The AMD XC2S200-6FGG648C is a high-performance field-programmable gate array from the renowned Spartan-II family, delivering exceptional logic density and I/O capabilities for demanding embedded applications. This versatile FPGA combines 200,000 system gates with advanced speed grade -6 performance in a robust 648-ball fine-pitch BGA package.
XC2S200-6FGG648C Key Features and Specifications
The XC2S200-6FGG648C represents AMD’s commitment to providing cost-effective programmable logic solutions without compromising on performance or reliability.
Logic Capacity and Architecture
The XC2S200-6FGG648C offers substantial programmable logic resources designed to handle complex digital designs:
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Maximum Distributed RAM |
57,344 bits |
| Maximum Block RAM |
56 Kbits |
| Block RAM Blocks |
14 |
Speed Grade -6 Performance Characteristics
The -6 speed grade designation indicates optimized timing parameters that balance power consumption with operational frequency. This speed grade delivers reliable performance across industrial temperature ranges while maintaining competitive clock speeds for most embedded applications.
FGG648C Package Configuration
The FGG648C package provides extensive connectivity options through its 648-ball fine-pitch BGA configuration:
| Package Parameter |
Value |
| Package Type |
Fine-Pitch BGA |
| Total Balls |
648 |
| Ball Pitch |
1.0mm |
| Maximum User I/O |
284 |
| Package Dimensions |
27mm x 27mm |
XC2S200-6FGG648C Technical Architecture
Configurable Logic Block Structure
Each configurable logic block in the XC2S200-6FGG648C contains two slices, with each slice featuring two 4-input look-up tables and two dedicated storage elements. This architecture enables efficient implementation of combinatorial and sequential logic while supporting distributed RAM configurations.
Dedicated Block RAM Resources
The 14 block RAM modules within the XC2S200-6FGG648C provide 4,096 bits each, configurable as single-port or dual-port memory. These dedicated memory blocks support various aspect ratios including 4K x 1, 2K x 2, 1K x 4, 512 x 8, and 256 x 16 configurations.
Digital Clock Manager Capabilities
The XC2S200-6FGG648C integrates four digital clock managers offering:
- Clock frequency synthesis and multiplication
- Phase shifting capabilities
- Duty cycle correction
- Clock deskewing functions
I/O Standards and Voltage Support
The XC2S200-6FGG648C supports multiple I/O standards essential for modern system design, making it an excellent choice as a Xilinx FPGA solution for diverse applications.
Supported I/O Standards
| Standard |
Description |
| LVTTL |
Low-Voltage TTL (3.3V) |
| LVCMOS |
Low-Voltage CMOS (2.5V, 3.3V) |
| PCI |
PCI Local Bus Compliant |
| GTL/GTL+ |
Gunning Transceiver Logic |
| HSTL |
High-Speed Transceiver Logic |
| SSTL |
Stub Series Terminated Logic |
| CTT |
Center Tap Terminated |
Power Supply Requirements
| Supply Rail |
Voltage |
Description |
| VCCINT |
2.5V |
Internal core supply |
| VCCO |
1.5V – 3.3V |
I/O bank supply (bank dependent) |
| VREF |
Variable |
Input reference voltage |
XC2S200-6FGG648C Application Areas
Industrial Control Systems
The robust architecture and extensive I/O count make the XC2S200-6FGG648C ideal for industrial automation, motor control, and process monitoring applications requiring real-time signal processing.
Communications Infrastructure
With support for high-speed I/O standards and substantial logic resources, this FPGA serves effectively in telecommunications equipment, protocol conversion, and data aggregation systems.
Embedded Computing Solutions
The XC2S200-6FGG648C provides sufficient gate count and memory resources for implementing soft processors, custom peripherals, and application-specific accelerators in embedded designs.
Test and Measurement Equipment
High-performance timing characteristics and flexible I/O configurations make this device suitable for implementing custom test interfaces and measurement instrumentation.
Configuration and Programming Options
Configuration Modes
The XC2S200-6FGG648C supports multiple configuration schemes:
| Mode |
Description |
| Master Serial |
Device controls external PROM |
| Slave Serial |
External controller provides bitstream |
| Master SelectMAP |
8-bit parallel configuration |
| Slave SelectMAP |
8-bit parallel, externally controlled |
| JTAG/Boundary Scan |
IEEE 1149.1 compliant programming |
Configuration Storage Requirements
The XC2S200-6FGG648C requires approximately 1,335,840 configuration bits for complete device programming. Compatible configuration PROMs include the XC18V02 and larger devices from the Platform Flash family.
Environmental and Operating Specifications
Temperature Ratings
| Grade |
Operating Range |
| Commercial |
0°C to +85°C |
| Industrial |
-40°C to +100°C |
Absolute Maximum Ratings
| Parameter |
Maximum Value |
| Storage Temperature |
-65°C to +150°C |
| VCCINT Maximum |
3.0V |
| VCCO Maximum |
4.0V |
| Input Voltage (VI) |
-0.5V to VCCO + 0.5V |
Design Considerations for XC2S200-6FGG648C
Power Distribution Network
Proper power supply decoupling is essential for reliable operation. Implement distributed decoupling capacitors across VCCINT and VCCO supply pins with values ranging from 100nF for high-frequency filtering to 10µF for bulk capacitance.
Thermal Management
The FGG648 package dissipates heat primarily through the PCB. For designs approaching maximum power consumption, consider thermal vias under the package and adequate copper plane area for heat spreading.
Signal Integrity
When utilizing high-speed I/O standards, maintain controlled impedance routing and appropriate termination schemes. The XC2S200-6FGG648C integrates digitally controlled impedance matching on select I/O banks.
Ordering Information
| Part Number |
Description |
| XC2S200-6FGG648C |
Spartan-II FPGA, 200K gates, -6 speed, 648 FBGA, Commercial |
| XC2S200-6FGG648I |
Spartan-II FPGA, 200K gates, -6 speed, 648 FBGA, Industrial |
Summary
The AMD XC2S200-6FGG648C delivers proven Spartan-II architecture with 200,000 system gates, 284 user I/O pins, and -6 speed grade performance in a space-efficient 648-ball BGA package. This FPGA provides an optimal balance of logic density, I/O flexibility, and cost-effectiveness for industrial, communications, and embedded applications requiring reliable programmable logic solutions.
