The AMD XC2S200-6FGG652C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional value for engineers seeking cost-effective solutions for complex digital design applications. With 200,000 system gates and advanced architectural features, the XC2S200-6FGG652C stands as a superior alternative to traditional mask-programmed ASICs.
Key Features of the XC2S200-6FGG652C FPGA
The AMD XC2S200-6FGG652C combines powerful processing capabilities with versatile I/O options, making it ideal for demanding embedded applications. This Xilinx FPGA offers unlimited reprogrammability, allowing design upgrades in the field without hardware replacement.
Core Specifications
| Parameter |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K |
| Speed Grade |
-6 (Higher Performance) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
| Package Type |
Fine Pitch BGA (Pb-Free) |
| Operating Temperature |
Commercial (0°C to +85°C) |
XC2S200-6FGG652C Architecture Overview
The AMD XC2S200-6FGG652C features a sophisticated architecture built around five major configurable elements that provide maximum design flexibility.
Configurable Logic Blocks (CLBs)
Each CLB in the XC2S200-6FGG652C contains four Logic Cells (LCs) organized in two identical slices. The architecture includes 4-input look-up tables (LUTs) that serve multiple functions, including function generators, 16×1-bit synchronous RAM modules, and 16-bit shift registers for high-speed data capture in burst-mode applications.
Input/Output Blocks (IOBs)
The XC2S200-6FGG652C IOBs support 16 high-performance interface standards, delivering versatile connectivity options for modern embedded designs.
Supported I/O Standards
- LVTTL (2-24 mA drive strength)
- LVCMOS2 (2.5V CMOS)
- PCI (3V/5V, 33MHz/66MHz compliant)
- GTL and GTL+
- HSTL Class I, III, and IV
- SSTL2 and SSTL3 Class I and II
- CTT
- AGP-2X
Block RAM Memory Architecture
The XC2S200-6FGG652C incorporates 14 dedicated block RAM modules, providing 56 kilobits of high-speed on-chip memory. Each 4096-bit block RAM cell features fully synchronous dual-port operation with independent control signals for each port.
Block RAM Configuration Options
| Width |
Depth |
Address Bus |
Data Bus |
| 1-bit |
4096 |
ADDR[11:0] |
DATA[0] |
| 2-bit |
2048 |
ADDR[10:0] |
DATA[1:0] |
| 4-bit |
1024 |
ADDR[9:0] |
DATA[3:0] |
| 8-bit |
512 |
ADDR[8:0] |
DATA[7:0] |
| 16-bit |
256 |
ADDR[7:0] |
DATA[15:0] |
Advanced Clock Management in the XC2S200-6FGG652C
Delay-Locked Loop (DLL) Technology
The XC2S200-6FGG652C integrates four fully digital Delay-Locked Loops positioned at each corner of the die. These DLLs provide zero-delay clock distribution with minimal skew between output clock signals throughout the device.
DLL Capabilities
- Clock delay compensation eliminating propagation delays
- Four quadrature phase outputs (0°, 90°, 180°, 270°)
- Clock frequency doubling
- Clock division by factors of 1.5, 2, 2.5, 3, 4, 5, 8, or 16
- Board-level clock deskewing across multiple devices
Global Clock Distribution Network
Four primary low-skew global clock distribution nets ensure consistent timing across the entire FPGA fabric. The XC2S200-6FGG652C supports system clock rates up to 200 MHz, meeting the demands of high-performance applications.
XC2S200-6FGG652C Configuration Modes
The AMD XC2S200-6FGG652C supports multiple configuration options for flexible system integration.
Available Configuration Methods
| Mode |
CCLK Direction |
Data Width |
Description |
| Master Serial |
Output |
1-bit |
FPGA controls configuration from serial PROM |
| Slave Serial |
Input |
1-bit |
External controller provides serial bitstream |
| Slave Parallel |
Input |
8-bit |
Fastest configuration option |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
IEEE 1149.1 compliant configuration |
Configuration File Requirements
The XC2S200-6FGG652C requires 1,335,840 bits of configuration data. This bitstream can be stored in Xilinx serial PROMs, parallel flash memory, or other nonvolatile storage solutions including hard drives and flash cards.
Design Advantages of the XC2S200-6FGG652C
Cost-Effective ASIC Alternative
The AMD XC2S200-6FGG652C eliminates the initial cost, lengthy development cycles, and inherent risk associated with conventional mask-programmed ASICs. Engineers benefit from unlimited reprogrammability, enabling iterative design refinement without hardware modifications.
Dedicated Arithmetic Resources
High-speed arithmetic operations are supported through dedicated carry logic chains. Each CLB supports two independent carry chains with a height of two bits per CLB, enabling efficient implementation of adders, counters, and multipliers.
Boundary Scan Support
Full IEEE 1149.1 boundary scan compliance enables comprehensive testing capabilities including EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. This feature simplifies PCB-level testing and debugging workflows.
Typical Applications for the XC2S200-6FGG652C
The AMD XC2S200-6FGG652C excels in numerous application domains requiring flexible, reprogrammable logic solutions.
Industrial Applications
- Digital signal processing systems
- Industrial automation controllers
- Motor drive systems
- Process control equipment
- Data acquisition systems
Communications Infrastructure
- Network routers and switches
- Telecommunications base stations
- Protocol conversion bridges
- Fiber optic interface modules
- Wireless communication systems
Consumer Electronics
- Video processing equipment
- Audio processing systems
- Display controllers
- Gaming peripherals
- Smart appliance controllers
Development Tool Support
The AMD XC2S200-6FGG652C is fully supported by the Xilinx ISE development environment, providing comprehensive design entry, implementation, and verification capabilities.
Supported Design Entry Methods
- HDL design using VHDL or Verilog
- Schematic capture
- EDIF netlist import
- Mixed hierarchical design combining multiple entry methods
Implementation Features
- Automatic mapping, placement, and routing
- Timing-driven optimization
- Floorplanning support for structured designs
- Fast design iteration with incremental compilation
Ordering Information for the XC2S200-6FGG652C
The AMD XC2S200-6FGG652C is available with Pb-free (lead-free) packaging, complying with RoHS environmental directives. The “G” character in the part number (FGG) indicates Pb-free packaging for environmentally responsible designs.
Part Number Breakdown
- XC2S200: Device type (Spartan-II, 200K system gates)
- -6: Speed grade (higher performance option)
- FGG652: Fine pitch BGA package, Pb-free
- C: Commercial temperature range (0°C to +85°C)
Conclusion
The AMD XC2S200-6FGG652C represents an optimal solution for engineers requiring a high-density, cost-effective FPGA with robust I/O capabilities and advanced clock management features. With 200,000 system gates, 56 kilobits of block RAM, and support for 16 different I/O standards, this Spartan-II device delivers exceptional flexibility for prototyping and production applications across industrial, communications, and consumer electronics sectors.
