The AMD XC2S200-6FGG660C is a high-performance Field-Programmable Gate Array (FPGA) from the renowned Spartan-II family, delivering exceptional logic density, versatile I/O capabilities, and cost-effective programmable solutions for demanding digital design applications. This device offers 200,000 system gates, 5,292 logic cells, and advanced clock management features in a robust Fine Pitch BGA package configuration.
Key Features of the XC2S200-6FGG660C FPGA
The XC2S200-6FGG660C represents the flagship device in the Spartan-II FPGA series, combining abundant logic resources with a rich feature set at an exceptionally competitive price point. Engineers and designers worldwide choose this Xilinx FPGA for applications requiring high-speed processing, flexible I/O interfacing, and unlimited reprogrammability.
Superior Performance Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Speed Grade |
-6 (High Performance) |
| Process Technology |
0.18 µm |
XC2S200-6FGG660C Architecture Overview
Configurable Logic Block (CLB) Structure
The XC2S200-6FGG660C features an advanced CLB architecture consisting of 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB contains four Logic Cells (LCs), organized into two identical slices, providing exceptional flexibility for implementing complex digital designs.
Logic Cell Components
Each Logic Cell within the XC2S200-6FGG660C includes:
- 4-Input Look-Up Table (LUT): Functions as a versatile function generator capable of implementing any 4-input Boolean function
- Carry Logic: Dedicated fast carry propagation for high-speed arithmetic operations
- Storage Element: Configurable as edge-triggered D-type flip-flop or level-sensitive latch
- Multiplexer Resources: F5 and F6 multiplexers for implementing functions up to 6 inputs
Memory Resources
The XC2S200-6FGG660C delivers comprehensive on-chip memory capabilities through two distinct memory architectures:
Distributed RAM
With 75,264 bits of distributed RAM, designers can implement shallow, fast memory structures directly within the CLB fabric. Each LUT can function as a 16 × 1-bit synchronous RAM, and two LUTs within a slice can combine to create:
- 16 × 2-bit synchronous RAM
- 32 × 1-bit synchronous RAM
- 16 × 1-bit dual-port synchronous RAM
Block RAM
The device incorporates 14 dedicated Block RAM modules, providing 56 Kbits of high-speed dual-port memory. Each 4,096-bit block RAM cell offers:
- Fully synchronous dual-port operation
- Independent control signals per port
- Configurable data widths (1, 2, 4, 8, or 16 bits)
- Built-in bus-width conversion capability
| Block RAM Configuration |
Address Bus |
Data Bus |
| 4096 × 1 |
ADDR[11:0] |
DATA[0] |
| 2048 × 2 |
ADDR[10:0] |
DATA[1:0] |
| 1024 × 4 |
ADDR[9:0] |
DATA[3:0] |
| 512 × 8 |
ADDR[8:0] |
DATA[7:0] |
| 256 × 16 |
ADDR[7:0] |
DATA[15:0] |
Advanced Clock Management Features
Delay-Locked Loop (DLL) Capabilities
The XC2S200-6FGG660C integrates four fully digital Delay-Locked Loops (DLLs), one at each corner of the die, providing sophisticated clock distribution and management capabilities:
- Zero Propagation Delay: Eliminates clock distribution delay throughout the device
- Low Clock Skew: Ensures minimal timing variation across all clock loads
- Clock Multiplication: Doubles the source clock frequency for time-domain multiplexing applications
- Clock Division: Divides source clock by factors of 1.5, 2, 2.5, 3, 4, 5, 8, or 16
- Quadrature Phase Generation: Provides 0°, 90°, 180°, and 270° phase outputs
Global Clock Distribution Network
Four dedicated global clock networks distribute high-fanout clock signals with minimal skew throughout the XC2S200-6FGG660C. The primary global routing resources include:
- Four global buffers (two at top center, two at bottom center)
- Dedicated clock pads adjacent to each global buffer
- Secondary backbone routing with 24 lines for flexible clock distribution
Versatile I/O Capabilities
Supported I/O Standards
The XC2S200-6FGG660C supports 16 high-performance interface standards, making it ideal for diverse system integration requirements:
| I/O Standard |
VREF (V) |
VCCO (V) |
VTT (V) |
| LVTTL (2-24 mA) |
N/A |
3.3 |
N/A |
