The AMD XC2S50-5FGG256I is an industrial-grade field-programmable gate array from the renowned Spartan-II FPGA family. This versatile programmable logic device delivers exceptional performance for cost-sensitive embedded systems, telecommunications equipment, and industrial automation applications. Manufactured using advanced 0.18-micron CMOS technology, this FPGA combines high logic density with reliable operation across extended temperature ranges.
XC2S50-5FGG256I Key Features and Benefits
The XC2S50-5FGG256I offers engineers a powerful combination of programmable logic resources and memory capabilities. The device features 50,000 system gates with 1,728 logic cells organized in 384 configurable logic blocks (CLBs). Operating at frequencies up to 263 MHz, this FPGA handles demanding digital signal processing and control applications with ease.
Engineers appreciate the unlimited reprogrammability that eliminates costly hardware revisions during product development. The device supports multiple configuration modes including Master Serial, Slave Serial, Slave Parallel, and Boundary Scan (JTAG), providing flexibility for various system architectures.
XC2S50-5FGG256I Technical Specifications
| Parameter |
Specification |
| Part Number |
XC2S50-5FGG256I |
| Manufacturer |
AMD (formerly Xilinx) |
| Family |
Spartan-II |
| System Gates |
50,000 |
| Logic Cells |
1,728 |
| CLBs (Configurable Logic Blocks) |
384 (16 x 24 array) |
| Maximum Frequency |
263 MHz |
| Speed Grade |
-5 |
| User I/O Pins |
176 maximum |
| Package Type |
256-Ball FBGA (Fine-Pitch Ball Grid Array) |
| Core Voltage |
2.5V |
| I/O Voltage |
1.5V, 2.5V, or 3.3V |
| Operating Temperature |
-40°C to +100°C (Industrial) |
| Process Technology |
0.18 µm CMOS |
| Mounting Type |
Surface Mount |
| RoHS Compliant |
Yes (Pb-free package) |
Memory Resources and SelectRAM Technology
The XC2S50-5FGG256I incorporates Xilinx’s SelectRAM hierarchical memory architecture. This dual-memory approach provides designers with flexible on-chip storage options for various application requirements.
Block RAM Specifications
The device contains 32 Kbits of dedicated block RAM organized in eight 4,096-bit memory blocks. Each block RAM cell functions as a fully synchronous dual-ported RAM with independent control signals for each port. The configurable aspect ratios support data widths from 1 to 16 bits with corresponding depths from 4,096 to 256 locations.
Distributed RAM Capabilities
Beyond block RAM, the XC2S50-5FGG256I provides 24,576 bits of distributed RAM implemented within the look-up tables (LUTs). Each LUT can function as a 16 x 1-bit synchronous RAM, and two LUTs within a slice can combine to create 16 x 2-bit, 32 x 1-bit synchronous RAM, or 16 x 1-bit dual-port synchronous RAM configurations.
Clock Management with Delay-Locked Loops
Four dedicated Delay-Locked Loops (DLLs) provide advanced clock management capabilities. These fully digital circuits eliminate clock distribution delay and minimize clock skew throughout the device. The DLLs support clock multiplication (2x), clock division (by 1.5 to 16), and generate four quadrature phases of the source clock for precise timing control.
Versatile I/O Standards and Banking
The XC2S50-5FGG256I supports 16 high-performance I/O standards for seamless integration with various system interfaces. Eight I/O banks allow mixing different voltage standards within the same device.
Supported I/O Standards
- LVTTL (2-24 mA drive strength)
- LVCMOS (2.5V and 3.3V)
- PCI (3.3V, 33/66 MHz compliant)
- GTL and GTL+
- HSTL Class I, III, and IV
- SSTL2 and SSTL3 Class I and II
- CTT
- AGP-2X
Each output buffer can source up to 24 mA and sink up to 48 mA, with programmable slew rate control to minimize bus transients and electromagnetic interference.
Industrial Temperature Grade Reliability
The “I” suffix in XC2S50-5FGG256I indicates industrial-grade temperature operation from -40°C to +100°C junction temperature. This extended operating range makes the device suitable for harsh environment applications including automotive systems, outdoor telecommunications equipment, and industrial process control.
Development Tools and Design Support
The XC2S50-5FGG256I is fully supported by the Xilinx ISE development environment. This comprehensive toolchain provides automatic mapping, placement, and routing with timing-driven optimization. The unified library contains over 400 primitives and macros for rapid design implementation.
IEEE 1149.1-compatible boundary scan logic enables in-system testing and debugging. The JTAG interface supports EXTEST, SAMPLE/PRELOAD, BYPASS, and configuration instructions for comprehensive board-level verification.
XC2S50-5FGG256I Applications
This Spartan-II FPGA serves diverse market segments requiring cost-effective programmable logic solutions:
- Telecommunications infrastructure and network equipment
- Industrial automation and process control systems
- Automotive electronics and infotainment
- Consumer electronics and set-top boxes
- Medical instrumentation
- Aerospace and defense systems
- Digital signal processing applications
- Protocol conversion and interface bridging
Package Information and PCB Design
The 256-ball FBGA package measures 17 x 17 mm with a 1.0 mm ball pitch. The “G” in FGG256 indicates Pb-free (lead-free) construction compliant with RoHS environmental directives. Surface mount assembly requires standard reflow soldering processes with appropriate temperature profiles for BGA components.
Why Choose the XC2S50-5FGG256I
The XC2S50-5FGG256I represents an optimal balance of performance, features, and cost for mid-range FPGA applications. Its proven Spartan-II architecture, combined with industrial-grade reliability and comprehensive development tool support, accelerates time-to-market while reducing development risk.
Unlike mask-programmed ASICs, this FPGA eliminates high initial design costs and lengthy development cycles. Field programmability enables design upgrades without hardware replacement, extending product lifecycles and reducing inventory obsolescence risks.
For engineers seeking reliable Xilinx FPGA solutions, the XC2S50-5FGG256I delivers the programmable logic capabilities needed for successful product development across telecommunications, industrial, automotive, and embedded computing applications.
Ordering Information
When ordering the XC2S50-5FGG256I, verify the complete part number to ensure correct specifications:
- XC2S50: Device type (50K system gate Spartan-II)
- -5: Speed grade (standard performance)
- FGG: 256-ball Fine-Pitch BGA, Pb-free package
- 256: Pin count
- I: Industrial temperature range (-40°C to +100°C)
Contact authorized distributors for current pricing, availability, and volume discount information.
