Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5CG-2SFVC784E: High-Performance Zynq UltraScale+ MPSoC for Advanced Embedded Applications

Product Details

The XCZU5CG-2SFVC784E is a powerful System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC family. This advanced programmable logic device combines dual ARM Cortex-A53 processors with flexible FPGA fabric, making it ideal for industrial automation, wireless communications, and edge computing applications.


XCZU5CG-2SFVC784E Overview and Key Features

The AMD XCZU5CG-2SFVC784E belongs to the CG (Compute Grade) subfamily of Zynq UltraScale+ devices. Built on 20nm FinFET technology, this SoC delivers exceptional performance while maintaining power efficiency. The “-2” speed grade designation indicates enhanced performance characteristics, and the “E” suffix denotes extended commercial temperature range operation.

Why Choose the XCZU5CG-2SFVC784E?

This Xilinx FPGA device offers a unique combination of heterogeneous processing power and programmable logic flexibility. Engineers benefit from the integration of application processors, real-time processors, and reconfigurable hardware in a single chip solution.


XCZU5CG-2SFVC784E Technical Specifications

General Device Information

Parameter Specification
Part Number XCZU5CG-2SFVC784E
Manufacturer AMD (formerly Xilinx)
Product Family Zynq UltraScale+ MPSoC
Device Subfamily CG (Compute Grade)
Process Technology 20nm FinFET
Speed Grade -2 (High Performance)
Temperature Range Extended Commercial (0°C to +100°C)

Processing System (PS) Specifications

Component Details
Application Processor Unit (APU) Dual-core ARM Cortex-A53 MPCore with CoreSight
APU Maximum Frequency Up to 1.3 GHz
Real-Time Processor Unit (RPU) Dual-core ARM Cortex-R5 with CoreSight
RPU Maximum Frequency Up to 533 MHz
Architecture 64-bit ARMv8-A (APU), 32-bit ARMv7-R (RPU)
On-Chip Memory (OCM) 256 KB
Cache Memory 32KB L1 I-Cache + 32KB L1 D-Cache per A53 core; 1MB L2 Cache shared

Programmable Logic (PL) Specifications

Resource Quantity
System Logic Cells 256,200
CLB Flip-Flops 234,240
CLB LUTs 117,120
Block RAM 7.6 Mb
UltraRAM 0 Mb
DSP Slices 1,248

Package and Electrical Characteristics

Parameter Value
Package Type 784-Ball FCBGA
Package Dimensions 23mm x 23mm
Ball Pitch 0.8mm
Core Voltage (VCCINT) 0.85V
Maximum User I/O 252
PS-GTR Transceivers 4

XCZU5CG-2SFVC784E Key Features and Capabilities

Dual ARM Cortex-A53 Application Processing Unit

The XCZU5CG-2SFVC784E features a powerful dual-core ARM Cortex-A53 APU running at up to 1.3 GHz. This 64-bit processor supports ARMv8-A architecture with advanced SIMD (NEON) extensions, providing excellent performance for Linux-based applications and complex computational workloads.

Dual ARM Cortex-R5 Real-Time Processing Unit

For deterministic, low-latency operations, the integrated dual-core ARM Cortex-R5 RPU delivers exceptional real-time performance at up to 533 MHz. This processor is ideal for safety-critical applications requiring predictable timing behavior.

Advanced Memory Architecture

The device incorporates a sophisticated memory subsystem including 256KB of on-chip memory (OCM), dedicated L1 and L2 caches, and support for external DDR4 memory interfaces. This architecture ensures high-bandwidth data movement between processing elements and programmable logic.

High-Speed Connectivity Options

The XCZU5CG-2SFVC784E includes four PS-GTR transceivers supporting multiple high-speed protocols including USB 3.0, SATA 3.1, DisplayPort, and PCIe Gen2. These integrated interfaces simplify system design and reduce external component count.


XCZU5CG-2SFVC784E Target Applications

Industrial Automation and Control

The combination of real-time processing and programmable logic makes the XCZU5CG-2SFVC784E ideal for motor control, industrial networking, and factory automation systems requiring deterministic response times.

Wireless Communications Infrastructure

5G small cells, software-defined radio (SDR), and wireless backhaul equipment benefit from the device’s signal processing capabilities and flexible connectivity options.

Edge Computing and IoT Gateway

Deploy machine learning inference at the edge with the XCZU5CG-2SFVC784E’s processing power and programmable acceleration. The device supports TensorFlow Lite and other ML frameworks for intelligent edge applications.

Medical and Healthcare Equipment

Medical imaging systems, patient monitoring devices, and diagnostic equipment leverage the SoC’s processing performance and real-time capabilities for critical healthcare applications.

Aerospace and Defense Systems

Radar signal processing, electronic warfare systems, and avionics applications utilize the XCZU5CG-2SFVC784E’s computational density and reconfigurable architecture.


XCZU5CG-2SFVC784E Development Tools and Software Support

Vivado Design Suite

AMD’s Vivado Design Suite provides comprehensive FPGA development capabilities including synthesis, implementation, and debug tools optimized for UltraScale+ architecture.

Vitis Unified Software Platform

The Vitis platform enables software developers to create embedded applications for the ARM processors and accelerated functions for the programmable logic using familiar programming languages like C, C++, and Python.

PetaLinux Development Tools

Build customized Linux distributions for the XCZU5CG-2SFVC784E using AMD’s PetaLinux tools, simplifying operating system development and application deployment.


XCZU5CG-2SFVC784E Part Number Decoder

Understanding the XCZU5CG-2SFVC784E part number helps identify device capabilities:

Code Meaning
XC Xilinx Commercial
ZU5 Zynq UltraScale+ Size 5
CG Compute Grade (Dual A53, no GPU)
-2 Speed Grade 2 (High Performance)
SF Lead-free Flip-Chip
VC Ball Configuration
784 784-Ball Package
E Extended Temperature Range

XCZU5CG-2SFVC784E Ordering Information

Parameter Details
Manufacturer Part Number XCZU5CG-2SFVC784E
Packaging Tray
RoHS Status Compliant
Lead-Free Status Lead-Free
ECCN 3A991.A.2
Product Status Active

Related Zynq UltraScale+ MPSoC Devices

Alternative Speed Grades

Part Number Speed Grade Temperature
XCZU5CG-1SFVC784E -1 (Standard) Extended
XCZU5CG-1SFVC784I -1 (Standard) Industrial
XCZU5CG-2SFVC784I -2 (High Performance) Industrial

Higher Performance Alternatives

Part Number Key Difference
XCZU5EG-2SFVC784E Adds Mali-400 MP2 GPU
XCZU7CG-2FFVC900E More logic cells, larger package
XCZU9CG-2FFVC900E Maximum logic density

Conclusion: XCZU5CG-2SFVC784E for Next-Generation Embedded Designs

The AMD XCZU5CG-2SFVC784E Zynq UltraScale+ MPSoC delivers an exceptional combination of processing performance, programmable flexibility, and power efficiency. With dual ARM Cortex-A53 and Cortex-R5 processors integrated with 256K system logic cells, this device enables innovative solutions across industrial, communications, and edge computing applications.

Engineers seeking a scalable, high-performance SoC platform will find the XCZU5CG-2SFVC784E offers the ideal balance of capabilities for demanding embedded applications requiring both deterministic real-time control and complex application processing.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.