Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG658C FPGA: High-Performance Spartan-II Programmable Logic Device

Product Details

The AMD XC2S200-6FGG658C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance for digital signal processing, embedded systems, and industrial automation applications. With 200,000 system gates, 5,292 logic cells, and a high-speed -6 speed grade, the XC2S200-6FGG658C offers engineers a cost-effective solution for complex digital designs.


Key Features of the XC2S200-6FGG658C Spartan-II FPGA

The XC2S200-6FGG658C combines flexible architecture with robust performance capabilities. This FPGA utilizes advanced 0.18-micron CMOS technology to deliver reliable operation across demanding applications.

Core Architecture Specifications

Parameter Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Speed Grade -6 (Highest Performance)

Memory Resources

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56 Kbits (14 blocks)
Total RAM Bits 57,344 bits

The dual-port block RAM architecture enables simultaneous read and write operations, making the XC2S200-6FGG658C ideal for high-bandwidth data buffering applications.


Technical Specifications and Electrical Characteristics

Understanding the electrical parameters of the XC2S200-6FGG658C ensures optimal design integration and reliable system performance.

Operating Voltage Requirements

Voltage Rail Specification
Core Voltage (VCCINT) 2.5V (2.375V – 2.625V)
I/O Voltage (VCCO) 1.5V / 2.5V / 3.3V (Selectable)

Package Information

Attribute Description
Package Type Fine-Pitch Ball Grid Array (FBGA)
Pin Count 658 Pins
Package Code FGG658
Mounting Type Surface Mount
RoHS Status Compliant (Lead-Free)

The “G” designation in the part number indicates Pb-free (lead-free) packaging, ensuring compliance with international environmental standards including RoHS and REACH directives.


Advanced Clocking and Timing Features

Delay-Locked Loop (DLL) Technology

The XC2S200-6FGG658C incorporates four dedicated Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:

  • Clock Deskewing – Eliminates clock distribution delays for synchronized operation
  • Clock Multiplication/Division – Generates multiple clock frequencies from a single source
  • Phase Shifting – Enables fine-tuning of clock phases for timing optimization
  • Clock Mirroring – Supports board-level clock synchronization across multiple devices

High-Speed Performance

Timing Parameter Value
Maximum System Frequency Up to 263 MHz
Pin-to-Pin Delay 5 ns (Typical)
Global Clock Networks 4 Primary + 24 Secondary

Configurable Logic Block (CLB) Architecture

Each CLB in the XC2S200-6FGG658C contains two slices, and each slice includes:

  • Two 4-input Look-Up Tables (LUTs) – Implement any combinatorial logic function
  • Two Dedicated Flip-Flops – Provide registered outputs with programmable set/reset
  • Fast Carry Logic – Enables efficient arithmetic operations
  • Distributed RAM Capability – Allows LUTs to function as 16×1 RAM cells

Routing Architecture

The XC2S200-6FGG658C features a hierarchical routing structure optimized for performance:

  • Direct Connections – High-speed paths between adjacent CLBs
  • General Routing Matrix (GRM) – Flexible interconnects for complex routing
  • Long Lines – Span the entire chip for low-skew signal distribution
  • Hex Lines – Provide efficient mid-range connections

Input/Output Block (IOB) Capabilities

Supported I/O Standards

The XC2S200-6FGG658C supports multiple I/O standards for seamless interface compatibility:

I/O Standard Voltage Level
LVTTL 3.3V
LVCMOS 2.5V / 3.3V
PCI (33 MHz) 3.3V / 5V Tolerant
GTL+ 1.5V
SSTL2 / SSTL3 DDR Memory Interface
HSTL High-Speed Transceiver Logic

I/O Features

  • Programmable Slew Rate Control – Reduces EMI and power consumption
  • Programmable Pull-Up/Pull-Down Resistors – Simplifies board design
  • 3-State Output Control – Enables bidirectional bus connections
  • Input Delay Elements – Provides hold time margin for system interfaces

Target Applications for the XC2S200-6FGG658C

The versatile XC2S200-6FGG658C is an excellent choice for numerous high-performance applications:

Industrial and Automation

  • Programmable Logic Controllers (PLCs)
  • Motor control systems
  • Factory automation equipment
  • Process monitoring systems

