Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S50-5TQG144C Spartan-II FPGA: Complete Technical Guide and Specifications

Product Details

The AMD XC2S50-5TQG144C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, delivering exceptional flexibility and cost-effectiveness for embedded systems, telecommunications, and industrial automation applications. This programmable logic device combines 50,000 system gates with advanced features in a compact 144-pin TQFP package.

XC2S50-5TQG144C Key Features and Benefits

The XC2S50-5TQG144C offers engineers a powerful combination of performance, versatility, and value. Built on cost-effective 0.18-micron process technology, this FPGA provides unlimited reprogramming cycles through SRAM-based configuration. The device supports system performance up to 263 MHz, making it suitable for demanding digital signal processing and control applications.

Core Architecture Specifications

The XC2S50-5TQG144C features a robust internal architecture based on the proven Virtex FPGA design principles. The device includes 1,728 logic cells arranged in a 16×24 CLB (Configurable Logic Block) array, providing 384 total CLBs for implementing complex digital logic functions.

Specification Value
System Gates 50,000
Logic Cells 1,728
CLB Array 16 × 24 (384 total)
Maximum Frequency 263 MHz
Supply Voltage 2.375V – 2.625V (2.5V nominal)
Process Technology 0.18 µm
Package 144-Pin TQFP
Operating Temperature 0°C to +85°C (Commercial)

XC2S50-5TQG144C Memory Resources

Block RAM Configuration

The XC2S50-5TQG144C integrates 32 Kbits of dedicated Block RAM organized in 8 memory blocks. These dual-port RAM blocks support synchronous read and write operations with configurable data widths, enabling efficient buffering and data storage for signal processing applications.

Distributed RAM Capabilities

Beyond Block RAM, the device provides 24,576 bits of distributed RAM implemented within the CLB structure. Each Look-Up Table (LUT) can function as 16 bits of distributed RAM, offering designers flexible memory options for register files, FIFOs, and small lookup tables.

I/O Features and Standards Support

User I/O Configuration

The 144-pin TQFP package provides up to 92 user-configurable I/O pins (excluding four global clock inputs). The XC2S50-5TQG144C supports multiple I/O standards for seamless integration with various system interfaces.

Supported I/O Standards

The device accommodates 16 selectable I/O standards including LVTTL, LVCMOS (3.3V and 2.5V), PCI (3.3V and 5V tolerant), GTL, GTL+, HSTL (Class I, III, IV), SSTL3 (Class I, II), SSTL2 (Class I, II), CTT, and AGP. This versatility ensures compatibility with diverse peripheral devices and communication protocols.

Clock Management with Delay-Locked Loops

Four Integrated DLLs

The XC2S50-5TQG144C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide advanced clock management capabilities including clock deskewing, frequency multiplication (2×), frequency division (1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16×), and phase shifting.

Global Clock Distribution

Four primary low-skew global clock distribution networks ensure consistent clock delivery throughout the device. This architecture minimizes clock skew and supports high-speed synchronous designs operating at frequencies up to 200 MHz system-wide.

XC2S50-5TQG144C Configuration Options

Multiple Configuration Modes

The XC2S50-5TQG144C supports flexible configuration through several modes. Master Serial mode reads configuration data from an external serial PROM, while Slave Serial, Slave Parallel, and Boundary Scan (JTAG) modes allow external processors or controllers to load the bitstream.

Configuration Storage

Configuration data is stored in internal SRAM cells, enabling unlimited reprogramming cycles. The device requires approximately 559,200 configuration bits, which can be stored in compatible Platform Flash PROMs or other non-volatile memory devices.

Typical Applications for XC2S50-5TQG144C FPGA

Telecommunications Equipment

The XC2S50-5TQG144C excels in telecommunications applications including protocol converters, channel cards, access equipment, and wireless base station controllers. The combination of high-speed I/O and flexible logic enables implementation of custom communication interfaces.

Industrial Control Systems

For industrial automation, the device supports motor control algorithms, sensor interfaces, and real-time control loops. The multiple I/O standards allow direct interfacing with industrial sensors, actuators, and fieldbus networks.

Consumer Electronics

Cost-sensitive consumer applications benefit from the XC2S50-5TQG144C’s balance of performance and economy. Applications include video processing, audio systems, gaming peripherals, and smart home devices.

Embedded Computing

The FPGA serves as an ideal co-processor or peripheral controller in embedded systems, implementing custom interfaces, hardware accelerators, and glue logic that would otherwise require multiple discrete components.

XC2S50-5TQG144C Package Information

144-Pin TQFP Details

The device uses a 144-pin Thin Quad Flat Pack (TQFP) with 20mm × 20mm body dimensions and 0.5mm lead pitch. This surface-mount package offers excellent thermal characteristics and is compatible with standard pick-and-place assembly equipment.

Pin Categories

Pin Type Quantity
User I/O 92
Global Clock Inputs 4
Power Supply (VCCINT) Multiple
Power Supply (VCCO) Multiple
Ground Multiple
Configuration Multiple
JTAG 4

Development Tools and Software Support

Xilinx ISE Design Suite

The XC2S50-5TQG144C is fully supported by the Xilinx ISE Design Suite, which provides synthesis, implementation, and simulation tools. The software handles mapping, placement, and routing automatically, streamlining the design workflow from concept to configuration bitstream.

Design Entry Options

Engineers can enter designs using VHDL, Verilog, or schematic capture. The ISE tools support incremental design methodology, enabling rapid iteration and optimization of complex designs.

Part Number Decoding for XC2S50-5TQG144C

Understanding the part number helps identify the specific device variant:

  • XC2S50: Spartan-II device with 50,000 system gates
  • -5: Speed grade 5 (standard performance tier)
  • TQ: 144-pin Thin Quad Flat Pack
  • G: Pb-free (lead-free RoHS compliant) package
  • 144: Pin count
  • C: Commercial temperature range (0°C to +85°C)

Ordering and Availability

The AMD XC2S50-5TQG144C remains available through authorized distributors for legacy design support and repair applications. While AMD (formerly Xilinx) does not recommend this device for new designs, existing production requirements and replacement needs continue to be supported.

For comprehensive Xilinx FPGA product selection, current inventory, and competitive pricing, engineers can explore authorized distribution channels offering the complete Spartan-II family and newer FPGA generations.

Conclusion

The AMD XC2S50-5TQG144C Spartan-II FPGA delivers a proven combination of 50,000 system gates, 32 Kbits of Block RAM, four DLLs, and 92 user I/O pins in a cost-effective 144-pin TQFP package. With support for 16 I/O standards and operating frequencies up to 263 MHz, this FPGA continues to serve telecommunications, industrial, consumer, and embedded applications requiring flexible, reprogrammable logic solutions.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.