The AMD XC2S200-6FGG668C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This versatile programmable logic device delivers exceptional digital processing capabilities while maintaining cost-effectiveness for volume production. Engineers and designers seeking a reliable FPGA solution will find the XC2S200-6FGG668C ideal for telecommunications, industrial automation, and embedded system applications.
Key Features of the AMD XC2S200-6FGG668C Spartan-II FPGA
The XC2S200-6FGG668C stands as a flagship device in the Spartan-II product line. This FPGA combines advanced architecture with proven reliability, making it a preferred choice for demanding digital design projects. The device incorporates Xilinx’s second-generation ASIC replacement technology, offering unlimited reprogrammability without hardware replacement.
Core Architecture and Logic Resources
The XC2S200-6FGG668C features an impressive array of programmable logic resources:
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
The Configurable Logic Block (CLB) array provides the foundation for implementing complex digital designs. Each CLB contains multiple look-up tables (LUTs), flip-flops, and dedicated routing resources. This architecture enables efficient implementation of combinational and sequential logic circuits.
Memory Configuration and SelectRAM Technology
The AMD XC2S200-6FGG668C incorporates SelectRAM hierarchical memory architecture. This innovative memory system provides designers with flexible options for data storage and processing:
Distributed RAM Capabilities
The distributed RAM totals 75,264 bits, organized as 16 bits per LUT. This memory type excels in applications requiring small, fast memory blocks close to the logic elements. Distributed RAM offers single-port and dual-port configurations with synchronous write and asynchronous read capabilities.
Dedicated Block RAM Resources
Seven columns of 4-Kbit block RAM modules deliver 56 Kbits of high-speed embedded memory. These block RAM elements support various configurations including single-port, dual-port, and FIFO implementations. The block RAM operates independently of the logic resources, enabling concurrent data processing operations.
Technical Specifications for XC2S200-6FGG668C
Understanding the complete technical specifications helps engineers make informed design decisions. The XC2S200-6FGG668C delivers consistent performance across its operating range.
Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Process Technology |
0.18 µm CMOS |
| Speed Grade |
-6 (Fastest) |
| Maximum Frequency |
263 MHz |
The 2.5V core voltage ensures compatibility with modern low-power designs while the flexible I/O voltage range supports multiple interface standards. The advanced 0.18-micron CMOS fabrication process delivers excellent speed-power characteristics.
Package Information: 668-Pin Fine-Pitch BGA
The FGG668 package designation indicates a 668-ball Fine-Pitch Ball Grid Array with lead-free (Pb-free) construction. This RoHS-compliant package meets environmental regulations while providing:
- Excellent thermal dissipation characteristics
- Superior electrical performance
- Reliable solder joint integrity
- Compact PCB footprint for high-density designs
The “G” suffix confirms Pb-free ball composition, essential for environmentally conscious manufacturing processes.
Speed Grade Explanation
The “-6” speed grade represents the fastest performance tier in the Spartan-II family. This grade is exclusively available for commercial temperature range operation (0°C to 85°C). Designers requiring industrial temperature variants should consult alternative speed grades.
I/O Standards and Interface Flexibility
The XC2S200-6FGG668C supports 16 selectable I/O standards, providing unmatched interface flexibility. This Xilinx FPGA accommodates various signaling requirements within a single device.
Supported I/O Standards
The device supports both single-ended and differential signaling standards:
Single-Ended Standards:
- LVTTL (3.3V Low-Voltage TTL)
- LVCMOS (Low-Voltage CMOS) at 1.5V, 1.8V, 2.5V, and 3.3V
- PCI (3.3V and 5V compatible)
- GTL and GTL+
Differential Standards:
- LVDS (Low-Voltage Differential Signaling)
- BLVDS (Bus LVDS)
- LVPECL
This comprehensive I/O support enables direct interfacing with processors, memory devices, communication PHYs, and other system components without external level translation.
