and data bus signaling with precision clock/data alignment.

Clock Management Technology

The device features advanced clock management tiles (CMT) with mixed-mode clock managers (MMCM) and phase-locked loops (PLL). Clock distribution uses 24 horizontal and vertical clock routes per clock region with 16 gateable leaf clocks for power-efficient operation.


XCZU5CG-2SFVC784I Application Areas

Industrial Automation and Control

The combination of real-time ARM Cortex-R5F processors with high-speed programmable logic makes the XCZU5CG-2SFVC784I ideal for industrial control systems, motor drives, and factory automation equipment requiring deterministic response times.

Wireless Communications Infrastructure

With GTH transceivers supporting up to 12.5 Gb/s data rates and extensive DSP resources, this device excels in 5G base stations, small cells, and wireless backhaul equipment.

Edge Computing and AI Acceleration

The heterogeneous architecture enables efficient deployment of machine learning inference workloads at the network edge, combining software-based preprocessing with hardware-accelerated neural network execution.

Medical and Scientific Instrumentation

High I/O bandwidth and precise timing capabilities support demanding applications in medical imaging, laboratory equipment, and scientific measurement systems.


Speed Grade and Operating Conditions

The XCZU5CG-2SFVC784I features the -2 speed grade, providing optimal balance between performance and power consumption for industrial applications. Available speed grades in the Zynq UltraScale+ family include -3, -2, and -1, with -3E devices offering highest performance.

Low-Power Operating Modes

For power-sensitive applications, -2LE variants can operate at reduced VCCINT voltage (0.72V or 0.85V), enabling lower static and dynamic power consumption while maintaining appropriate performance levels.


XCZU5CG-2SFVC784I Part Number Decoder

Understanding the part number structure helps identify device configuration:

Code Segment Meaning
XC Xilinx Commercial
ZU5 Zynq UltraScale+ Size 5
CG Cost-Optimized with GPU
-2 Speed Grade 2
S Lead-free (RoHS Compliant)
F Flip-Chip Package
VC Package Variant
784 Pin Count
I Industrial Temperature Grade

Development Tools and Design Software

Vivado Design Suite

AMD’s Vivado Design Suite provides comprehensive tools for XCZU5CG-2SFVC784I development, including synthesis, implementation, simulation, and debug capabilities. The integrated design environment streamlines the development workflow from concept to production.

PetaLinux and Vitis

Software development is supported through PetaLinux for Linux-based systems and Vitis unified software platform for bare-metal and RTOS applications. These tools enable rapid development of embedded software targeting the ARM processor subsystem.


Ordering Information and Availability

The AMD XCZU5CG-2SFVC784I is available through authorized distributors worldwide. The device ships in tray packaging suitable for automated assembly processes.

Parameter Detail
Manufacturer Part Number XCZU5CG-2SFVC784I
Manufacturer AMD (formerly Xilinx)
Product Category Embedded – System On Chip (SoC)
Device Family Zynq UltraScale+ MPSoC
RoHS Status Compliant
Moisture Sensitivity Level MSL-3

Why Choose the XCZU5CG-2SFVC784I?

The XCZU5CG-2SFVC784I represents an optimal choice for designers seeking a powerful, cost-effective solution combining:

  • Integrated Processing Power: Dual ARM Cortex-A53 and Cortex-R5F processors eliminate need for external processors
  • Flexible Programmable Logic: 256K+ logic cells enable custom hardware acceleration
  • High-Speed Connectivity: 12.5 Gb/s transceivers support modern communication standards
  • Industrial Reliability: Extended temperature range and proven 20nm FinFET technology
  • Scalable Architecture: Pin-compatible options within the Zynq UltraScale+ family enable design migration

For engineers developing next-generation embedded systems requiring heterogeneous computing capabilities, the AMD XCZU5CG-2SFVC784I delivers the performance, flexibility, and reliability demanded by industrial and commercial applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.