The AMD XC2S200-6FGG675C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This powerful programmable logic device delivers exceptional flexibility, cost-effectiveness, and reliability for demanding digital design applications. Whether you’re developing communication systems, industrial automation solutions, or embedded control applications, the XC2S200-6FGG675C provides the ideal combination of logic capacity, I/O resources, and processing performance.

Key Features of the AMD XC2S200-6FGG675C FPGA

The XC2S200-6FGG675C represents the flagship device in the Spartan-II FPGA family, offering the highest gate density and most extensive I/O capabilities within this product line. Built on proven 0.18-micron CMOS technology, this FPGA combines robust performance with exceptional power efficiency.

Core Specifications and Logic Resources

Speed Grade -6 Performance Advantage

The XC2S200-6FGG675C features the -6 speed grade, which is the higher performance option available exclusively for commercial temperature range applications (0°C to +85°C). This speed grade enables system clock rates up to 200 MHz, making it suitable for high-throughput digital processing applications that demand maximum performance from the Spartan-II architecture.

Spartan-II FPGA Architecture Overview

The AMD XC2S200-6FGG675C inherits the advanced architecture that has made the Spartan-II family a preferred choice for cost-sensitive, high-volume applications.

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG675C consists of 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB contains four logic cells (LCs), providing the building blocks for implementing custom digital circuits. The CLBs feature:

• 4-Input Look-Up Tables (LUTs): Each function generator can implement any Boolean function of four inputs
• Dedicated Flip-Flops: Edge-triggered D-type flip-flops or level-sensitive latches
• Fast Carry Logic: Dedicated resources for high-speed arithmetic operations
• Cascade Chains: Enable efficient implementation of wide-input functions
• Multiplexer Support: F5 and F6 multiplexers for 5-input and 6-input function generation

SelectRAM Hierarchical Memory System

The XC2S200-6FGG675C offers a flexible dual-memory architecture:

Distributed RAM (75,264 bits):

• 16 bits per LUT configuration
• Ideal for small, fast memory structures
• Can be configured as single-port or dual-port RAM
• 16-bit shift register capability for DSP applications

Block RAM (56 Kbits):

• 14 dedicated 4,096-bit memory blocks
• Fully synchronous dual-port operation
• Configurable aspect ratios: 4096×1, 2048×2, 1024×4, 512×8, 256×16
• Independent control signals for each port
• Built-in bus-width conversion capability

Delay-Locked Loop (DLL) Clock Management

The XC2S200-6FGG675C integrates four dedicated Delay-Locked Loops for advanced clock management:

• Zero-Delay Clock Distribution: Eliminates clock distribution skew
• Clock Multiplication: 2× clock frequency multiplication
• Clock Division: Divide-by ratios of 1.5, 2, 2.5, 3, 4, 5, 8, and 16
• Quadrature Phase Generation: 0°, 90°, 180°, and 270° clock phases
• Clock Mirroring: Board-level clock de-skewing for multi-FPGA systems

Input/Output Block (IOB) Capabilities

Versatile I/O Standards Support

The XC2S200-6FGG675C provides comprehensive support for 16 high-performance I/O signaling standards, enabling seamless integration with diverse system components:

I/O Banking Architecture

The device organizes I/O pins into eight independent banks, allowing different voltage standards to coexist on the same chip. Each bank features:

• Multiple VCCO power pins for output voltage selection
• Shared VREF pins for input threshold voltage
• Independent configuration for maximum design flexibility

IOB Register Features

Each I/O block contains three configurable registers:

• Input Register: Captures incoming data with optional delay matching
• Output Register: Synchronizes outgoing data
• 3-State Control Register: Manages output enable timing
• Clock Enable (CE): Individual enable control for each register
• Set/Reset: Configurable as synchronous or asynchronous

FGG675 Package Specifications

The XC2S200-6FGG675C utilizes a 675-ball Fine-Pitch Ball Grid Array (FGG675) package, optimized for high-density board layouts and thermal performance.

Package Characteristics

Thermal Considerations

The FGG675 package provides excellent thermal dissipation characteristics, essential for maintaining reliable operation across the commercial temperature range. Proper PCB design with adequate ground planes and thermal vias ensures optimal heat transfer from the device.

