Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XCZU5CG-2FBVB900I: Zynq UltraScale+ MPSoC FPGA IC

Product Details

The AMD XCZU5CG-2FBVB900I is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family. This advanced programmable logic device combines a powerful 64-bit ARM processing system with flexible FPGA fabric, making it ideal for embedded systems, industrial automation, and edge computing applications.


XCZU5CG-2FBVB900I Key Features and Overview

The XCZU5CG-2FBVB900I integrates a feature-rich processing system (PS) with programmable logic (PL) based on the UltraScale architecture. This SoC delivers exceptional performance-per-watt efficiency, making it a preferred choice for engineers designing next-generation embedded platforms.

ARM Cortex-A53 and Cortex-R5 Dual-Core Processing System

The processing subsystem features:

  • Dual-core ARM Cortex-A53 MPCore with CoreSight technology operating at up to 1.2GHz
  • Dual-core ARM Cortex-R5 real-time processors with CoreSight for deterministic, low-latency operations
  • 256KB on-chip RAM for fast data access
  • Hardware coherency for efficient multi-processor communication

XCZU5CG-2FBVB900I Technical Specifications

Parameter Specification
Manufacturer AMD (Xilinx)
Part Number XCZU5CG-2FBVB900I
Family Zynq UltraScale+ MPSoC
Device Type CG (Cost-optimized Grade)
Logic Cells 256,200
Process Technology 16nm FinFET+
Core Voltage (VCCINT) 0.85V
Speed Grade -2
Temperature Grade Industrial (-40°C to +100°C TJ)
Package Type 900-FCBGA (31mm × 31mm)
Ball Pitch 1.0mm
Mounting Type Surface Mount

Programmable Logic (PL) Resources

The XCZU5CG-2FBVB900I offers extensive programmable logic resources built on the UltraScale architecture.

Configurable Logic Block (CLB) Architecture

Resource Description
CLB Structure 8 LUTs + 16 Flip-Flops per CLB
LUT Configuration 6-input LUT or dual 5-input LUTs
Slice Types SLICEL and SLICEM
Distributed RAM 64-bit RAM per LUT (SLICEM)
Shift Registers 32-bit SRL per LUT (SLICEM)

DSP and Memory Blocks

Feature Specification
DSP Slices 27×18 Multipliers with pre-adder
Block RAM 36Kb blocks with FIFO and ECC
UltraRAM 4K×72 high-density memory blocks
Distributed RAM Configurable from CLB LUTs

I/O and Connectivity Features

High-Speed Serial Transceivers

The XCZU5CG-2FBVB900I includes PS-GTR transceivers supporting multiple protocols:

Interface Data Rate
USB 3.0 5Gb/s
SATA 3.1 6Gb/s
DisplayPort 1.2 5.4Gb/s
PCIe Gen2 5Gb/s

Peripheral Connectivity Options

  • CANbus interface for automotive and industrial networks
  • Gigabit Ethernet with IEEE 1588 support
  • USB 2.0/3.0 OTG controllers
  • Multiple SPI, I2C, and UART interfaces
  • SD/SDIO/eMMC memory card support

Zynq UltraScale+ MPSoC Architecture Benefits

Why Choose the XCZU5CG-2FBVB900I for Your Design?

The Zynq UltraScale+ MPSoC architecture delivers significant advantages over traditional FPGA-only or processor-only solutions:

Heterogeneous Computing Power: The combination of ARM Cortex-A53 application processors and Cortex-R5 real-time processors enables parallel execution of Linux-based applications and time-critical control loops.

SmartConnect Interconnect Technology: Optimized interconnect between processing blocks delivers 20-30% better performance per watt compared to conventional bus architectures.

Power Domain Isolation: The PS and PL operate on separate power domains, enabling independent power management and the ability to power down unused sections for energy efficiency.

Software-First Boot: The processing system boots first, enabling a software-centric configuration approach similar to standard ASSPs.


XCZU5CG-2FBVB900I Package Information

Attribute Value
Package Code FBVB900
Pin Count 900
Package Style FCBGA (Flip Chip Ball Grid Array)
Dimensions 31mm × 31mm
Ball Pitch 1.0mm
Package Type Tray

Development Tools and Software Support

Vivado Design Suite Compatibility

The XCZU5CG-2FBVB900I is fully supported by AMD’s Vivado Design Suite, which provides:

  • Integrated synthesis and implementation tools
  • IP Integrator for block-based design
  • System Debugger for hardware/software co-debugging
  • High-Level Synthesis (HLS) for C/C++ to RTL conversion

Operating System Support

  • Linux (PetaLinux, Yocto Project)
  • FreeRTOS for real-time applications
  • Bare-metal programming for Cortex-R5 cores

Ideal Applications for XCZU5CG-2FBVB900I

The XCZU5CG-2FBVB900I SoC FPGA is optimized for applications requiring both high-performance processing and hardware acceleration:

  • Industrial Automation: Motor control, PLC, and industrial IoT gateways
  • Embedded Vision: Machine learning inference and image processing
  • Medical Equipment: Ultrasound imaging and patient monitoring systems
  • Aerospace & Defense: Radar signal processing and secure communications
  • Telecommunications: 5G base stations and network equipment
  • Test & Measurement: High-speed data acquisition systems

Ordering Information and Part Number Breakdown

XCZU5CG-2FBVB900I part number structure:

Segment Meaning
XC Xilinx Commercial
ZU5 Zynq UltraScale+ Size 5
CG Cost-optimized Grade (no GPU)
-2 Speed Grade 2
F Flip Chip Package
BVB Ball Configuration
900 900 Balls
I Industrial Temperature Range

Buy XCZU5CG-2FBVB900I from Trusted Distributors

When sourcing the AMD XCZU5CG-2FBVB900I for your embedded design project, ensure you purchase from authorized distributors to guarantee authentic components and full manufacturer support.

For a comprehensive selection of Xilinx FPGA products including the Zynq UltraScale+ MPSoC family, visit Xilinx FPGA to explore available inventory and competitive pricing.


Conclusion: XCZU5CG-2FBVB900I Zynq UltraScale+ MPSoC Summary

The AMD XCZU5CG-2FBVB900I represents a powerful combination of ARM-based processing and FPGA flexibility in a single 900-pin FCBGA package. With 256,200 logic cells, dual Cortex-A53 and Cortex-R5 processors, and comprehensive I/O options, this Zynq UltraScale+ MPSoC delivers the performance and integration needed for demanding embedded applications.

Whether you’re developing industrial control systems, edge AI platforms, or high-reliability medical devices, the XCZU5CG-2FBVB900I provides the scalable, power-efficient architecture to accelerate your time-to-market.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.