| LVCMOS2 |
N/A |
2.5 |
N/A |
| PCI (3.3V/5V, 33/66 MHz) |
N/A |
3.3 |
N/A |
| GTL |
0.8 |
N/A |
1.2 |
| GTL+ |
1.0 |
N/A |
1.5 |
| HSTL Class I |
0.75 |
1.5 |
0.75 |
| HSTL Class III |
0.9 |
1.5 |
1.5 |
| HSTL Class IV |
0.9 |
1.5 |
1.5 |
| SSTL3 Class I/II |
1.5 |
3.3 |
1.5 |
| SSTL2 Class I/II |
1.25 |
2.5 |
1.25 |
| CTT |
1.5 |
3.3 |
1.5 |
| AGP-2X |
1.32 |
3.3 |
N/A |
I/O Banking Architecture
The XC2S200-6FGG660C organizes I/O resources into eight independent banks, with each edge of the device divided into two banks. This architecture allows:
- Mixed voltage operation across different banks
- Independent VCCO configuration per bank
- Flexible VREF voltage assignment within banks
- Hot-swap Compact PCI compatibility
Input/Output Block (IOB) Features
Three-Register Architecture
Each IOB in the XC2S200-6FGG660C contains three registers configurable as:
- Edge-triggered D-type flip-flops
- Level-sensitive latches
Output Driver Specifications
The programmable output buffers deliver robust drive capabilities:
- Source Current: Up to 24 mA
- Sink Current: Up to 48 mA
- Slew Rate Control: Programmable for bus transient minimization
- Drive Strength Control: Individual configuration per output
Input Path Features
- Optional delay element for zero pad-to-pad hold time
- Programmable input threshold using external VREF
- Pull-up and pull-down resistor options
- 5V tolerant capability (LVTTL, LVCMOS2, PCI modes)
Power Supply Requirements
Operating Voltages
| Supply |
Voltage |
Purpose |
| VCCINT |
2.5V |
Core logic power |
| VCCO |
1.5V / 2.5V / 3.3V |
I/O bank power (configurable) |
| VREF |
Standard-dependent |
Input reference voltage |
Configuration Options
The XC2S200-6FGG660C supports multiple configuration modes for maximum design flexibility:
Available Configuration Modes
- Master Serial Mode: FPGA generates CCLK, drives external PROM
- Slave Serial Mode: External source provides CCLK for daisy-chain configurations
- Slave Parallel Mode: Byte-wide data loading at up to 66 MHz
- Boundary-Scan Mode: IEEE 1149.1 JTAG configuration via TAP
Configuration File Size
The complete configuration bitstream for the XC2S200-6FGG660C requires 1,335,840 bits of storage.
Boundary Scan Support
The XC2S200-6FGG660C implements full IEEE 1149.1 boundary scan compliance with supported instructions including:
- EXTEST
- SAMPLE/PRELOAD
- BYPASS
- IDCODE
- USERCODE
- CFG_IN/CFG_OUT (for JTAG configuration/readback)
- INTEST
- JSTART
XC2S200-6FGG660C Applications
The exceptional performance and versatility of the XC2S200-6FGG660C make it ideal for:
- Telecommunications Equipment: High-speed serial interfaces and protocol processing
- Industrial Control Systems: Real-time signal processing and motor control
- Medical Instrumentation: Data acquisition and imaging systems
- Consumer Electronics: Video processing and display controllers
- Automotive Systems: Sensor fusion and communication interfaces
- Aerospace and Defense: Secure communications and radar processing
- Test and Measurement: High-speed data capture and analysis
Development Tool Support
The XC2S200-6FGG660C is fully supported by the Xilinx ISE Development System, providing:
- Automatic mapping, placement, and routing
- Timing-driven implementation
- Comprehensive simulation and verification
- In-circuit debugging capabilities
- Static timing analysis
Ordering Information
Part Number Breakdown
XC2S200-6FGG660C
| Segment |
Description |
| XC2S200 |
Device type (Spartan-II, 200K gates) |
| -6 |
Speed grade (higher performance) |
| FGG |
Package type (Fine Pitch BGA, Pb-free) |
| 660 |
Pin count |
| C |
Temperature range (Commercial: 0°C to +85°C) |
Summary
The AMD XC2S200-6FGG660C delivers an outstanding combination of performance, features, and value for FPGA-based designs. With 200,000 system gates, 5,292 logic cells, 56 Kbits of block RAM, and support for 16 I/O standards, this Spartan-II FPGA provides designers with a powerful, flexible platform for implementing complex digital systems. The -6 speed grade ensures optimal performance for demanding applications, while the comprehensive development tool support streamlines the design process from concept to production.
