The AMD XCZU5CG-1FBVB900I is an advanced System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family, delivering exceptional processing power combined with programmable logic flexibility. This industrial-grade integrated circuit is engineered for demanding embedded applications requiring real-time control, sensor fusion, and motor control capabilities.
Product Overview: AMD Xilinx XCZU5CG-1FBVB900I Specifications
The XCZU5CG-1FBVB900I represents AMD’s commitment to high-performance heterogeneous computing. Built on advanced 20nm process technology, this MPSoC integrates dual ARM Cortex-A53 application processors with dual ARM Cortex-R5 real-time processors, providing a versatile platform for complex embedded system designs.
Key Features of the Zynq UltraScale+ XCZU5CG SoC
This programmable SoC offers an optimal balance of processing performance, programmable logic resources, and power efficiency for cost-sensitive industrial and commercial applications.
Technical Specifications
Processor Subsystem (PS)
| Specification |
Details |
| Application Processor |
Dual ARM Cortex-A53 MPCore with CoreSight |
| APU Clock Speed |
Up to 1.2 GHz |
| Real-Time Processor |
Dual ARM Cortex-R5 with CoreSight |
| RPU Clock Speed |
Up to 500 MHz |
| Architecture |
64-bit processing capability |
Programmable Logic (PL) Resources
| Resource |
Specification |
| Logic Cells |
256,200 (256K+) |
| Look-Up Tables (LUTs) |
117,120 |
| Flip-Flops |
234,240 |
| DSP Slices |
1,248 (27×18 multipliers) |
| Block RAM |
144 blocks |
| Block RAM Capacity |
7.6 Mb |
| UltraRAM Blocks |
64 |
| UltraRAM Capacity |
4.5 Mb |
Connectivity and I/O Features
| Interface |
Specification |
| GTH Transceivers |
16 channels |
| Transceiver Speed |
Up to 12.5 Gbps |
| PCIe Support |
Gen 2/Gen 3 x4 |
| HP I/O Pins |
156 High-Performance I/O |
| HD I/O Pins |
96 High-Density I/O |
| Ethernet MACs |
4 integrated MACs |
| USB Support |
USB 3.0 and USB 2.0 |
| DisplayPort |
Integrated support |
Package and Environmental Specifications
| Parameter |
Value |
| Package Type |
900-FCBGA (31×31 mm) |
| Ball Pitch |
1.0 mm |
| Pin Count |
900 pins |
| Operating Temperature |
-40°C to +100°C (Industrial) |
| Core Voltage (VCCINT) |
0.85V typical |
| Speed Grade |
-1 (Standard) |
| Process Technology |
20nm FinFET |
Applications for the AMD XCZU5CG-1FBVB900I
Industrial Motor Control and Automation
The CG variant of the Zynq UltraScale+ MPSoC family is specifically optimized for industrial motor control applications. The combination of dual Cortex-A53 processors for supervisory control and dual Cortex-R5 processors for real-time motor commutation makes this SoC ideal for servo drives, variable frequency drives (VFDs), and multi-axis motion control systems.
Sensor Fusion and Edge Computing
With 1,248 DSP slices and substantial programmable logic resources, the XCZU5CG-1FBVB900I excels in sensor fusion applications. Engineers can implement custom signal processing algorithms in the FPGA fabric while running sensor management software on the ARM processors.
Industrial Communication and Networking
The integrated Ethernet MACs, PCIe interface, and high-speed transceivers enable implementation of industrial protocols including EtherCAT, PROFINET, and Ethernet/IP. The device supports real-time industrial networking with deterministic latency requirements.
Test and Measurement Equipment
The high-speed transceiver channels and extensive DSP resources make this SoC suitable for automated test equipment (ATE), data acquisition systems, and instrumentation applications requiring high bandwidth and processing capability.
Why Choose the XCZU5CG-1FBVB900I for Your Design
Heterogeneous Processing Architecture
The integration of application processors, real-time processors, and programmable logic in a single device eliminates the need for multiple discrete components, reducing board complexity, power consumption, and overall system cost.
Industrial Temperature Grade
The -I suffix indicates industrial temperature grade operation (-40°C to +100°C), ensuring reliable performance in harsh environmental conditions common in factory automation, outdoor installations, and transportation applications.
Software Development Tools
The XCZU5CG-1FBVB900I is fully supported by AMD’s Vivado Design Suite for programmable logic development and Vitis unified software platform for embedded software development. This comprehensive toolchain accelerates time-to-market for complex SoC designs.
Pin-Compatible Options
The FBVB900 package offers pin compatibility with other devices in the Zynq UltraScale+ family, enabling scalable designs that can migrate between different logic and processing capabilities without PCB redesign.
Part Number Breakdown: XCZU5CG-1FBVB900I
Understanding the AMD part numbering convention:
- XC – Xilinx Commercial device
- ZU5 – Zynq UltraScale+ family, size 5
- CG – Cost-optimized device with dual Cortex-A53 (no GPU)
- -1 – Speed grade 1 (standard performance)
- FBVB – Package type (Fine-pitch BGA, variant B)
- 900 – Pin count (900 balls)
- I – Industrial temperature grade (-40°C to +100°C)
Ordering Information and Availability
The AMD XCZU5CG-1FBVB900I is available through authorized distributors worldwide. For design engineers seeking additional Xilinx FPGA options and related programmable logic devices, comprehensive product portfolios are available to meet diverse application requirements.
Related Part Numbers
| Part Number |
Description |
| XCZU5CG-1FBVB900E |
Extended commercial temperature (-40°C to +85°C) |
| XCZU5CG-2FBVB900I |
Speed grade 2, industrial temperature |
| XCZU5CG-1SFVC784I |
784-pin package variant |
| XCZU5EG-1FBVB900I |
Quad-core variant with Mali GPU |
Design Resources and Documentation
AMD provides comprehensive technical documentation for the XCZU5CG-1FBVB900I:
- DS891: Zynq UltraScale+ MPSoC Data Sheet Overview
- DS925: DC and AC Switching Characteristics
- UG1085: Zynq UltraScale+ Device Technical Reference Manual
- PG201: Processing System Configuration Guide
Summary
The AMD XCZU5CG-1FBVB900I delivers a powerful combination of ARM processing capability and UltraScale+ programmable logic in an industrial-grade package. With 256K+ logic cells, 1,248 DSP slices, dual Cortex-A53 and dual Cortex-R5 processors, this SoC provides the performance, flexibility, and reliability required for advanced industrial automation, motor control, and sensor fusion applications. The 900-pin FCBGA package and industrial temperature rating ensure robust operation in demanding environments.
