The AMD XC2S200-6FGG645C is a powerful Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional performance and reliability for demanding industrial and commercial applications. This versatile programmable logic device combines advanced reconfigurable architecture with cost-effective implementation, making it an ideal solution for engineers seeking robust digital signal processing and control system capabilities.

Key Features of the XC2S200-6FGG645C FPGA

The XC2S200-6FGG645C offers an impressive combination of programmable resources and high-speed performance characteristics that set it apart in the embedded systems market.

Core Logic Architecture

The XC2S200-6FGG645C features a comprehensive set of programmable resources built on proven 0.18μm CMOS technology:

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG645C utilizes an advanced CLB architecture consisting of four logic cells per block. Each logic cell includes a 4-input function generator, dedicated carry logic, and configurable storage elements that can operate as D-type flip-flops or level-sensitive latches.

Input/Output Block (IOB) Capabilities

The programmable I/O blocks support multiple industry-standard signaling interfaces, including LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, and SSTL. This versatility enables seamless integration with diverse system components and modern memory interfaces.

Advanced Memory Resources

Block RAM Features

The XC2S200-6FGG645C incorporates 56 Kbits of dedicated block RAM organized in dual-port synchronous memory blocks. Each 4,096-bit RAM block offers:

• Independent read and write ports
• Configurable data width options
• True dual-port operation with separate control signals
• Support for various memory configurations

Distributed RAM Capability

Beyond block RAM, the XC2S200-6FGG645C provides 75,264 bits of distributed RAM implemented within the CLB structure, offering flexible shallow memory structures ideal for register files and small FIFO buffers.

Clock Management with Delay-Locked Loops

The XC2S200-6FGG645C includes four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:

• Clock deskewing and phase adjustment
• Clock multiplication and division
• Board-level clock synchronization across multiple devices
• Reduced clock-to-output delays

Package Specifications for the XC2S200-6FGG645C

The XC2S200-6FGG645C is available in a Fine-Pitch Ball Grid Array (FBGA) package that optimizes board space while ensuring excellent thermal performance and signal integrity.

Physical Characteristics

Target Applications for the XC2S200-6FGG645C

The XC2S200-6FGG645C excels in numerous industrial and commercial applications where reprogrammability and cost-effectiveness are paramount.

Industrial Automation

Deploy the XC2S200-6FGG645C in motor control systems, PLC implementations, and factory automation equipment where reliable operation and field-upgradability are essential.

Telecommunications Equipment

Implement protocol conversion, data routing, and interface bridging functions in networking hardware and communication systems.

Consumer Electronics

Leverage the XC2S200-6FGG645C for video processing, display controllers, and multimedia applications requiring high-performance digital logic.

Automotive Systems

Utilize the robust architecture for automotive control units, sensor interfaces, and in-vehicle networking applications.

Embedded Systems Development

The XC2S200-6FGG645C serves as an excellent platform for prototyping and production in embedded applications requiring customizable hardware functionality.

Why Choose the AMD XC2S200-6FGG645C Over Traditional ASICs?

The XC2S200-6FGG645C offers compelling advantages compared to mask-programmed Application-Specific Integrated Circuits (ASICs):

• Eliminates NRE Costs: No expensive tooling or mask charges
• Faster Time-to-Market: Skip lengthy ASIC development cycles
• Field Upgradability: Reprogram designs without hardware replacement
• Reduced Risk: Validate designs before committing to production
• Unlimited Reprogramming: Update functionality throughout product lifecycle

Development Tools and Design Support

The XC2S200-6FGG645C is fully supported by comprehensive development tools and resources available from AMD and the broader Xilinx FPGA ecosystem.

Software Development Environment

Design entry, synthesis, implementation, and verification are supported through professional-grade software tools compatible with industry-standard HDL languages including VHDL and Verilog.

Configuration Options

Multiple configuration modes enable flexible deployment scenarios:

• Master Serial Mode
• Slave Serial Mode
• Master Parallel Mode
• Slave Parallel Mode
• Boundary Scan (JTAG) Configuration

Technical Documentation and Resources

Comprehensive documentation supports successful implementation of the XC2S200-6FGG645C:

• Complete family datasheet (DS001)
• Pinout specifications and package drawings
• Application notes and reference designs
• User guides and design guidelines
• IBIS models for signal integrity analysis

Ordering Information for the XC2S200-6FGG645C

When ordering the XC2S200-6FGG645C, consider the following product code components:

• XC2S200: Device density (200K system gates)
• -6: Speed grade (highest performance tier)
• FGG: Fine-pitch BGA package with Pb-free designation
• 645C: Pin count and commercial temperature range

Conclusion

The AMD XC2S200-6FGG645C represents a proven, cost-effective FPGA solution delivering 200,000 system gates, 5,292 logic cells, and 263 MHz operation in a reliable package. Whether developing industrial automation systems, telecommunications equipment, or embedded applications, the XC2S200-6FGG645C provides the programmable logic resources, memory capabilities, and clock management features needed for successful project implementation.

Contact authorized distributors for current pricing, availability, and technical support for the XC2S200-6FGG645C and other Spartan-II family devices.