The AMD XC2S200-6FGG657C is a high-performance Field Programmable Gate Array from the acclaimed Spartan-II FPGA family. This programmable logic device delivers exceptional versatility for digital design applications, offering 200,000 system gates and advanced clock management capabilities. Engineers and designers seeking cost-effective ASIC alternatives will find the XC2S200-6FGG657C provides the perfect balance of performance, flexibility, and value.
XC2S200-6FGG657C Key Features and Benefits
The XC2S200-6FGG657C incorporates second-generation ASIC replacement technology, making it an ideal solution for applications requiring unlimited reprogrammability without the lengthy development cycles associated with traditional ASICs. This Xilinx FPGA delivers streamlined features based on the proven Virtex FPGA architecture, ensuring reliable performance across demanding applications.
Core Logic Architecture Specifications
The XC2S200-6FGG657C features a robust core logic architecture designed for complex digital implementations. The device utilizes a 0.18-micron CMOS process technology, operating with a 2.5V core voltage for optimal power efficiency. System performance reaches up to 263 MHz, enabling high-speed signal processing and data handling capabilities.
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Process Technology |
0.18µm |
| Core Voltage |
2.5V |
| Maximum Frequency |
263 MHz |
Memory Resources and SelectRAM Technology
The XC2S200-6FGG657C incorporates advanced SelectRAM hierarchical memory architecture, providing designers with flexible memory options. Distributed RAM capacity reaches 75,264 bits through 16-bit Look-Up Table configurations. Block RAM totals 56 Kilobits, organized in fourteen 4,096-bit dual-port memory blocks positioned along the device edges.
XC2S200-6FGG657C Package and Pin Configuration
The FGG657 package utilizes Fine-pitch Ball Grid Array technology, providing reliable surface mount connections for high-density PCB applications. The Pb-free packaging option, indicated by the “G” designation in FGG, ensures compliance with environmental regulations including RoHS directives.
Speed Grade and Temperature Range
The -6 speed grade designation indicates higher performance operation optimized for commercial temperature applications. This speed grade operates within the commercial temperature range of 0°C to +85°C junction temperature, suitable for indoor industrial and consumer electronics environments.
I/O Banking and Voltage Standards
The XC2S200-6FGG657C organizes input/output pins into eight separate banks, enabling support for multiple I/O voltage standards within a single device. Each bank operates with independent VCCO supply voltage connections, supporting various interface requirements simultaneously.
Supported I/O Standards
- LVTTL with selectable drive strength from 2mA to 24mA
- LVCMOS2 for 2.5V logic interfacing
- PCI compliance for 3.3V and 5V bus applications at 33MHz and 66MHz
- GTL and GTL+ for high-speed point-to-point connections
- HSTL Class I, III, and IV for memory interfaces
- SSTL2 and SSTL3 for DDR memory applications
- CTT for telecommunications systems
- AGP-2X for graphics subsystems
XC2S200-6FGG657C Configurable Logic Blocks
Each Configurable Logic Block contains four Logic Cells organized into two identical slices. The CLB architecture provides dedicated resources for implementing combinatorial logic, sequential elements, and arithmetic functions efficiently.
Look-Up Table Functionality
The four-input Look-Up Tables within each Logic Cell operate as function generators capable of implementing any Boolean function of four variables. These LUTs also serve as 16×1-bit synchronous RAM elements or 16-bit shift registers for burst data capture applications.
Dedicated Carry Logic for Arithmetic Operations
High-speed arithmetic operations benefit from dedicated carry logic chains spanning vertically through adjacent CLBs. Each slice contains XOR gates for full adder implementation and dedicated AND gates optimizing multiplier structures. Two independent carry chains per CLB enable efficient 2-bit arithmetic per vertical position.
Clock Distribution and DLL Features
The XC2S200-6FGG657C incorporates four Delay-Locked Loop circuits positioned at each device corner. These fully digital DLLs eliminate clock distribution delay while providing advanced clock domain control capabilities essential for high-performance synchronous designs.