Configuration and Programming Options

The XC2S200-6FGG675C supports multiple configuration modes to accommodate various system architectures:

Configuration Modes

Configuration File Size

The XC2S200 requires a configuration bitstream of 1,335,840 bits (approximately 167 KB), which can be stored in standard serial or parallel PROMs, flash memory, or delivered from a microprocessor or other intelligent controller.

In-System Programmability

The XC2S200-6FGG675C supports unlimited reprogramming cycles, enabling:

• Field upgrades without hardware modification
• Design iteration during development
• Multiple personality configurations
• Dynamic reconfiguration applications

Application Areas for the XC2S200-6FGG675C

The combination of high logic density, versatile I/O, and cost-effectiveness makes the XC2S200-6FGG675C ideal for numerous applications across multiple industries.

Telecommunications and Networking

• Protocol conversion and bridging
• Network interface controllers
• Channel coding and decoding
• Data encryption and security modules
• Base station processing

Industrial Automation

• Motor control systems
• Process control interfaces
• Sensor data acquisition
• Factory automation controllers
• Machine vision preprocessing

Consumer Electronics

• Digital video processing
• Audio signal processing
• Display controllers
• Gaming and multimedia systems
• Set-top box applications

Embedded Systems

• Custom peripheral controllers
• Bus interface adapters
• Co-processor implementations
• State machine controllers
• Glue logic consolidation

Design Tools and Development Support

ISE Design Suite Compatibility

The XC2S200-6FGG675C is fully supported by the Xilinx ISE Design Suite, providing:

• Automatic mapping, placement, and routing
• Timing-driven optimization
• Comprehensive simulation capabilities
• Static timing analysis
• In-circuit debugging with readback

HDL Design Entry

The device supports industry-standard hardware description languages:

• Verilog HDL
• VHDL
• Mixed-language designs
• Schematic capture integration

IP Core Library

Access to an extensive library of pre-verified IP cores including:

• Arithmetic functions (adders, multipliers, accumulators)
• Memory controllers
• Communication interfaces
• Digital signal processing blocks
• Standard bus interfaces

Ordering Information and Part Number Decoder

Part Number Structure: XC2S200-6FGG675C

Temperature Grade Options

• C (Commercial): 0°C to +85°C operating temperature
• I (Industrial): -40°C to +100°C (available in -5 speed grade only)

Why Choose the AMD XC2S200-6FGG675C FPGA

The XC2S200-6FGG675C stands as a superior alternative to mask-programmed ASICs, offering compelling advantages for modern electronic design:

Cost-Effectiveness

• Zero NRE (Non-Recurring Engineering) costs
• No mask tooling charges
• Reduced inventory risk through programmability
• Lower total cost of ownership for medium-volume production

Time-to-Market Advantage

• Eliminates lengthy ASIC development cycles
• Rapid design iteration and debugging
• Immediate availability without fabrication delays
• Prototype-to-production continuity

Design Flexibility

• Field-upgradable logic for future enhancements
• Multiple configuration personalities
• Design reuse across product generations
• Reduced obsolescence risk

Quality and Reliability

• Manufactured using mature 0.18 µm process technology
• Comprehensive qualification testing
• Proven track record in demanding applications
• Full IEEE 1149.1 boundary scan support for testability

Related Spartan-II FPGA Products

For applications requiring different resource configurations, consider these related Xilinx FPGA products from the Spartan-II family:

Technical Documentation and Resources

For comprehensive technical information on the XC2S200-6FGG675C, refer to:

• DS001: Spartan-II FPGA Family Data Sheet (all modules)
• Module 1: Introduction and Ordering Information
• Module 2: Functional Description and Architecture
• Module 3: DC and Switching Characteristics
• Module 4: Pinout Tables and Package Drawings

Conclusion

The AMD XC2S200-6FGG675C represents the pinnacle of the Spartan-II FPGA family, delivering maximum logic capacity, extensive memory resources, and comprehensive I/O capabilities in a high-density FGG675 package. With its -6 speed grade performance, 200,000 system gates, and support for 16 I/O standards, this FPGA provides the ideal platform for demanding digital design applications across telecommunications, industrial, consumer, and embedded markets.

The combination of unlimited reprogrammability, cost-effective manufacturing, and proven reliability makes the XC2S200-6FGG675C an excellent choice for designers seeking ASIC-replacement solutions with reduced risk and accelerated time-to-market. Whether you’re developing new products or upgrading existing designs, the XC2S200-6FGG675C offers the performance, flexibility, and value to meet your programmable logic requirements.