The AMD XC2S200-6FGG651C is a high-performance Field Programmable Gate Array (FPGA) from the proven Spartan-II family, engineered to deliver exceptional logic density and processing speed for demanding embedded applications. This versatile XC2S200-6FGG651C programmable logic device combines 200,000 system gates with advanced 0.18-micron CMOS technology, making it an ideal choice for engineers seeking reliable, cost-effective digital design solutions.
XC2S200-6FGG651C Key Features and Specifications
System Gates and Logic Capacity
The XC2S200-6FGG651C offers impressive computational resources with 200,000 system gates and 5,292 logic cells, providing ample capacity for implementing complex digital circuits, state machines, and custom hardware accelerators. The device features a 28 × 42 CLB array totaling 1,176 Configurable Logic Blocks (CLBs), ensuring flexible logic implementation for diverse application requirements.
Speed Grade -6 Performance Advantage
With the -6 speed grade designation, the XC2S200-6FGG651C represents the fastest performance tier in the Spartan-II product line. This premium speed rating enables:
- Maximum system frequency up to 263 MHz
- Optimized timing parameters for high-speed signal processing
- Enhanced throughput for data-intensive applications
- Reduced propagation delays for time-critical designs
Memory Architecture
The XC2S200-6FGG651C integrates substantial on-chip memory resources:
| Memory Type |
Capacity |
Configuration |
| Distributed RAM |
75,264 bits |
LUT-based |
| Block RAM |
56 Kbits |
14 dedicated blocks |
| Total RAM Bits |
131,264 bits |
Combined resources |
Each dual-port Block RAM module delivers 4,096 bits with independent read/write ports, supporting configurable aspect ratios from 4096×1 to 256×16 for optimal memory bandwidth utilization.
XC2S200-6FGG651C Technical Specifications
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V ± 5% |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Process Technology |
0.18 μm CMOS |
| Maximum User I/O |
284 pins |
| Operating Temperature |
0°C to +85°C (Commercial) |
Package Information
The XC2S200-6FGG651C utilizes a Fine-Pitch Ball Grid Array (FBGA) package format, delivering:
- High pin density in compact footprint
- Superior thermal dissipation characteristics
- Enhanced signal integrity for high-speed interfaces
- Reliable solder joint formation for production assembly
Clock Management
The XC2S200-6FGG651C incorporates four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide:
- Clock de-skewing and phase alignment
- Duty cycle correction
- Clock multiplication and division
- System clock distribution with minimal jitter
XC2S200-6FGG651C Application Areas
Industrial Control Systems
The XC2S200-6FGG651C excels in industrial automation environments, supporting:
- Motor drive controllers and PWM generation
- PLC co-processor implementations
- Real-time sensor data acquisition
- Industrial communication protocol bridges
Digital Signal Processing
Engineers leverage the XC2S200-6FGG651C for DSP applications including:
- Audio codec interfaces and processing
- Video signal conditioning
- Filter implementations (FIR/IIR)
- Data compression algorithms
Communications Infrastructure
The high-speed capabilities of the XC2S200-6FGG651C enable:
- Protocol conversion bridges (Ethernet, USB, SPI)
- UART and serial interface multiplexing
- Network packet processing
- Wireless baseband implementations
Embedded Systems Development
For embedded applications, the XC2S200-6FGG651C provides:
- Custom peripheral controllers
- Hardware acceleration for microcontroller systems
- ASIC prototyping and verification
- Legacy system interface adaptation
Explore our complete selection of Xilinx FPGA products for additional programmable logic solutions.
XC2S200-6FGG651C Design Resources
Development Tools Compatibility
The XC2S200-6FGG651C is fully supported by AMD’s comprehensive design ecosystem:
- ISE Design Suite – Complete synthesis, implementation, and programming environment
- Schematic Capture – Traditional design entry methodology
- HDL Support – VHDL and Verilog hardware description languages
- IP Core Library – Pre-verified functional blocks for rapid development
Configuration Options
Multiple programming modes ensure deployment flexibility:
- Master Serial Mode
- Slave Serial Mode
- Master Parallel Mode (SelectMAP)
- JTAG/Boundary Scan Mode
Why Choose the XC2S200-6FGG651C?
Cost-Effective ASIC Alternative
The XC2S200-6FGG651C eliminates the substantial NRE (Non-Recurring Engineering) costs associated with custom ASIC development, offering:
- Zero mask charges or fabrication fees
- Immediate design iteration capability
- Field-upgradeable functionality
- Reduced time-to-market cycles
Proven Reliability
Built on AMD’s mature Spartan-II architecture, the XC2S200-6FGG651C delivers:
- Established production track record
- Comprehensive documentation and application notes
- Global distributor network availability
- Long-term supply continuity
Scalable Design Path
The XC2S200-6FGG651C maintains pin and architecture compatibility within the Spartan-II family, enabling seamless migration between capacity variants as design requirements evolve.
XC2S200-6FGG651C Ordering Information
When specifying the XC2S200-6FGG651C for procurement, verify the following part number components:
- XC2S200 – Device density (200K system gates)
- -6 – Speed grade (fastest)
- FGG651 – Package type (Fine-pitch BGA)
- C – Temperature grade (Commercial: 0°C to +85°C)
Frequently Asked Questions
What is the maximum operating frequency of the XC2S200-6FGG651C?
The XC2S200-6FGG651C achieves maximum clock speeds of 263 MHz with the -6 speed grade, enabling high-throughput digital signal processing and fast state machine implementations.
Is the XC2S200-6FGG651C suitable for new designs?
While newer FPGA families offer enhanced capabilities, the XC2S200-6FGG651C remains a viable option for cost-sensitive applications, legacy system maintenance, and designs requiring the specific Spartan-II architecture.
What programming tools support the XC2S200-6FGG651C?
AMD’s ISE Design Suite provides complete synthesis, place-and-route, timing analysis, and bitstream generation capabilities for the XC2S200-6FGG651C and all Spartan-II family devices.
How many user I/O pins does the XC2S200-6FGG651C provide?
The XC2S200-6FGG651C supports up to 284 user-configurable I/O pins, plus four dedicated global clock input pins for system timing distribution.
Summary
The AMD XC2S200-6FGG651C FPGA delivers a compelling combination of logic density, memory resources, and high-speed performance in a proven programmable platform. With 200,000 system gates, 56 Kbits of Block RAM, and the fastest -6 speed grade achieving 263 MHz operation, the XC2S200-6FGG651C addresses a broad spectrum of digital design challenges across industrial, communications, and em
