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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG644C Spartan-II FPGA | High-Performance Programmable Logic Device

Product Details

The AMD XC2S200-6FGG644C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This powerful programmable logic device delivers exceptional performance, extensive logic resources, and advanced features at a competitive price point. Designed for engineers and system designers requiring reliable, cost-effective solutions, the XC2S200-6FGG644C serves as a superior alternative to mask-programmed ASICs.

Key Features of AMD XC2S200-6FGG644C FPGA

The XC2S200-6FGG644C offers an impressive combination of density, speed, and flexibility that makes it ideal for a wide range of industrial, commercial, and consumer applications. This Xilinx FPGA solution eliminates the initial cost, lengthy development cycles, and inherent risk associated with conventional ASICs while providing unlimited reprogrammability for field upgrades.

Core Architecture Specifications

The XC2S200-6FGG644C leverages the proven Spartan-II architecture, featuring a streamlined design based on Virtex FPGA technology. The device utilizes cost-effective 0.18-micron process technology to achieve optimal performance and power efficiency.

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum Frequency 263 MHz
Process Technology 0.18 µm
Core Voltage 2.5V
Package Type FGG644 (Fine Pitch BGA)
Temperature Range Commercial (0°C to +85°C)
Speed Grade -6 (Higher Performance)

XC2S200-6FGG644C Memory Resources

The AMD XC2S200-6FGG644C incorporates a sophisticated hierarchical memory architecture that provides designers with flexible storage options for various application requirements.

Block RAM Configuration

Memory Type Capacity Configuration Options
Block RAM Blocks 14 Dual-port synchronous
Total Block RAM 56 Kbits 4,096 bits per block
Distributed RAM 75,264 bits 16 bits per LUT
RAM Width Options 1, 2, 4, 8, 16 bits Configurable depth

Memory Features Overview

The SelectRAM hierarchical memory system enables designers to implement:

  • High-speed synchronous single-port and dual-port RAM
  • Configurable 4K-bit block RAM modules
  • 16-bit shift registers for DSP applications
  • Fast interfaces to external memory devices
  • Built-in bus-width conversion capabilities

I/O Standards and Interface Support

The XC2S200-6FGG644C provides comprehensive I/O flexibility with support for 16 high-performance interface standards, making it compatible with virtually any system architecture.

Supported I/O Standards Table

I/O Standard Reference Voltage (VREF) Output Voltage (VCCO) Application
LVTTL N/A 3.3V General purpose
LVCMOS2 N/A 2.5V Low-voltage CMOS
PCI (33/66 MHz) N/A 3.3V Peripheral bus
GTL 0.8V N/A Backplane interface
GTL+ 1.0V N/A High-speed backplane
HSTL Class I 0.75V 1.5V Memory interface
HSTL Class III/IV 0.9V 1.5V DDR memory
SSTL3 Class I/II 1.5V 3.3V SDRAM interface
SSTL2 Class I/II 1.25V 2.5V DDR SDRAM
CTT 1.5V 3.3V Cache interface
AGP-2X 1.32V 3.3V Graphics interface

I/O Electrical Characteristics

Parameter Specification
Maximum User I/O 284 pins
Output Drive Current Up to 24 mA source, 48 mA sink
I/O Banks 8 independent banks
Global Clock Pins 4 dedicated
5V Tolerant Inputs Yes (LVTTL, LVCMOS2, PCI)
Hot-Swap Support Compact PCI compatible

Clock Management and Distribution

The XC2S200-6FGG644C features advanced clock management capabilities through its integrated Delay-Locked Loop (DLL) circuits, ensuring optimal timing performance across the entire device.

DLL Specifications

Feature Capability
Number of DLLs 4
Clock Multiplication
Clock Division 1.5, 2, 2.5, 3, 4, 5, 8, 16
Quadrature Phases 0°, 90°, 180°, 270°
Global Clock Networks 4 primary
Clock Skew Minimized through dedicated routing
Zero Delay Buffer Yes

Clock Distribution Benefits

  • Eliminates clock distribution delay
  • Provides low-skew clock signals throughout the device
  • Supports board-level clock deskewing
  • Enables multiple clock domain management
  • Guarantees system clock stability before device startup

Configuration and Programming Options

The XC2S200-6FGG644C supports multiple configuration modes, offering flexibility in system design and manufacturing processes.

