The AMD XC2S200-6FGG641C is a high-performance Field Programmable Gate Array (FPGA) from the industry-proven Spartan-II family, delivering exceptional programmable logic capabilities for demanding industrial, commercial, and embedded applications. This 200K system gate FPGA combines cost-effective implementation with advanced digital design flexibility, making it an ideal solution for engineers seeking reliable alternatives to mask-programmed ASICs.
XC2S200-6FGG641C Key Features and Benefits
The XC2S200-6FGG641C offers comprehensive functionality that enables engineers to implement complex digital designs with confidence. As a member of the Xilinx FPGA product portfolio (now AMD), this device provides field-upgradable programmability that eliminates the lengthy development cycles and high initial costs associated with traditional ASICs.
Superior Programmable Logic Architecture
The Spartan-II XC2S200-6FGG641C features an advanced programmable architecture built on proven 0.18μm process technology. This architecture provides designers with the flexibility to implement custom logic functions, signal processing algorithms, and control systems efficiently.
High-Speed Performance with -6 Speed Grade
The -6 speed grade designation indicates this is the fastest commercial-grade option available in the Spartan-II family, enabling high-frequency operation up to 263MHz for time-critical applications.
XC2S200-6FGG641C Technical Specifications
| Parameter |
Specification |
| Device Family |
AMD/Xilinx Spartan-II |
| Part Number |
XC2S200-6FGG641C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 CLBs) |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Delay-Locked Loops (DLLs) |
4 |
| Operating Voltage |
2.5V |
| Process Technology |
0.18μm |
| Package Type |
Fine Pitch BGA (FBGA) |
| Speed Grade |
-6 (Fastest Commercial) |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Pb-Free (Lead-Free) |
XC2S200-6FGG641C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG641C contains 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB provides flexible look-up tables (LUTs), flip-flops, and routing resources essential for implementing combinational and sequential logic circuits. This extensive CLB array supports complex digital designs including state machines, arithmetic units, and custom processing pipelines.
Input/Output Blocks (IOBs)
With up to 284 user-configurable I/O pins, the XC2S200-6FGG641C delivers exceptional connectivity for interfacing with external components, memory devices, and communication peripherals. The IOBs support multiple I/O standards, enabling seamless integration into diverse system architectures.
Dual-Port Block RAM
The integrated 56 Kbits of dual-port block RAM provides high-bandwidth on-chip memory resources. Each block RAM cell is a fully synchronous dual-ported 4,096-bit RAM with independent control signals for each port, offering flexible data width configurations for buffering, FIFO implementation, and local data storage applications.
Distributed RAM Resources
The XC2S200-6FGG641C includes 75,264 bits of distributed RAM implemented within the CLB fabric. This distributed memory enables fast, localized storage for small data structures, lookup tables, and shift registers without consuming dedicated block RAM resources.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops positioned at each corner of the die provide advanced clock management capabilities. The DLLs enable clock deskewing, frequency synthesis, and phase shifting—critical functions for high-speed synchronous designs and multi-clock domain applications.
XC2S200-6FGG641C Package Information
FGG641 Fine Pitch Ball Grid Array Package
The XC2S200-6FGG641C utilizes a fine pitch Ball Grid Array (BGA) package designed for high-density PCB mounting applications. Key package characteristics include:
- Package Style: Fine Pitch FBGA
- Lead-Free Construction: RoHS compliant Pb-free solder balls
- Thermal Performance: Optimized for reliable heat dissipation
- Mounting: Surface mount technology (SMT) compatible
Package Marking and Identification
The “G” character in the FGG641 designation indicates Pb-free packaging, ensuring compliance with environmental regulations including RoHS and WEEE directives.
XC2S200-6FGG641C Configuration Options
The Spartan-II XC2S200-6FGG641C supports multiple configuration modes for flexible system integration:
Master Serial Mode
In Master Serial mode, the FPGA generates the configuration clock and reads bitstream data from an external serial PROM or flash memory device.
Slave Parallel Mode
Slave Parallel mode enables 8-bit parallel configuration with an externally supplied clock, supporting faster configuration times for time-sensitive applications.
Slave Serial Mode
The Slave Serial configuration mode accepts serial bitstream data with an external clock source, ideal for daisy-chain configurations with multiple FPGAs.
JTAG/Boundary-Scan Mode
Full IEEE 1149.1 boundary-scan support enables in-system configuration and testing through the standard JTAG interface, simplifying board-level debugging and production testing.
XC2S200-6FGG641C Application Areas
Industrial Control Systems
The XC2S200-6FGG641C excels in industrial automation applications including motor control, PLC implementations, sensor interfaces, and real-time monitoring systems where reliability and deterministic performance are essential.
Digital Signal Processing (DSP)
With abundant logic resources and high-speed capability, this FPGA supports DSP algorithm implementation for audio processing, image filtering, and communication signal conditioning applications.
Telecommunications Equipment
Network interface cards, protocol converters, and communication bridges benefit from the XC2S200-6FGG641C’s flexible I/O and processing capabilities.
Embedded Systems
The cost-effective nature and programmable flexibility make this device ideal for embedded controllers, custom peripheral interfaces, and system-on-chip prototyping.
Test and Measurement
Automated test equipment, data acquisition systems, and instrumentation applications leverage the FPGA’s reconfigurable logic for custom measurement implementations.
XC2S200-6FGG641C Design Resources
Development Software
The XC2S200-6FGG641C is supported by Xilinx ISE Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and verification.
Documentation Available
- Complete datasheet (DS001) with detailed specifications
- User guides and application notes
- Package pinout diagrams
- Reference designs and IP cores
Design Entry Support
- VHDL and Verilog HDL synthesis
- Schematic capture tools
- IP core integration
- Timing constraint management
XC2S200-6FGG641C Ordering Information
Part Number Breakdown
| Code Element |
Meaning |
| XC2S200 |
Spartan-II 200K gate device |
| -6 |
Speed grade (fastest commercial) |
| FGG |
Fine pitch BGA, Pb-free |
| 641 |
Pin count |
| C |
Commercial temperature range |
Temperature Range Options
- C (Commercial): 0°C to +85°C ambient
- Note: The -6 speed grade is exclusively available in commercial temperature range
Why Choose XC2S200-6FGG641C for Your Design
Cost-Effective ASIC Alternative
The XC2S200-6FGG641C eliminates the high NRE costs and lengthy mask development cycles associated with custom ASICs, enabling faster time-to-market with lower project risk.
Field Upgradability
Unlike fixed-function ASICs, the programmable nature of this FPGA allows design updates and feature enhancements after deployment—impossible with hardwired alternatives.
Proven Reliability
The Spartan-II family has demonstrated exceptional reliability across millions of deployed units in demanding commercial and industrial environments worldwide.
Comprehensive Ecosystem
Extensive documentation, development tools, IP libraries, and global technical support ensure successful design implementation from concept through production.
XC2S200-6FGG641C Summary
The AMD XC2S200-6FGG641C Spartan-II FPGA delivers a powerful combination of 200,000 system gates, 5,292 logic cells, integrated memory resources, and advanced clock management in a lead-free BGA package. With its -6 speed grade performance, flexible configuration options, and cost-effective architecture, this programmable gate array serves as an excellent solution for industrial control, DSP, telecommunications, and embedded system applications requiring reliable, high-performance programmable logic.