Communications Infrastructure

  • Network switches and routers
  • Protocol conversion bridges
  • Base station controllers
  • Fiber optic transceivers

Consumer Electronics

  • Set-top boxes
  • Digital displays
  • Gaming peripherals
  • Audio/video processing systems

Automotive Systems

  • Infotainment systems
  • Advanced Driver Assistance Systems (ADAS)
  • Instrument clusters
  • Body control modules

Medical Equipment

  • Patient monitoring devices
  • Diagnostic imaging systems
  • Laboratory instrumentation
  • Portable medical devices

Configuration and Programming Options

The XC2S200-6FGG658C supports multiple configuration modes for flexible system design:

Configuration Methods

Mode Description
Master Serial FPGA controls configuration clock
Slave Serial External controller provides clock
Master Parallel 8-bit parallel data interface
Slave Parallel External processor controls configuration
Boundary Scan (JTAG) IEEE 1149.1 compliant programming

Configuration Storage Solutions

Compatible configuration storage options include:

  • Platform Flash In-System Programmable PROMs
  • Serial Flash Memory
  • Parallel Flash Memory
  • Microprocessor-based configuration

Design Tool Support and Development Resources

Software Compatibility

The XC2S200-6FGG658C is fully supported by Xilinx ISE Design Suite, providing:

  • Schematic capture and HDL entry
  • Logic synthesis and optimization
  • Automatic place-and-route
  • Timing analysis and simulation
  • JTAG programming interface

HDL Language Support

  • VHDL – IEEE standard hardware description
  • Verilog – Industry-standard RTL design
  • Mixed-Language Support – Combine VHDL and Verilog modules

Advantages Over Mask-Programmed ASICs

The XC2S200-6FGG658C offers significant benefits compared to traditional ASIC solutions:

Cost Efficiency

  • No NRE Costs – Eliminates expensive mask and tooling charges
  • Low Minimum Orders – Ideal for prototyping and low-volume production
  • Reduced Inventory Risk – Single device serves multiple applications

Time-to-Market Acceleration

  • Rapid Prototyping – Design changes implemented in hours, not months
  • In-System Updates – Field upgrades without hardware changes
  • Iterative Development – Quick design verification cycles

Risk Mitigation

  • Design Flexibility – Late-stage modifications possible
  • Bug Fixes – Functional corrections after deployment
  • Feature Updates – Add capabilities to existing products

Ordering Information and Part Number Breakdown

Part Number Structure: XC2S200-6FGG658C

Segment Meaning
XC2S Spartan-II Family Identifier
200 200,000 System Gates
-6 Speed Grade (Highest Performance)
FG Fine-Pitch BGA Package
G Pb-Free (Lead-Free) Packaging
658 658-Pin Package
C Commercial Temperature Range (0°C to +85°C)

Temperature Grade Options

Grade Temperature Range
C (Commercial) 0°C to +85°C
I (Industrial) -40°C to +100°C

Quality and Compliance Certifications

The XC2S200-6FGG658C meets stringent quality and environmental standards:

  • RoHS Compliant – Restriction of Hazardous Substances directive
  • REACH Compliant – Registration, Evaluation, Authorization of Chemicals
  • ISO 9001 – Quality management system certification
  • AEC-Q100 – Automotive qualification (where applicable)

Why Choose the AMD XC2S200-6FGG658C?

The XC2S200-6FGG658C represents an outstanding balance of performance, flexibility, and cost-effectiveness. Its combination of high gate density, abundant memory resources, and advanced clocking capabilities makes it suitable for a wide range of demanding applications.

Whether you are developing industrial control systems, communication equipment, or consumer electronics, the XC2S200-6FGG658C provides the programmable logic resources necessary for successful implementation.

For more information about Spartan-II devices and related programmable logic solutions, explore our comprehensive Xilinx FPGA product catalog.


Summary: XC2S200-6FGG658C Specifications at a Glance

Specification Value
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLBs 1,176
Block RAM 56 Kbits
Distributed RAM 75,264 bits
User I/O (Max) 284
DLLs 4
Core Voltage 2.5V
Package 658-Pin FBGA
Speed Grade -6
Technology 0.18 µm CMOS
RoHS Status Compliant

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.