Configuration Modes Comparison

Mode Data Width CCLK Direction Features
Master Serial 1-bit Output PROM-based, autonomous
Slave Serial 1-bit Input Daisy-chain capable
Slave Parallel 8-bit Input Fastest configuration
Boundary Scan (JTAG) 1-bit N/A IEEE 1149.1 compliant

Configuration Specifications

Parameter Value
Configuration File Size 1,335,840 bits
Maximum CCLK Frequency 66 MHz
Configuration without Handshake 50 MHz max
Unlimited Reprogrammability Yes
In-System Programming Yes
Readback Capability Full verification support

Applications for XC2S200-6FGG644C FPGA

The versatile architecture of the XC2S200-6FGG644C makes it suitable for diverse applications across multiple industries.

Industrial Applications

  • Process control systems
  • Motor drive controllers
  • Industrial automation equipment
  • Programmable logic controllers (PLC)
  • Data acquisition systems

Communications Applications

  • Network switching equipment
  • Protocol conversion bridges
  • Base station controllers
  • Fiber optic transceivers
  • Encryption/decryption modules

Consumer Electronics

  • Video processing systems
  • Audio DSP implementations
  • Display controllers
  • Gaming peripherals
  • Set-top box designs

Automotive and Transportation

  • In-vehicle infotainment systems
  • Advanced driver assistance systems (ADAS)
  • Instrument cluster controllers
  • Body electronics modules
  • Diagnostic interfaces

Development Tools and Software Support

The XC2S200-6FGG644C is fully supported by the Xilinx ISE Development System, providing comprehensive design entry, implementation, and verification capabilities.

Design Flow Support

Tool Category Capabilities
Design Entry Schematic, HDL (VHDL, Verilog)
Synthesis Automatic mapping and optimization
Implementation Place-and-route with timing-driven algorithms
Verification Simulation, static timing analysis, readback
Programming Multiple configuration modes
Debug In-circuit debugging, ChipScope

Library Resources

The unified library includes over 400 primitives and macros:

  • Boolean logic functions
  • Arithmetic operators and accumulators
  • Counters and shift registers
  • Multiplexers and decoders
  • I/O primitives and buffers
  • Memory elements and FIFOs

Ordering Information for XC2S200-6FGG644C

Part Number Breakdown

Code Element Meaning
XC2S200 Spartan-II, 200K system gates
-6 Speed grade (higher performance)
FGG Fine-pitch BGA, Pb-free
644 Pin count
C Commercial temperature (0°C to +85°C)

Package Specifications

Parameter Specification
Package Type Fine Pitch Ball Grid Array
Pin Count 644
Pb-Free Yes (RoHS Compliant)
Ball Pitch 1.0 mm
Moisture Sensitivity MSL-3

Why Choose AMD XC2S200-6FGG644C

The XC2S200-6FGG644C delivers significant advantages for modern electronic system designs:

Cost-Effectiveness

  • Eliminates NRE costs associated with ASIC development
  • Reduces time-to-market with rapid prototyping
  • Enables field upgrades without hardware replacement
  • Provides cost-effective 0.18 µm process technology

Performance Benefits

  • System clock rates up to 200 MHz
  • Fast carry logic for high-speed arithmetic
  • Dedicated multiplier support
  • Low-power segmented routing architecture

Design Flexibility

  • Unlimited reprogrammability
  • Multiple configuration options
  • Comprehensive I/O standard support
  • Scalable architecture within device family

Reliability

  • Proven Spartan-II architecture
  • Full PCI compliance
  • IEEE 1149.1 boundary scan support
  • Comprehensive ESD protection

Technical Documentation and Resources

Engineers working with the XC2S200-6FGG644C can access comprehensive technical documentation including:

  • Complete datasheet (DS001)
  • User guides and application notes
  • Reference designs and IP cores
  • Development board schematics
  • Configuration and readback guides

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.