The AMD XC2S200-6FGG632C is a high-performance Field Programmable Gate Array from the renowned Spartan-II FPGA family. This powerful programmable logic device delivers exceptional flexibility, robust processing capabilities, and cost-effective solutions for demanding digital design applications.

XC2S200-6FGG632C Key Features and Benefits

The XC2S200-6FGG632C FPGA combines advanced architecture with industry-leading reliability. Engineers choose this device for its superior alternative to traditional mask-programmed ASICs, eliminating lengthy development cycles and reducing inherent manufacturing risks.

High-Density Logic Resources

The XC2S200-6FGG632C provides substantial programmable resources for complex digital implementations. This Spartan-II device features 200,000 system gates with 5,292 logic cells organized in a 28 × 42 CLB array totaling 1,176 Configurable Logic Blocks. The architecture supports sophisticated designs requiring extensive logic density without compromising performance or power efficiency.

Advanced Memory Architecture

This Xilinx FPGA integrates SelectRAM hierarchical memory technology that delivers versatile data storage options. The device includes 75,264 bits of distributed RAM offering 16 bits per LUT configuration. Additionally, 56K bits of dedicated block RAM provide configurable dual-port memory blocks supporting various width configurations for optimized data throughput.

High-Speed Performance Specifications

The XC2S200-6FGG632C operates at frequencies up to 263MHz, enabling demanding signal processing and high-bandwidth applications. The -6 speed grade designation indicates optimized timing parameters for commercial temperature range operations between 0°C and 85°C.

XC2S200-6FGG632C Technical Specifications

Spartan-II Architecture Advantages

Configurable Logic Block Structure

Each CLB in the XC2S200-6FGG632C contains four logic cells with 4-input function generators, storage elements, and dedicated carry logic. This architecture enables efficient implementation of arithmetic functions, state machines, and complex combinational logic. The four direct feedthrough paths per CLB provide additional routing flexibility for high-performance designs.

Flexible Input/Output Block Configuration

The programmable IOB structure supports 16 different I/O signaling standards including LVTTL, LVCMOS, PCI, GTL, SSTL, and HSTL interfaces. This comprehensive I/O compatibility ensures seamless integration with diverse memory interfaces, processor buses, and peripheral components. Three IOB registers per block function as edge-triggered flip-flops or level-sensitive latches with independent clock enable signals.

Delay-Locked Loop Technology

Four integrated DLLs positioned at each die corner provide precise clock management capabilities. These DLLs eliminate clock distribution delays, support clock multiplication and division, and enable phase-shifted clock outputs for advanced timing requirements. The clock mirror functionality allows board-level clock deskewing across multiple devices.

XC2S200-6FGG632C Application Areas

The XC2S200-6FGG632C FPGA excels in numerous application domains where programmable logic provides distinct advantages over fixed-function alternatives.

Telecommunications and Networking

Protocol processing, channel coding, encryption acceleration, and network interface implementations benefit from the device’s high-speed I/O capabilities and substantial logic density. The flexible memory architecture supports packet buffering and data queuing requirements.

Industrial Control Systems

Real-time control algorithms, motor drive applications, sensor interface processing, and PLC implementations leverage the FPGA’s deterministic timing characteristics. In-system reprogrammability enables field upgrades without hardware replacement.

Consumer Electronics

Video processing, audio enhancement, display controllers, and gaming peripherals utilize the cost-effective programmable platform. The compact FBGA package optimizes PCB area while maintaining excellent thermal performance.

Aerospace and Defense

Radiation-tolerant designs, signal intelligence processing, radar implementations, and secure communications rely on the device’s proven reliability and extensive configuration options.

Design Development and Software Support

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG632C receives full support from Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Both VHDL and Verilog HDL design flows enable efficient development workflows with automated placement, routing, and timing optimization.

Configuration Options

Multiple configuration modes support diverse system architectures. Master and Slave Serial modes interface with external configuration PROMs. Slave Parallel mode enables high-speed byte-wide configuration from microprocessors or CPLDs. Boundary Scan (JTAG) configuration supports in-system programming and debugging capabilities.

Development Resources

Extensive application notes, reference designs, and implementation guidelines accelerate product development. Evaluation boards and starter kits provide immediate prototyping capabilities for proof-of-concept validation.

Package Information and PCB Design Considerations

The Fine-Pitch Ball Grid Array package delivers optimal signal integrity and thermal dissipation characteristics. The ball grid configuration ensures reliable solder connections for high-volume manufacturing processes. Recommended PCB design practices include proper power supply decoupling, controlled impedance routing for high-speed signals, and adequate thermal relief provisions.

Quality and Compliance Standards

The XC2S200-6FGG632C meets stringent quality requirements for commercial applications. Pb-free packaging options indicated by the “G” character in the part number support RoHS compliance initiatives. Standard export documentation applies with ECCN classification for international shipments.

Ordering Information Decoded

Understanding the XC2S200-6FGG632C part number structure:

• XC2S – Spartan-II FPGA family identifier
• 200 – 200,000 system gate density
• -6 – Speed grade (highest performance in commercial range)
• FG – Fine-pitch BGA package type
• G – Pb-free (lead-free) designation
• 632 – Pin count
• C – Commercial temperature range

Why Choose the XC2S200-6FGG632C FPGA

The XC2S200-6FGG632C delivers compelling value for digital design projects requiring programmable logic solutions. The combination of generous logic resources, flexible memory options, high-speed performance, and comprehensive I/O capabilities addresses diverse application requirements. Field-programmable architecture eliminates NRE costs associated with ASIC development while enabling rapid design iterations and in-field upgrades impossible with hardwired alternatives.

Engineers selecting the XC2S200-6FGG632C benefit from proven silicon reliability backed by extensive design resources and worldwide technical support. The Spartan-II platform’s established design ecosystem ensures long-term component availability and sustained engineering support throughout product lifecycles.