The AMD XC2S200-6FGG649C represents a powerful entry in the Spartan-II family of field-programmable gate arrays, delivering exceptional performance for cost-sensitive applications. This comprehensive guide covers everything engineers and procurement specialists need to know about this versatile FPGA solution.
What Is the AMD XC2S200-6FGG649C?
The AMD XC2S200-6FGG649C is a high-density programmable logic device from the renowned Spartan-II FPGA series, originally developed by Xilinx before the AMD acquisition. This device combines substantial logic capacity with a generous I/O count, making it ideal for complex digital system implementations where both performance and cost efficiency matter.
As a member of the Spartan-II platform, this FPGA utilizes a 0.18-micron process technology and operates at a core voltage of 2.5V, striking an optimal balance between power consumption and computational capability. The “-6” speed grade designation indicates standard performance characteristics suitable for a wide range of industrial and commercial applications.
Key Features of the XC2S200-6FGG649C
Logic Capacity and Architecture
The XC2S200-6FGG649C offers impressive logic resources that enable sophisticated digital designs:
- System Gates: 200,000 equivalent system gates provide ample capacity for complex logic implementations
- Logic Cells: 5,292 logic cells arranged in a configurable logic block (CLB) array
- CLB Array: 28 x 42 array configuration offering flexible resource allocation
- Slices: 2,352 slices available for combinatorial and sequential logic functions
- Flip-Flops: 5,556 flip-flops support extensive state machine and pipeline designs
- Maximum Distributed RAM: 59,904 bits for high-speed local memory requirements
- Block RAM: 56,000 bits organized in dedicated memory blocks for larger storage needs
Package and Pin Configuration
The FGG649C package designation provides critical information about the physical implementation:
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Total Pins: 649 pins in a robust BGA configuration
- User I/O Pins: Up to 410 user-configurable I/O pins
- Pin Pitch: 1.0mm ball pitch for reliable soldering and inspection
- Package Dimensions: 31mm x 31mm body size
- Temperature Grade: Commercial temperature range (0°C to +85°C)
I/O Capabilities and Standards
Modern digital systems require flexible interfacing options, and the XC2S200-6FGG649C delivers comprehensive I/O support:
- I/O Banks: Multiple independently configurable I/O banks
- LVTTL Support: 3.3V LVTTL compatibility for legacy system integration
- LVCMOS Options: Support for 3.3V, 2.5V, and 1.8V LVCMOS standards
- Differential Signaling: LVDS and BLVDS support for high-speed serial communications
- SSTL Support: SSTL2 and SSTL3 compatibility for memory interfaces
- PCI Compliance: Direct PCI local bus interface capability
Technical Specifications Summary
Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5V ±5% |
| I/O Voltage (VCCO) |
1.8V to 3.3V |
| Speed Grade |
-6 (Standard) |
| Operating Temperature |
0°C to +85°C |
| Storage Temperature |
-65°C to +150°C |
Performance Metrics
| Parameter |
Typical Value |
| Maximum System Clock |
Up to 200 MHz |
| I/O Toggle Rate |
Up to 311 MHz |
| Block RAM Access Time |
2.5 ns |
| Global Clock Networks |
4 primary global clocks |
| DLL Units |
4 integrated delay-locked loops |
Applications for the XC2S200-6FGG649C
The versatility of this Xilinx FPGA makes it suitable for numerous application domains where programmable logic provides advantages over fixed-function alternatives.
Industrial Automation
Manufacturing environments benefit from the XC2S200-6FGG649C’s robust feature set for motor control systems, sensor processing, and real-time data acquisition. The generous I/O count supports direct interfacing with multiple sensors and actuators without requiring external multiplexing circuitry.
Telecommunications Infrastructure
Base station equipment, protocol converters, and network interface cards leverage this FPGA for packet processing, signal conditioning, and protocol bridging functions. The high-speed I/O capabilities enable efficient handling of serial data streams at rates compatible with modern communication standards.
Medical Equipment
Diagnostic imaging systems, patient monitoring devices, and laboratory instrumentation utilize the XC2S200-6FGG649C for signal processing and control functions. The commercial temperature rating ensures reliable operation in climate-controlled medical environments.
Automotive Electronics
Infotainment systems, driver assistance modules, and vehicle networking equipment incorporate this FPGA for video processing, CAN bus interfacing, and sensor fusion applications. The device’s proven reliability supports the demanding requirements of automotive environments.
