The AMD XC2S200-6FGG647C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This advanced programmable logic device delivers exceptional processing power with 200,000 system gates, making it an ideal solution for complex digital design applications, embedded systems, and industrial automation projects.
Key Features of the XC2S200-6FGG647C FPGA
The XC2S200-6FGG647C offers engineers and designers a powerful platform for implementing custom digital circuits. This Xilinx FPGA represents the pinnacle of Spartan-II technology, combining high logic density with cost-effective implementation.
Technical Specifications
| Parameter |
Value |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 Total CLBs) |
| Maximum User I/O |
284 |
| Block RAM |
56 Kbits (14 blocks × 4,096 bits) |
| Distributed RAM |
75,264 bits |
| Maximum Frequency |
Up to 200 MHz |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V, 2.5V, or 3.3V |
| Speed Grade |
-6 (Higher Performance) |
| Package Type |
FGG647 (Fine-pitch BGA) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Process Technology |
0.18 µm CMOS |
XC2S200-6FGG647C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG647C contains 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB consists of four logic cells (LCs), with each logic cell including a 4-input look-up table (LUT), dedicated carry logic, and a storage element. This architecture enables implementation of complex combinational and sequential logic functions.
Block RAM Memory Structure
This Spartan-II FPGA integrates 14 dedicated block RAM modules, providing 56 Kbits of high-speed, dual-port synchronous memory. Each block RAM cell offers configurable aspect ratios supporting depths from 256 to 4,096 locations and widths from 1 to 16 bits. The dual-port architecture allows simultaneous read and write operations at different addresses.
Distributed RAM Capabilities
Beyond block RAM, the XC2S200-6FGG647C offers 75,264 bits of distributed RAM implemented within the CLB look-up tables. This distributed memory architecture provides flexible, low-latency storage ideal for FIFOs, shift registers, and small lookup tables scattered throughout the design.
Advanced Clock Management Features
Four Delay-Locked Loops (DLLs)
The XC2S200-6FGG647C incorporates four fully digital Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide zero-propagation-delay clock distribution, eliminating clock skew across the device. Key DLL capabilities include clock doubling, clock division (by 1.5, 2, 2.5, 3, 4, 5, 8, or 16), and four quadrature phase outputs (0°, 90°, 180°, 270°).
Global Clock Distribution Network
Four dedicated global clock networks ensure low-skew clock distribution to all CLB, IOB, and block RAM clock pins. The hierarchical clock routing architecture minimizes timing uncertainty in synchronous designs.
Versatile I/O Standards Support
16 Programmable Interface Standards
The XC2S200-6FGG647C supports a comprehensive range of I/O signaling standards:
- LVTTL (2-24 mA drive strength)
- LVCMOS2 (2.5V low-voltage CMOS)
- PCI (3.3V/5V, 33 MHz/66 MHz compliant)
- GTL / GTL+ (Gunning Transceiver Logic)
- HSTL Class I, III, IV (High-Speed Transceiver Logic)
- SSTL2 / SSTL3 Class I & II (Stub Series Terminated Logic)
- CTT (Center Tap Terminated)
- AGP-2X (Accelerated Graphics Port)
Hot-Swap and 5V Tolerance
The I/O structure includes ESD protection and optional 5V compliance, making the XC2S200-6FGG647C suitable for mixed-voltage system designs and hot-swap Compact PCI applications.
FGG647 Package Details
Fine-Pitch Ball Grid Array Configuration
The FGG647 package utilizes a Fine-pitch Ball Grid Array (FBGA) format with 647 solder balls. This package provides optimal thermal performance and signal integrity for high-speed designs while maintaining a compact PCB footprint.
Pin Compatibility and Migration
The Spartan-II family offers footprint compatibility across different device densities within common packages, facilitating design migration and capacity scaling without PCB redesign.
Design and Development Support
Xilinx ISE Design Tools
The XC2S200-6FGG647C is fully supported by Xilinx ISE development tools, offering automatic mapping, placement, and routing. The unified library contains over 400 primitives and macros, including arithmetic functions, counters, multiplexers, and shift registers.
Configuration Options
Multiple configuration modes ensure flexible system integration:
- Master Serial Mode – FPGA drives CCLK to external PROM
- Slave Serial Mode – External controller provides configuration clock
- Slave Parallel Mode – Fastest 8-bit wide configuration interface
- Boundary-Scan Mode – IEEE 1149.1 JTAG configuration
Configuration Storage Requirements
The XC2S200-6FGG647C requires approximately 1,335,840 bits (167 KB) for configuration data storage.
Application Areas for XC2S200-6FGG647C
Industrial and Embedded Systems
The XC2S200-6FGG647C excels in industrial automation, motor control, and embedded computing applications where programmable logic enables rapid prototyping and field-upgradeable designs.
Telecommunications Equipment
High-speed interface support and substantial logic resources make this FPGA ideal for networking equipment, protocol converters, and communications infrastructure.
Digital Signal Processing
With dedicated carry chains for high-speed arithmetic and efficient multiplier support, the XC2S200-6FGG647C handles DSP algorithms including FIR filters, FFT implementations, and signal conditioning.
ASIC Replacement and Prototyping
The XC2S200-6FGG647C offers a cost-effective alternative to mask-programmed ASICs, eliminating NRE costs, reducing development cycles, and enabling field-upgradeable systems.
Why Choose the XC2S200-6FGG647C?
- High Performance: -6 speed grade delivers maximum operating frequencies up to 200 MHz
- Cost-Effective: Optimized 0.18 µm process technology reduces per-unit cost
- Flexible Memory: Combination of block and distributed RAM addresses diverse storage needs
- Comprehensive I/O: 284 user I/O pins with 16 interface standards ensure broad connectivity
- Proven Architecture: Spartan-II family offers mature, well-documented design resources
- Unlimited Reprogrammability: SRAM-based configuration enables infinite design iterations
Ordering Information
Part Number: XC2S200-6FGG647C
- XC2S200: 200K system gate Spartan-II device
- -6: Higher performance speed grade
- FGG: Fine-pitch BGA package (Pb-free)
- 647: 647-pin package
- C: Commercial temperature range (0°C to +85°C)
