The AMD XC2S200-6FGG637C is a powerful Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, delivering exceptional performance for demanding digital design applications. This programmable logic device combines robust architecture with cost-effective implementation, making it an ideal solution for engineers seeking reliable FPGA technology.

XC2S200-6FGG637C Overview and Key Features

The XC2S200-6FGG637C belongs to the Spartan-II FPGA family, originally developed by Xilinx and now part of AMD’s semiconductor portfolio. This device offers 200,000 system gates and is designed for high-volume, cost-sensitive applications that require programmable logic solutions.

Core Architecture Specifications

The XC2S200-6FGG637C features a comprehensive set of technical specifications:

XC2S200-6FGG637C Package Information

The FGG637 package designation indicates a Fine-pitch Ball Grid Array (FBGA) configuration with 637 balls, providing extensive I/O connectivity for complex system designs. This Pb-free (lead-free) package variant, indicated by the “G” suffix, ensures RoHS compliance and environmental safety standards.

Spartan-II FPGA Architecture Details

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG637C contains 1,176 Configurable Logic Blocks arranged in a 28 x 42 array. Each CLB includes four Logic Cells (LCs), with each LC containing a 4-input function generator (Look-Up Table), carry logic, and a storage element. This architecture provides exceptional flexibility for implementing complex digital designs.

Block RAM Memory Resources

This Xilinx FPGA device incorporates 14 dedicated block RAM modules, providing 56 kilobits of dual-port synchronous memory. Each block RAM cell offers 4,096 bits of storage with independent read and write ports, supporting configurable data widths from 1 to 16 bits.

Distributed RAM Capabilities

Beyond block RAM, the XC2S200-6FGG637C provides 75,264 bits of distributed RAM implemented within the CLB Look-Up Tables. This distributed memory architecture enables high-speed local storage for data buffering and small memory applications.

XC2S200-6FGG637C I/O Standards and Interface Support

Multi-Voltage I/O Capability

The XC2S200-6FGG637C supports multiple I/O voltage standards, enabling seamless integration with various system components:

• LVTTL (3.3V Low-Voltage TTL)
• LVCMOS (3.3V, 2.5V)
• PCI (3.3V compliant)
• GTL+
• SSTL3 (Class I and II)
• SSTL2 (Class I and II)
• HSTL (Class I, III, and IV)
• AGP-2X

Input/Output Block Features

Each IOB (Input/Output Block) in the XC2S200-6FGG637C includes programmable input and output registers, 3-state control, and programmable pull-up/pull-down resistors. The SelectI/O technology allows engineers to configure I/O pins for various signaling standards without external components.

Clock Management with Delay-Locked Loops

Four Integrated DLLs

The XC2S200-6FGG637C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:

• Clock deskew capability
• Clock multiplication (2x)
• Clock division (1.5x, 2x, 2.5x, 3x, 4x, 5x, 8x, 16x)
• Phase shift control
• Clock mirroring for board-level synchronization

Global Clock Distribution

The device features four dedicated global clock networks, each driven by global clock buffers (BUFGCLKs). These networks distribute clock signals with minimal skew across the entire FPGA, ensuring reliable synchronous operation.

XC2S200-6FGG637C Application Areas

Industrial Automation and Control

The XC2S200-6FGG637C excels in industrial control systems requiring:

• Motor control algorithms
• Process automation
• PLC (Programmable Logic Controller) implementations
• Sensor interface and signal conditioning
• Real-time data acquisition

Telecommunications Infrastructure

This FPGA supports telecommunications applications including:

• Protocol conversion and bridging
• Data encoding and decoding
• Channel interface management
• Base station signal processing
• Network switching equipment

Consumer Electronics

The XC2S200-6FGG637C is well-suited for consumer products such as:

• Digital video processing
• Audio signal processing
• Display controllers
• Gaming systems
• Set-top boxes

Medical Equipment

Healthcare applications benefit from the device’s reliability:

• Patient monitoring systems
• Diagnostic imaging equipment
• Medical instrument control
• Laboratory automation
• Portable medical devices

XC2S200-6FGG637C Programming and Configuration

Configuration Modes

The XC2S200-6FGG637C supports multiple configuration modes:

In-System Programmability

One significant advantage of the XC2S200-6FGG637C is unlimited reprogrammability. Engineers can update device configurations in the field without hardware modifications, reducing development costs and enabling feature upgrades throughout the product lifecycle.

Speed Grade -6 Performance Specifications

The -6 speed grade designation indicates the highest performance variant within the Spartan-II family. Key timing parameters include:

• Internal clock frequency up to 263 MHz
• Fast propagation delays through logic
• Optimized routing resources for timing-critical designs
• Commercial temperature range operation (0°C to +85°C)

XC2S200-6FGG637C Design Resources and Development Tools

Software Support

The XC2S200-6FGG637C is supported by industry-standard development tools:

• Xilinx ISE Design Suite (recommended for Spartan-II devices)
• Third-party synthesis tools (Synplify, Precision)
• Simulation tools (ModelSim, VCS)
• Hardware description languages (VHDL, Verilog)

Design Documentation

Comprehensive documentation available includes:

• Complete device datasheet (DS001)
• Package pinout drawings
• PCB design guidelines
• Configuration application notes
• Reference designs and IP cores

Ordering Information for XC2S200-6FGG637C

Part Number Breakdown

Understanding the part number structure helps identify device specifications:

• XC2S200: Spartan-II device with 200K system gates
• -6: Speed grade (highest performance)
• FGG: Fine-pitch BGA, Pb-free package
• 637: Number of package pins
• C: Commercial temperature range (0°C to +85°C)

Quality and Compliance

The XC2S200-6FGG637C meets stringent quality standards:

• RoHS compliant (lead-free)
• ISO 9001 certified manufacturing
• AEC-Q100 qualification available for automotive variants
• JEDEC standard packaging

Why Choose the XC2S200-6FGG637C FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG637C provides a superior alternative to mask-programmed ASICs, eliminating:

• High NRE (Non-Recurring Engineering) costs
• Long development and fabrication cycles
• Risk of silicon respins
• Inflexibility to design changes

Proven Technology

As part of the established Spartan-II family, the XC2S200-6FGG637C benefits from:

• Mature, well-documented architecture
• Extensive application heritage
• Reliable manufacturing processes
• Long-term availability commitments

Flexible System Integration

The device’s comprehensive feature set enables:

• Multi-standard I/O interfacing
• On-chip memory resources
• Flexible clock management
• Easy prototyping and production transition

Technical Support and Resources

Engineers working with the XC2S200-6FGG637C can access:

• AMD technical documentation portal
• Application engineering support
• Online community forums
• Training and certification programs
• Reference design libraries

Conclusion

The AMD XC2S200-6FGG637C represents an excellent choice for designers requiring a reliable, high-performance FPGA solution. With 200,000 system gates, extensive I/O capabilities, and robust clock management features, this Spartan-II device delivers the programmable logic resources needed for sophisticated digital designs across industrial, telecommunications, consumer, and medical applications.

Whether upgrading legacy designs or developing new products, the XC2S200-6FGG637C provides the performance, flexibility, and cost-effectiveness that modern electronic systems demand.