Consumer Electronics
Set-top boxes, gaming peripherals, and audio/video processing equipment employ the XC2S200-6FGG649C for format conversion, effects processing, and user interface management tasks.
Design Considerations for the XC2S200-6FGG649C
Power Supply Requirements
Proper power sequencing ensures reliable device operation and prevents potential damage during system startup. The recommended sequence applies VCCINT before VCCO supplies, with appropriate ramp rate control to minimize inrush current effects.
A multi-rail power solution typically includes separate regulators for the 2.5V core supply and the various I/O bank voltages. Adequate decoupling capacitance placed close to the device pins maintains signal integrity and minimizes ground bounce effects.
Configuration Options
The XC2S200-6FGG649C supports multiple configuration modes to accommodate different system requirements:
- Master Serial Mode: Device controls configuration from external PROM
- Slave Serial Mode: External processor manages configuration data flow
- Master Parallel Mode: 8-bit parallel configuration interface
- Slave Parallel Mode: Host-controlled parallel configuration
- Boundary Scan (JTAG): IEEE 1149.1 compliant programming and testing
Clock Management
The integrated delay-locked loop (DLL) blocks provide sophisticated clock management capabilities essential for high-performance designs. These DLLs can multiply, divide, or phase-shift incoming clock signals while maintaining low jitter characteristics.
Four global clock networks distribute timing signals throughout the device with minimal skew, ensuring synchronous operation across the entire logic array.
Comparison With Related Spartan-II Devices
The Spartan-II family encompasses multiple density options, allowing designers to select the optimal capacity for their specific requirements:
| Device |
System Gates |
Logic Cells |
Block RAM (Kb) |
Maximum I/O |
| XC2S15 |
15,000 |
432 |
16 |
86 |
| XC2S30 |
30,000 |
972 |
24 |
132 |
| XC2S50 |
50,000 |
1,728 |
32 |
176 |
| XC2S100 |
100,000 |
2,700 |
40 |
196 |
| XC2S150 |
150,000 |
3,888 |
48 |
260 |
| XC2S200 |
200,000 |
5,292 |
56 |
410 |
The XC2S200-6FGG649C occupies the highest density position within this family, offering maximum logic resources for the most demanding applications while maintaining compatibility with lower-density variants for design migration.
Ordering Information and Part Number Breakdown
Understanding the XC2S200-6FGG649C part number helps ensure correct device selection:
- XC2S: Spartan-II family identifier
- 200: Device density (200K system gates)
- -6: Speed grade (standard performance)
- FG: Fine-pitch BGA package type
- G: Lead-free designation
- 649: Total pin count
- C: Commercial temperature grade
Development Tools and Resources
Successful implementation with the XC2S200-6FGG649C requires appropriate development infrastructure. The AMD Vivado Design Suite and legacy ISE software provide comprehensive toolchains for design entry, synthesis, implementation, and verification.
Recommended Development Flow
The typical design process encompasses several phases from concept through production. Initial architecture definition establishes the functional requirements and resource estimates. RTL coding in VHDL or Verilog captures the design intent in synthesizable form. Simulation validates functional correctness before committing to physical implementation.
Synthesis translates the RTL description into device-specific primitives. Place and route tools optimize the physical arrangement for timing closure. Timing analysis confirms that all paths meet their frequency requirements. Finally, bitstream generation produces the configuration file for device programming.
Quality and Reliability Information
The XC2S200-6FGG649C undergoes rigorous testing to ensure consistent performance across the specified operating conditions. Production testing validates parametric specifications at multiple temperature points, while reliability qualification demonstrates long-term operational stability.
Moisture sensitivity level (MSL) ratings guide proper handling and storage procedures for the BGA package. Appropriate bake-out procedures restore devices that have exceeded their floor life limits before assembly.
Conclusion
The AMD XC2S200-6FGG649C delivers a compelling combination of logic density, I/O flexibility, and cost efficiency for applications requiring programmable hardware solutions. Its established position within the Spartan-II family ensures broad tool support and extensive application knowledge, making it a reliable choice for new designs and legacy system maintenance alike.
Engineers seeking detailed timing parameters, package drawings, and application notes should consult the official AMD documentation for the complete technical reference. The proven architecture and comprehensive ecosystem surrounding this device family continue to support successful implementations across diverse market segments.
