Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG655C Spartan-II FPGA: Complete Technical Guide and Specifications

Product Details

The AMD XC2S200-6FGG655C is a high-performance Field Programmable Gate Array from the renowned Spartan-II FPGA family. This programmable logic device delivers exceptional value for industrial automation, telecommunications, and embedded system applications. Engineers seeking reliable ASIC alternatives will find this Xilinx FPGA offers cost-effective implementation with unlimited reprogrammability.


XC2S200-6FGG655C Overview and Key Features

The XC2S200-6FGG655C represents AMD’s commitment to delivering high-density programmable logic at competitive price points. This device combines advanced 0.18-micron CMOS process technology with a streamlined architecture derived from the Virtex FPGA platform.

Core Architecture Specifications

The XC2S200-6FGG655C features a robust internal architecture designed for demanding applications:

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 CLBs)
Maximum User I/O 284
Block RAM 56 Kbits (14 blocks)
Distributed RAM 75,264 bits
Speed Grade -6 (Higher Performance)

Package and Environmental Details

Specification Value
Package Type Fine-Pitch BGA (Pb-Free)
Core Voltage 2.5V
I/O Voltage Options 1.5V, 2.5V, 3.3V
Operating Temperature 0°C to +85°C (Commercial)
Process Technology 0.18μm CMOS

XC2S200-6FGG655C Technical Specifications

Configurable Logic Block (CLB) Architecture

Each Configurable Logic Block in the XC2S200-6FGG655C contains four Logic Cells organized in two slices. The architecture provides flexible implementation options for complex digital designs.

Logic Cell Components

  • 4-Input Look-Up Tables (LUTs): Each LUT functions as a 16×1 synchronous RAM or 16-bit shift register
  • Dedicated Carry Logic: Enables high-speed arithmetic operations
  • Storage Elements: Configurable as edge-triggered D-type flip-flops or level-sensitive latches
  • F5/F6 Multiplexers: Combine function generators for 5-input or 6-input functions

Memory Resources

The XC2S200-6FGG655C offers hierarchical SelectRAM memory architecture:

Block RAM Features

  • 14 dedicated 4,096-bit RAM blocks
  • Dual-port synchronous operation
  • Independent read/write clocks per port
  • Configurable aspect ratios: 4096×1, 2048×2, 1024×4, 512×8, 256×16

Distributed RAM Capabilities

  • 75,264 bits total distributed RAM
  • 16 bits per LUT implementation
  • Single-port and dual-port configurations
  • Fast local interconnect access

I/O Standards and Interface Support

The XC2S200-6FGG655C supports 16 high-performance I/O signaling standards. This versatility enables seamless integration with various system components.

Supported I/O Standards

Standard VREF VCCO Description
LVTTL N/A 3.3V Low Voltage TTL
LVCMOS2 N/A 2.5V Low Voltage CMOS
PCI N/A 3.3V 33/66 MHz Compliant
GTL/GTL+ 0.8V/1.0V N/A Gunning Transceiver Logic
HSTL Class I/III/IV 0.75V/0.9V 1.5V High-Speed Transceiver Logic
SSTL2/SSTL3 1.25V/1.5V 2.5V/3.3V Stub Series Terminated Logic

I/O Banking Configuration

The device organizes I/Os into eight independent banks. This architecture allows mixing compatible voltage standards within specific constraints.


Clock Management and Distribution

Delay-Locked Loop (DLL) Features

The XC2S200-6FGG655C includes four fully digital DLLs providing:

  • Zero propagation delay clock distribution
  • Minimal clock skew across all loads
  • Clock multiplication (2×)
  • Clock division (1.5, 2, 2.5, 3, 4, 5, 8, 16)
  • Four quadrature phase outputs (0°, 90°, 180°, 270°)
  • Board-level clock deskewing capability

Global Clock Network

  • Four dedicated low-skew global clock nets
  • Dedicated clock input pins
  • Clock distribution to all CLB, IOB, and Block RAM clock pins

Configuration Options

The XC2S200-6FGG655C supports multiple configuration modes for maximum design flexibility.

Available Configuration Modes

Mode CCLK Direction Data Width Description
Master Serial Output 1-bit FPGA drives PROM
Slave Serial Input 1-bit External controller drives FPGA
Slave Parallel Input 8-bit Fastest configuration option
Boundary Scan N/A 1-bit IEEE 1149.1 JTAG interface

Configuration File Size

The complete configuration bitstream requires approximately 1.34 Mbits of storage.


Design Development Support

Software Tools

AMD provides comprehensive development support through the ISE Design Suite:

  • Automatic mapping, placement, and routing
  • Timing-driven implementation
  • Static timing analysis
  • In-circuit debugging capabilities

Library Support

Over 400 primitives and macros available including:

  • Arithmetic functions and comparators
  • Counters and shift registers
  • Multiplexers and decoders
  • Boolean functions and latches

XC2S200-6FGG655C Application Areas

The XC2S200-6FGG655C excels in numerous application domains:

Industrial Applications

  • Process Control Systems: Real-time monitoring and control
  • Motor Drives: PWM generation and feedback processing
  • Industrial Networking: Protocol conversion and bridging

Communications Applications

  • Digital Signal Processing: Filter implementation and signal conditioning
  • Protocol Processing: Packet handling and data formatting
  • Interface Bridging: Legacy system integration

Consumer Electronics

  • Display Controllers: Video processing and timing generation
  • Audio Processing: Digital audio interfaces and effects
  • Peripheral Control: USB, UART, and SPI implementations

Ordering Information

Part Number Breakdown

XC2S200-6FGG655C decodes as follows:

  • XC2S200: Spartan-II 200K gate device
  • -6: Higher performance speed grade
  • FGG: Fine-pitch BGA, Pb-free package
  • 655: Pin count
  • C: Commercial temperature range (0°C to +85°C)

Why Choose the XC2S200-6FGG655C

The XC2S200-6FGG655C delivers compelling advantages for hardware designers:

  1. Cost-Effective ASIC Alternative: Eliminates NRE costs and lengthy development cycles
  2. Field Upgradability: Unlimited reprogrammability enables post-deployment updates
  3. Proven Technology: Mature, well-documented architecture with extensive design resources
  4. Flexible I/O: Support for 16 signaling standards simplifies system integration
  5. Comprehensive Memory: Hierarchical RAM architecture meets diverse storage requirements
  6. Advanced Clocking: Four DLLs provide sophisticated clock management capabilities

Technical Documentation and Resources

Engineers can access complete technical documentation including:

  • DS001 Spartan-II FPGA Family Data Sheet
  • Configuration and Readback Application Notes
  • BSDL Files for Boundary Scan Implementation
  • ISE Design Suite User Guides

The XC2S200-6FGG655C continues to serve as a reliable choice for designers requiring proven FPGA technology with comprehensive vendor support and extensive design resources.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.