Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG633C FPGA: Complete Specifications and Features Guide

Product Details

The AMD XC2S200-6FGG633C is a high-performance programmable logic device from the renowned Spartan-II FPGA family. This cost-effective FPGA solution delivers exceptional performance for industrial, communications, and embedded applications requiring reliable logic integration. With 200,000 system gates and advanced speed grade -6 performance, the XC2S200-6FGG633C provides engineers with a versatile platform for complex digital designs.


Key Features of the XC2S200-6FGG633C FPGA

High-Density Logic Architecture

The XC2S200-6FGG633C offers substantial logic resources designed to meet demanding application requirements:

  • System Gates: 200,000 gates for complex logic implementation
  • Logic Cells: 5,292 equivalent logic cells
  • CLB Array: 28 × 42 Configurable Logic Block matrix
  • Flip-Flops: 5,292 registers for sequential logic designs

Flexible Memory Options

This Xilinx FPGA incorporates multiple memory architectures to support diverse design needs:

  • Total RAM Capacity: Up to 57,344 bits of Block RAM
  • Distributed RAM: 43,008 bits available within CLB slices
  • Block SelectRAM: Dual-port memory blocks for high-bandwidth applications
  • Memory Configuration: Supports various configurations including 4K × 4, 2K × 8, 1K × 16, and 512 × 32

XC2S200-6FGG633C Technical Specifications

Package and Pin Configuration

Parameter Specification
Part Number XC2S200-6FGG633C
Package Type Fine-Pitch Ball Grid Array (FBGA)
Pin Count 633 Pins
Body Size 27mm × 27mm
Ball Pitch 1.0mm
Operating Temperature Commercial (0°C to +85°C)

Performance Specifications

Characteristic Value
Speed Grade -6 (High Performance)
System Clock Frequency Up to 200 MHz
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, SSTL, CTT, AGP-2X
DLL Units 4 Delay-Locked Loops
Global Clock Networks 4 Primary Clock Lines

Electrical Characteristics

Parameter Minimum Typical Maximum Unit
Core Voltage (VCCINT) 2.375 2.5 2.625 V
I/O Voltage (VCCO) 1.4 3.6 V
Input Low Voltage -0.5 0.8 V
Input High Voltage 2.0 VCCO+0.5 V

XC2S200-6FGG633C Architecture Overview

Configurable Logic Blocks (CLBs)

The CLB architecture in the XC2S200-6FGG633C provides exceptional flexibility for implementing combinatorial and sequential logic functions:

  • Each CLB contains 4 logic cells arranged in 2 slices
  • 4-input Look-Up Tables (LUTs) for function generation
  • Dedicated carry logic for arithmetic operations
  • Fast interconnect resources for critical timing paths

Input/Output Block Features

The advanced IOB structure supports multiple I/O standards and features:

  • Programmable output drive strength (2mA to 24mA)
  • Selectable slew rate control
  • Built-in pull-up and pull-down resistors
  • 3-state output capability
  • Double Data Rate (DDR) register support

Clock Management with DLLs

Four integrated Delay-Locked Loops provide advanced clock management:

  • Clock de-skew for improved timing margins
  • Frequency synthesis (1.5×, 2×, 4× multiplication)
  • Phase shifting capability (0°, 90°, 180°, 270°)
  • Low-jitter clock distribution

XC2S200-6FGG633C Application Areas

Industrial Automation

The robust specifications of the XC2S200-6FGG633C make it suitable for industrial control systems, motor drives, and process automation equipment requiring deterministic timing and high reliability.

Telecommunications Equipment

This FPGA excels in telecommunications applications including protocol bridging, data aggregation, and interface conversion for networking equipment.

Consumer Electronics

Cost-effective pricing combined with comprehensive I/O support enables deployment in display controllers, audio processing systems, and multimedia devices.

Prototyping and Development

The generous logic resources and flexible I/O make the XC2S200-6FGG633C an excellent choice for ASIC prototyping and system development platforms.


Ordering Information for XC2S200-6FGG633C

Part Number Decoder

Code Segment Meaning
XC2S Spartan-II Family
200 200K System Gates
-6 Speed Grade -6
FG Fine-pitch BGA Package
G633 633-Pin Configuration
C Commercial Temperature Range

Related Part Numbers

  • XC2S200-6FGG633I (Industrial Temperature: -40°C to +100°C)
  • XC2S150-6FGG633C (150K Gates Version)
  • XC2S300-6FGG633C (300K Gates Version)

Design Resources and Support

Development Tools

  • AMD Vivado Design Suite (Legacy ISE Support)
  • Comprehensive IP Core Library
  • Reference Designs and Application Notes

Configuration Methods

The XC2S200-6FGG633C supports multiple configuration modes:

  • Master Serial Mode
  • Slave Serial Mode
  • Master Parallel (SelectMAP) Mode
  • Slave Parallel Mode
  • JTAG/Boundary Scan Configuration

Why Choose the XC2S200-6FGG633C FPGA

The AMD XC2S200-6FGG633C delivers an optimal balance of performance, density, and cost-effectiveness. Its proven Spartan-II architecture ensures reliable operation while the comprehensive I/O capabilities support seamless system integration. Engineers benefit from extensive documentation, robust development tools, and long-term availability for production designs.

For demanding applications requiring programmable logic solutions, the XC2S200-6FGG633C represents a proven, field-tested choice backed by AMD’s comprehensive support ecosystem.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.