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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG646C: High-Performance Spartan-II FPGA for Industrial Applications

Product Details

The AMD XC2S200-6FGG646C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, delivering exceptional performance and versatility for embedded systems, digital signal processing, and industrial control applications. This 200K system gate device combines advanced programmable logic with cost-effective implementation, making it an ideal choice for engineers seeking reliable FPGA solutions.

Key Features of the XC2S200-6FGG646C

The XC2S200-6FGG646C belongs to AMD’s (formerly Xilinx) Spartan-II FPGA series, which has established itself as a superior alternative to traditional mask-programmed ASICs. This device eliminates the initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC designs.

Technical Specifications

Parameter Value
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Speed Grade -6 (Higher Performance)
Package Type FGG646 (Fine-Pitch BGA, Pb-Free)
Operating Temperature 0°C to +85°C (Commercial)
Core Voltage 2.5V
I/O Voltage 1.5V / 2.5V / 3.3V

Memory Resources

The XC2S200-6FGG646C provides abundant on-chip memory options for demanding applications:

  • Distributed RAM: 75,264 bits of flexible LUT-based RAM
  • Block RAM: 56K bits organized in fourteen 4K-bit dual-port modules
  • SelectRAM Technology: Hierarchical memory architecture supporting both synchronous single-port and dual-port configurations

Architecture Overview of the AMD XC2S200-6FGG646C

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG646C features 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB contains four logic cells (LCs), with each LC including:

  • 4-input look-up table (LUT) function generators
  • Dedicated carry logic for high-speed arithmetic
  • Storage elements configurable as flip-flops or latches
  • Cascade chain support for wide-input functions

Advanced Clock Management

Four integrated Delay-Locked Loops (DLLs) provide sophisticated clock control capabilities:

  • Zero propagation delay clock distribution
  • Low clock skew across all output signals
  • Clock multiplication (2×) and division (up to 1/16)
  • Quadrature phase generation (0°, 90°, 180°, 270°)
  • System performance support up to 200 MHz

I/O Capabilities

The XC2S200-6FGG646C supports 16 high-performance I/O standards, enabling seamless integration with various system interfaces:

  • LVTTL (2-24 mA drive strength)
  • LVCMOS2
  • PCI (3.3V/5V, 33 MHz/66 MHz compliant)
  • GTL and GTL+
  • HSTL Class I, III, and IV
  • SSTL2 and SSTL3 Class I and II
  • CTT
  • AGP-2X

Benefits of Choosing the XC2S200-6FGG646C

Cost-Effective Development

The XC2S200-6FGG646C offers unlimited reprogrammability, allowing design upgrades in the field without hardware replacement—a capability impossible with traditional ASICs. This feature significantly reduces time-to-market and development costs.

Pb-Free Package Option

The FGG646C designation indicates a Pb-free (lead-free) fine-pitch BGA package, ensuring compliance with RoHS environmental directives and modern manufacturing requirements.

Comprehensive Development Support

Fully supported by AMD’s development tools, the XC2S200-6FGG646C benefits from:

  • Automatic mapping, placement, and routing
  • Timing-driven implementation
  • Extensive library of over 400 primitives and macros
  • IEEE 1149.1 boundary scan testing support

Ideal Applications for the XC2S200-6FGG646C

The versatile XC2S200-6FGG646C excels in numerous applications:

  • Telecommunications: Protocol bridging, data encoding/decoding
  • Industrial Automation: Motor control, sensor interfaces, PLC implementations
  • Consumer Electronics: Video processing, audio systems
  • Automotive Systems: Dashboard controllers, infotainment interfaces
  • Medical Devices: Signal processing, control systems
  • Aerospace & Defense: Communication systems, data acquisition

Configuration Options

The XC2S200-6FGG646C supports multiple configuration modes for flexible system integration:

  • Master Serial Mode: Internal oscillator-driven configuration
  • Slave Serial Mode: External clock-controlled configuration
  • Slave Parallel Mode: High-speed byte-wide configuration (up to 66 MHz)
  • Boundary-Scan Mode: JTAG-based configuration through TAP

Why Choose the Spartan-II XC2S200-6FGG646C?

For engineers and designers seeking a reliable, high-performance programmable logic solution, the XC2S200-6FGG646C delivers the perfect balance of capability and cost-effectiveness. Its robust feature set, combined with AMD’s proven reliability, makes it an excellent choice for both new designs and legacy system upgrades.

Explore our complete selection of Xilinx FPGA devices to find the perfect solution for your project requirements.

Ordering Information

Part Number Description
XC2S200-6FGG646C Spartan-II FPGA, 200K Gates, -6 Speed, FGG646 Pb-Free Package, Commercial Temperature

The XC2S200-6FGG646C represents AMD’s commitment to delivering powerful, cost-effective FPGA solutions for demanding applications. Contact your authorized distributor for pricing and availability.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.