The AMD XCZU5CG-1FBVB900E is a high-performance System-on-Chip (SoC) from the Zynq UltraScale+ MPSoC family. This advanced programmable logic device combines powerful ARM Cortex processors with flexible FPGA fabric, making it ideal for industrial automation, wireless communications, and edge computing applications.
Key Features of the XCZU5CG-1FBVB900E
The XCZU5CG-1FBVB900E delivers exceptional processing power through its heterogeneous multiprocessor architecture. This Xilinx FPGA integrates both software programmability and hardware configurability in a single device.
Processing System Specifications
The processing system features dual-core ARM Cortex-A53 MPCore processors running at up to 1.2GHz. These 64-bit application processors support TrustZone security, NEON Advanced SIMD, and single/double precision floating-point operations. Additionally, the device includes dual-core ARM Cortex-R5 real-time processors operating at up to 500MHz for time-critical tasks.
Programmable Logic Resources
| Resource |
Specification |
| System Logic Cells |
256,200 |
| CLB Flip-Flops |
234,240 |
| CLB LUTs |
117,120 |
| DSP Slices |
1,248 |
| Block RAM |
5.1 Mb (144 blocks) |
| UltraRAM |
18.0 Mb (64 blocks) |
| Distributed RAM |
3.5 Mb |
High-Speed Connectivity Options
The XCZU5CG-1FBVB900E provides extensive connectivity through 16 GTH transceivers supporting data rates up to 16.3 Gb/s. The device includes PCIe Gen3 x16 capability, four PS-GTR transceivers for USB 3.0, SATA 3.1, DisplayPort 1.2a, and SGMII interfaces.
Package and Electrical Specifications
| Parameter |
Value |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Pin Count |
900 |
| Package Dimensions |
31mm x 31mm |
| Ball Pitch |
1.0mm |
| Core Voltage (VCCINT) |
0.85V |
| Speed Grade |
-1 (Standard) |
| Temperature Grade |
E (Extended: 0°C to +100°C) |
| Process Technology |
20nm FinFET |
Memory Interface Capabilities
The XCZU5CG-1FBVB900E supports multiple external memory standards including DDR4, DDR3, DDR3L, LPDDR3, and LPDDR4. The device features 256KB on-chip memory with ECC protection and supports up to 32GB of addressable external memory space.
Memory Controller Features
The multi-protocol dynamic memory controller supports both 32-bit and 64-bit interfaces with ECC support. Target data rates reach up to 2400 Mb/s for DDR4 operation, enabling high-bandwidth data processing applications.
I/O Configuration
| I/O Type |
Maximum Available |
| High-Performance (HP) I/O |
156 pins |
| High-Density (HD) I/O |
48 pins |
| PS-GTR Transceivers |
4 channels |
| GTH Transceivers |
16 channels |
| PS MIO Pins |
214 |
Peripheral Interfaces
The processing system includes comprehensive peripheral connectivity through dedicated I/O:
- Four Gigabit Ethernet MAC controllers with IEEE 1588 support
- Two USB 3.0/2.0 controllers
- Two SD/SDIO 3.0 controllers with eMMC 4.51 support
- Two CAN 2.0B interfaces
- Two SPI and two I2C controllers
- Two UART interfaces
- Quad-SPI flash controller
- NAND flash controller with 24-bit ECC
Applications and Use Cases
The XCZU5CG-1FBVB900E excels in demanding applications requiring both real-time processing and programmable hardware acceleration. Common applications include:
- Wireless communications and 5G infrastructure
- Industrial automation and control systems
- Medical imaging and diagnostic equipment
- Automotive driver assistance systems
- Video processing and machine vision
- Aerospace and defense electronics
- Data center acceleration
Development Tools and Software Support
AMD provides comprehensive development support through the Vivado Design Suite and Vitis unified software platform. The device supports PetaLinux for embedded Linux development and includes standalone drivers for all integrated peripherals.
Power Management Features
The XCZU5CG-1FBVB900E implements advanced power management through separate power domains. The Platform Management Unit (PMU) controls power gating for PS peripherals, power islands, and individual processor cores. The device supports multiple low-power modes including active power-down, self-refresh, and hibernation.
Security Features
Built-in security includes AES-256-GCM encryption, SHA-3/384 authentication, and RSA-4096 for secure boot operations. The Configuration Security Unit (CSU) manages secure device boot and runtime security monitoring.
Ordering Information
| Parameter |
Details |
| Manufacturer Part Number |
XCZU5CG-1FBVB900E |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Zynq UltraScale+ MPSoC |
| Device Series |
CG (Dual APU, Dual RPU) |
| RoHS Status |
Compliant |
| Packaging |
Tray |
Technical Documentation
For complete specifications, consult the Zynq UltraScale+ MPSoC Data Sheet (DS891) and the DC and AC Switching Characteristics document (DS925). Pin configuration details are available in the Packaging and Pinouts Product Specification User Guide.
