The AMD XC2S200-6FGG627C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II series. This programmable logic device delivers exceptional flexibility with 200,000 system gates and advanced I/O capabilities, making it an excellent choice for cost-sensitive embedded systems, telecommunications equipment, and industrial automation applications.
XC2S200-6FGG627C Key Features and Specifications
The XC2S200-6FGG627C combines robust processing power with versatile connectivity options. Engineers and designers choose this FPGA for its optimal balance between performance, power consumption, and cost-effectiveness.
Device Architecture Overview
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG627C |
| Manufacturer |
AMD (formerly Xilinx) |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Speed Grade |
-6 (High Performance) |
| Package Type |
FGG627C (Fine-Pitch BGA) |
| Operating Temperature |
Commercial (0°C to +85°C) |
Memory Resources
The XC2S200-6FGG627C provides generous on-chip memory for demanding applications:
| Memory Type |
Capacity |
| Block RAM |
56 Kbits (14 blocks × 4,096 bits) |
| Distributed RAM |
73,728 bits |
| Total RAM |
129,728 bits |
Clock Management
| Feature |
Specification |
| Delay-Locked Loops (DLLs) |
4 |
| Maximum Internal Clock |
200 MHz |
| Clock Deskew |
Supported |
| Frequency Synthesis |
2× multiplication |
XC2S200-6FGG627C Electrical Characteristics
Understanding the electrical specifications ensures proper system integration and reliable operation of the XC2S200-6FGG627C.
Power Supply Requirements
| Supply Rail |
Voltage |
Description |
| VCCINT |
2.5V ± 5% |
Internal core logic supply |
| VCCO |
1.5V to 3.3V |
I/O bank supply (programmable) |
| VCCAUX |
3.3V |
Auxiliary supply for DLLs |
I/O Standards Supported
The XC2S200-6FGG627C supports multiple I/O standards for maximum design flexibility:
- LVTTL (3.3V Low-Voltage TTL)
- LVCMOS (1.5V, 2.5V, 3.3V)
- PCI 3.3V (33 MHz and 66 MHz compliant)
- GTL and GTL+
- HSTL Class I, II, III, IV
- SSTL2 Class I and II
- SSTL3 Class I and II
- CTT (Center-Tapped Termination)
- AGP 2×
FGG627C Package Information
The FGG627C package configuration provides excellent signal integrity and thermal performance for the XC2S200-6FGG627C.
Package Specifications
| Parameter |
Value |
| Package Type |
Fine-Pitch Ball Grid Array |
| Pin Count |
627 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
27 mm × 27 mm |
| Maximum User I/O |
284+ |
| Thermal Resistance (θJA) |
Approximately 18°C/W |
Pin Categories
| Pin Type |
Function |
| User I/O |
General purpose programmable I/O |
| VCCINT |
Core power supply |
| VCCO |
I/O bank power supply |
| GND |
Ground connections |
| Configuration |
JTAG, mode, and programming pins |
| DLL |
Clock input and feedback pins |
XC2S200-6FGG627C Speed Grade Analysis
The -6 speed grade designation indicates this XC2S200-6FGG627C variant offers the highest performance tier available for the Spartan-II 200K device.
Timing Performance
| Parameter |
-6 Speed Grade |
| CLB Toggle Rate |
Up to 200 MHz |
| I/O Toggle Rate |
Up to 200 MHz |
| Block RAM Speed |
200 MHz |
| System Clock |
200 MHz maximum |
Speed Grade Comparison
| Speed Grade |
Performance Level |
Application Focus |
| -5 |
Standard |
Cost-sensitive designs |
| -6 |
High Performance |
Performance-critical applications |
Target Applications for XC2S200-6FGG627C
The versatile XC2S200-6FGG627C FPGA addresses diverse market requirements across multiple industries.
Industrial Applications
- Programmable Logic Controllers (PLCs)
- Motor control systems
- Industrial networking equipment
- Factory automation interfaces
- Sensor data acquisition systems
Telecommunications
- Network switching equipment
- Protocol converters
- Base station controllers
- VoIP processing systems
- SDH/SONET interfaces
Consumer Electronics
- Set-top boxes
- Digital video processing
- Audio processing systems
- Gaming peripherals
- Display controllers
Embedded Systems
- Microcontroller co-processors
- Custom peripheral interfaces
- Real-time data processing
- System-on-Chip prototyping
- Legacy system bridges
Design Resources and Development Tools
Developing with the XC2S200-6FGG627C is streamlined through AMD’s comprehensive toolchain and extensive documentation. For additional Xilinx FPGA resources and product availability, engineers can access specialized component distributors.
Software Support
| Tool |
Purpose |
| Vivado Design Suite |
Primary development environment |
| ISE Design Suite |
Legacy support (recommended for Spartan-II) |
| ModelSim |
Simulation and verification |
| ChipScope Pro |
On-chip debugging |
Development Resources
- Reference designs and application notes
- Constraint file templates
- IBIS models for signal integrity analysis
- Power estimation spreadsheets
- PCB footprint libraries
XC2S200-6FGG627C Ordering Information
Part Number Breakdown
XC2S200-6FGG627C
│ │ │ │ │ │
│ │ │ │ │ └── Temperature: C = Commercial (0°C to +85°C)
│ │ │ │ └───── Pin Count: 627
│ │ │ └──────── Package: FGG = Fine-pitch BGA
│ │ └────────── Speed Grade: -6 = Highest performance
│ └────────────── Device Density: 200 = 200,000 system gates
└──────────────── Family: XC2S = Spartan-II
Quality and Compliance
| Standard |
Status |
| RoHS Compliance |
RoHS Compliant |
| Lead-Free |
Available |
| Moisture Sensitivity |
MSL-3 |
| ESD Rating |
Class 2 (HBM) |
Technical Summary: Why Choose XC2S200-6FGG627C
The AMD XC2S200-6FGG627C delivers a compelling combination of features for embedded and industrial FPGA applications:
- Proven Architecture – Built on the reliable Spartan-II platform with extensive field deployment history
- High Gate Density – 200,000 system gates enable complex logic implementations
- Fast Performance – The -6 speed grade ensures 200 MHz operation capability
- Flexible I/O – Multiple voltage standards support diverse interface requirements
- Robust Memory – Combined 129+ Kbits of on-chip RAM reduces external memory needs
- Commercial Temperature – Qualified for 0°C to +85°C industrial environments
- Large Package Option – FGG627C BGA maximizes available I/O for complex designs