Delay-Locked Loop (DLL) Technology
Four Delay-Locked Loops position at each corner of the XC2S200-6FGG668C die. These DLLs provide essential clock management functions:
Clock Management Features
- Clock deskew and delay compensation
- Clock multiplication and division
- Phase shifting for timing optimization
- Low-jitter clock distribution
The DLLs eliminate clock distribution delays, ensuring synchronized operation across the entire FPGA fabric. This feature proves particularly valuable in high-speed synchronous designs.
Application Areas for AMD XC2S200-6FGG668C
The versatile architecture of the XC2S200-6FGG668C enables deployment across numerous application domains.
Telecommunications and Networking
Network infrastructure equipment leverages this FPGA for:
- Protocol processing and conversion
- Data packet routing and switching
- Physical layer interface implementation
- Quality of Service (QoS) management
Industrial Automation and Control
Manufacturing and process control systems utilize the device for:
- Motor drive control algorithms
- Sensor data acquisition and processing
- PLC functionality implementation
- Real-time monitoring systems
Consumer Electronics
Consumer products benefit from the FPGA’s capabilities in:
- Video and audio processing
- Display interface conversion
- Peripheral controller implementation
- Custom protocol bridges
Medical and Scientific Equipment
Precision instruments employ the XC2S200-6FGG668C for:
- Signal conditioning and filtering
- Data acquisition systems
- Image processing algorithms
- Instrument control logic
Design Tool Support and Development Environment
AMD (formerly Xilinx) provides comprehensive design tool support for the Spartan-II family. The ISE Design Suite offers complete development capabilities:
Supported Design Tools
| Tool |
Function |
| ISE WebPACK |
Free design entry and synthesis |
| ISE Foundation |
Advanced implementation features |
| ChipScope Pro |
On-chip debugging and analysis |
| CORE Generator |
Pre-verified IP core library |
The design environment supports multiple hardware description languages including VHDL, Verilog, and schematic capture methodologies.
Ordering Information and Part Number Breakdown
Understanding the AMD XC2S200-6FGG668C part number structure helps procurement and engineering teams:
| Segment |
Meaning |
| XC2S |
Spartan-II Family Identifier |
| 200 |
200K System Gate Density |
| -6 |
Speed Grade (Fastest) |
| FG |
Fine-Pitch BGA Package |
| G |
Pb-Free (Lead-Free) |
| 668 |
Pin Count |
| C |
Commercial Temperature (0°C to 85°C) |
Comparison with Alternative FPGA Solutions
The XC2S200-6FGG668C offers distinct advantages over competing solutions:
Benefits Over Mask-Programmed ASICs
- Zero NRE (Non-Recurring Engineering) costs
- Immediate design iteration capability
- Field upgradability without hardware changes
- Reduced time-to-market
- Lower risk for volume production
Advantages in Programmable Logic Market
- Proven architecture reliability
- Extensive documentation and support
- Wide distributor availability
- Competitive pricing for volume orders
- Long-term product availability
Quality and Compliance Standards
The XC2S200-6FGG668C meets stringent quality and environmental standards:
- RoHS Compliant (Pb-free version)
- ISO 9001 manufacturing certification
- Full JTAG boundary scan support
- IEEE 1149.1 compliance
Technical Support and Resources
Engineers working with the XC2S200-6FGG668C have access to extensive technical resources:
Available Documentation
- Complete datasheet (DS001)
- Package specifications and drawings
- Application notes and design guides
- Reference designs and evaluation boards
Online Support Channels
- Technical documentation portal
- Design example repositories
- Community forums and knowledge bases
- Direct technical support access
Conclusion: Why Choose AMD XC2S200-6FGG668C
The AMD XC2S200-6FGG668C Spartan-II FPGA delivers an optimal combination of performance, flexibility, and value. Its 200,000 system gates, 5,292 logic cells, and comprehensive I/O capabilities address demanding design requirements across multiple industries.
The -6 speed grade ensures maximum performance for timing-critical applications, while the lead-free FGG668 package meets modern environmental standards. Whether implementing complex telecommunications protocols, industrial control systems, or embedded processing solutions, the XC2S200-6FGG668C provides the programmable logic foundation for successful product development.
For volume pricing, technical samples, and availability information, contact authorized distributors or request a quotation through official procurement channels.
