The AMD XCZU5CG-2FBVB900E is a high-performance System-on-Chip (SoC) from the renowned Zynq UltraScale+ MPSoC family. This advanced programmable logic device combines the flexibility of FPGA fabric with powerful ARM Cortex processors, making it an ideal choice for industrial automation, embedded vision, sensor fusion, and edge computing applications. As a leading Xilinx FPGA solution, this component delivers exceptional processing power and versatility for demanding embedded designs.
XCZU5CG-2FBVB900E Key Features and Benefits
The XCZU5CG-2FBVB900E belongs to AMD’s dual-core CG variant series, optimized for industrial motor control and real-time sensor fusion applications. This Zynq UltraScale+ device provides 64-bit processor scalability while combining real-time control capabilities with programmable logic for maximum design flexibility.
Powerful Dual-Core ARM Processor Architecture
| Processor Component |
Specification |
| Application Processor |
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ |
| Real-Time Processor |
Dual ARM® Cortex™-R5 with CoreSight™ |
| APU Clock Speed |
Up to 1.5 GHz |
| RPU Clock Speed |
Up to 533 MHz |
| Processing System RAM |
256 KB |
XCZU5CG-2FBVB900E Technical Specifications
| Parameter |
Value |
| Manufacturer |
AMD (formerly Xilinx) |
| Part Number |
XCZU5CG-2FBVB900E |
| Product Family |
Zynq® UltraScale+™ MPSoC CG |
| Logic Cells |
256,200+ |
| Process Technology |
20nm / 16nm FinFET+ |
| Speed Grade |
-2 (Mid Speed) |
| Package Type |
900-FCBGA (Flip-Chip Ball Grid Array) |
| Package Dimensions |
31mm × 31mm |
| Ball Pitch |
1.0mm |
| I/O Pins |
204 |
| Core Voltage (VCCINT) |
0.85V |
XCZU5CG-2FBVB900E Electrical Characteristics
Understanding the electrical specifications is crucial for successful PCB design and system integration. The XCZU5CG-2FBVB900E offers excellent power efficiency while maintaining high performance.
Operating Conditions
| Parameter |
Minimum |
Typical |
Maximum |
Unit |
| Operating Temperature (Tj) |
0 |
— |
100 |
°C |
| Core Supply Voltage |
0.82 |
0.85 |
0.88 |
V |
| Temperature Grade |
— |
Extended (E) |
— |
— |
Power and Performance Features
- Low Power Operation: Designed for power-sensitive embedded applications
- Programmable Power Management: Dynamic voltage and frequency scaling support
- Thermal Management: Optimized for extended temperature range operation
- Speed Grade -2: Balanced performance-to-power ratio
Zynq UltraScale+ MPSoC CG Series Connectivity Options
The XCZU5CG-2FBVB900E integrates comprehensive connectivity interfaces for versatile system design.
Integrated Peripheral Interfaces
| Interface Type |
Description |
| USB |
USB OTG Support |
| Ethernet |
Gigabit Ethernet MAC |
| CAN Bus |
Industrial CAN Communication |
| SPI |
Serial Peripheral Interface |
| I²C |
Inter-Integrated Circuit |
| UART/USART |
Serial Communication |
| MMC/SD/SDIO |
Memory Card Interfaces |
| EBI/EMI |
External Memory Interface |
| DMA |
Direct Memory Access Controller |
| WDT |
Watchdog Timer |
AMD Zynq UltraScale+ XCZU5CG Target Applications
The XCZU5CG-2FBVB900E SoC FPGA is engineered for a wide range of industrial and embedded applications requiring both processing power and programmable logic flexibility.
Industrial Applications
- Motor Control Systems: Precision industrial motor drives
- Sensor Fusion: Multi-sensor data processing and integration
- Industrial IoT: Edge computing and gateway applications
- Factory Automation: PLC and motion control systems
- Process Control: Real-time monitoring and control systems
Embedded Vision and AI
- Machine Vision: Camera-based inspection systems
- Edge AI Inference: On-device machine learning acceleration
- Real-Time Analytics: Low-latency data processing
- Surveillance Systems: Video processing and analytics
Communication Systems
- 5G Wireless Infrastructure: Baseband processing
- Software-Defined Radio: Flexible RF signal processing
- Network Appliances: Packet processing and routing
XCZU5CG-2FBVB900E Package and Ordering Information
Package Details
| Specification |
Details |
| Package Code |
FBVB900 |
| Package Style |
Flip-Chip Ball Grid Array |
| Pin Count |
900 Balls |
| Body Size |
31mm × 31mm |
| Ball Pitch |
1.0mm |
| Packaging Method |
Tray |
| Moisture Sensitivity Level |
MSL 4 (72 Hours) |
Compliance and Certifications
| Standard |
Status |
| RoHS 3 |
Compliant |
| REACH |
Unaffected |
| Lead-Free |
Yes |
| Halogen-Free |
Available |
Part Number Decoder for XCZU5CG-2FBVB900E
| Segment |
Meaning |
| XC |
Xilinx Commercial |
| ZU5 |
Zynq UltraScale+ Size 5 |
| CG |
Dual-Core (CG Variant) |
| -2 |
Speed Grade 2 |
| F |
Flip-Chip Package |
| BVB |
Package Variant |
| 900 |
900-Ball Package |
| E |
Extended Temperature Range |
Development Tools and Software Support
AMD provides comprehensive development tools for the XCZU5CG-2FBVB900E, ensuring rapid prototyping and efficient design workflows.
Recommended Development Environment
- Vivado Design Suite: Complete FPGA development platform
- Vitis Unified Software Platform: Embedded software development
- PetaLinux Tools: Linux-based OS development
- MATLAB/Simulink Support: Model-based design integration
Available Evaluation Kits
- ZCU102 Evaluation Kit
- ZCU104 Embedded Vision Kit
- UltraZed-EG Starter Kit
Why Choose AMD XCZU5CG-2FBVB900E for Your Design
The XCZU5CG-2FBVB900E offers several compelling advantages for embedded system designers:
- Heterogeneous Processing: Combines ARM processors with programmable logic
- Real-Time Performance: Dedicated Cortex-R5 cores for deterministic operations
- Scalable Architecture: Part of a comprehensive MPSoC family
- Long-Term Availability: AMD UltraScale+ products supported through 2045
- Comprehensive Ecosystem: Extensive development tools and reference designs
- Industrial Grade: Extended temperature range for harsh environments
XCZU5CG-2FBVB900E Availability and Lead Time
| Attribute |
Information |
| Product Status |
Active |
| Standard Lead Time |
52 Weeks |
| Lifecycle Status |
In Production |
| Minimum Order Quantity |
Contact Distributor |
Summary: AMD XCZU5CG-2FBVB900E Zynq UltraScale+ MPSoC
The AMD XCZU5CG-2FBVB900E represents an exceptional choice for engineers seeking a powerful, flexible System-on-Chip solution. With its dual ARM Cortex-A53 and Cortex-R5 processors, 256K+ logic cells, comprehensive peripheral integration, and 900-FCBGA package, this Zynq UltraScale+ MPSoC CG device delivers the performance and versatility required for next-generation industrial automation, embedded vision, and edge computing applications.
Whether you’re designing industrial motor control systems, implementing sensor fusion algorithms, or developing edge AI solutions, the XCZU5CG-2FBVB900E provides the processing power and programmable flexibility to bring your innovative designs to life.