DLL Capabilities
- Zero propagation delay clock distribution
- Clock doubling and division by factors including 1.5, 2, 2.5, 3, 4, 5, 8, and 16
- Four quadrature phase outputs (0°, 90°, 180°, 270°)
- Board-level clock deskew through clock mirroring
- Automatic lock indication for system initialization control
Global Clock Network Architecture
Four dedicated global clock networks distribute timing signals with minimal skew throughout the device. Global clock buffers located at top and bottom die edges drive these primary routing resources, ensuring synchronized operation across all register elements.
XC2S200-6FGG657C Configuration Options
The XC2S200-6FGG657C supports multiple configuration modes enabling flexible system integration approaches. Configuration data totals 1,335,840 bits, stored in internal SRAM cells that allow unlimited reprogramming throughout product lifecycle.
Configuration Mode Selection
| Mode |
Description |
Data Width |
CCLK Direction |
| Master Serial |
FPGA controls configuration from external PROM |
1-bit |
Output |
| Slave Serial |
External controller provides clock and data |
1-bit |
Input |
| Slave Parallel |
High-speed 8-bit configuration interface |
8-bit |
Input |
| Boundary Scan |
JTAG-based configuration through TAP |
1-bit |
N/A |
JTAG Boundary Scan Support
Full IEEE 1149.1 boundary scan compliance enables in-system testing and configuration through the dedicated Test Access Port. Mandatory instructions including EXTEST, SAMPLE/PRELOAD, and BYPASS facilitate board-level testing without additional test infrastructure.
XC2S200-6FGG657C Applications
The XC2S200-6FGG657C serves diverse application requirements across multiple market segments. Telecommunications equipment manufacturers utilize these devices for protocol processing and signal conditioning functions. Industrial control systems benefit from the programmable logic implementing custom state machines and interface controllers.
Typical Application Areas
- Digital signal processing front-end implementations
- Communication protocol bridges and converters
- Industrial automation control logic
- Consumer electronics timing and control
- Medical instrumentation data acquisition
- Automotive infotainment subsystems
- Test and measurement equipment
Development Tools and Support
The XC2S200-6FGG657C receives full support from the ISE development environment providing automated design flow from HDL entry through configuration file generation. The unified library contains over 400 primitives and macros ranging from basic gates to complex arithmetic functions.
Design Implementation Flow
The implementation tools automatically perform technology mapping, placement optimization, and routing based on timing constraints specified during design entry. Iterative timing-driven placement ensures successive design revisions maintain performance targets without manual intervention.
XC2S200-6FGG657C Ordering Information
The part number XC2S200-6FGG657C decodes according to standard AMD/Xilinx conventions. The XC2S200 designates the Spartan-II family 200K gate device. The -6 indicates higher performance speed grade. FGG specifies Pb-free Fine-pitch BGA packaging. The 657 indicates pin count, and C designates commercial temperature operation.
Related Part Numbers in XC2S200 Family
- XC2S200-5FGG456C: Standard performance, 456-pin Pb-free BGA, commercial
- XC2S200-6FGG456C: Higher performance, 456-pin Pb-free BGA, commercial
- XC2S200-5FGG256C: Standard performance, 256-pin Pb-free BGA, commercial
- XC2S200-6FGG256C: Higher performance, 256-pin Pb-free BGA, commercial
Technical Documentation Resources
Comprehensive technical documentation supports XC2S200-6FGG657C design efforts. The DS001 datasheet encompasses four modules covering introduction, functional description, DC and switching characteristics, and pinout tables. Application notes address specific implementation topics including configuration methods and system interface design.
Why Choose the XC2S200-6FGG657C FPGA
The XC2S200-6FGG657C delivers compelling advantages for programmable logic applications requiring proven reliability and comprehensive feature integration. Field upgradability eliminates hardware replacement costs when design modifications become necessary. The mature 0.18-micron process technology ensures consistent manufacturing quality and supply chain stability for production applications.
Engineers selecting the XC2S200-6FGG657C gain access to extensive design resources accumulated over the Spartan-II family lifecycle. This FPGA solution balances performance requirements with cost constraints effectively, making it suitable for both prototyping phases and volume production deployments across diverse electronic system applications.
