The AMD XC2S200-6FGG626C is a high-performance Field Programmable Gate Array (FPGA) from the legendary Spartan-II family. This programmable logic device delivers exceptional digital processing capabilities with 200,000 system gates, making it the ideal solution for engineers seeking reliable, cost-effective embedded system designs.

XC2S200-6FGG626C Product Overview

The XC2S200-6FGG626C represents the flagship model of the Spartan-II FPGA series, originally developed by Xilinx and now part of AMD’s comprehensive programmable logic portfolio. Built on advanced 0.18-micron CMOS technology, this FPGA provides an optimal balance of performance, power efficiency, and affordability.

As a superior alternative to mask-programmed ASICs, the XC2S200-6FGG626C eliminates lengthy development cycles and reduces project risk. The device supports unlimited reprogrammability, enabling design upgrades in the field without hardware replacement. For more Xilinx FPGA solutions, explore our comprehensive product catalog.

Key Features of the XC2S200-6FGG626C Spartan-II FPGA

High-Density Logic Resources

The XC2S200-6FGG626C offers impressive logic capacity for complex digital designs:

Advanced Speed Grade Performance

The “-6” speed grade designation indicates this is the higher-performance variant within the Spartan-II XC2S200 family. System clock rates up to 200 MHz are supported, with internal logic capable of operating at frequencies exceeding 263 MHz.

Lead-Free 626-Pin Fine-Pitch BGA Package

The FGG626C package configuration provides several advantages for modern PCB designs:

• Lead-free (Pb-free) RoHS-compliant packaging
• Fine-pitch Ball Grid Array (BGA) construction
• Commercial temperature range: 0°C to +85°C
• Enhanced thermal dissipation characteristics
• Reliable solder joint integrity

XC2S200-6FGG626C Technical Specifications

Electrical Characteristics

Versatile I/O Standards Support

The XC2S200-6FGG626C supports 16 high-performance interface standards for maximum design flexibility:

• LVTTL (2-24 mA drive strength)
• LVCMOS2 (2.5V logic)
• PCI 3.3V/5V (33 MHz and 66 MHz)
• GTL and GTL+ signaling
• HSTL Class I, III, and IV
• SSTL2 and SSTL3 Class I/II
• CTT (Center-Tapped Termination)
• AGP-2X graphics interface

XC2S200-6FGG626C Architecture and Design Resources

Configurable Logic Block Structure

Each CLB in the XC2S200-6FGG626C contains four Logic Cells (LCs) organized in two identical slices. This architecture provides:

• 4-input Look-Up Tables (LUTs) for function generation
• Dedicated carry logic for high-speed arithmetic
• Built-in storage elements configurable as flip-flops or latches
• Direct feedthrough paths for efficient routing

Hierarchical Memory System

The XC2S200-6FGG626C features a comprehensive SelectRAM memory architecture:

• Distributed RAM: 16 bits per LUT for small, fast memory arrays
• Block RAM: 14 dedicated 4K-bit blocks (56 Kbits total)
• Dual-port capability with independent read/write clocks
• Configurable aspect ratios from 1×4096 to 16×256

Clock Management with Delay-Locked Loops

Four on-chip Delay-Locked Loops (DLLs) provide advanced clock distribution:

• Zero propagation delay through closed-loop compensation
• Low clock skew across the entire device
• Clock multiplication (2X) and division (up to 16X)
• Quadrature phase generation (0°, 90°, 180°, 270°)
• Clock mirroring for board-level synchronization

XC2S200-6FGG626C Application Areas

Industrial Control Systems

The XC2S200-6FGG626C excels in industrial automation and control applications requiring real-time processing capabilities. Its robust commercial temperature rating and reliable operation make it suitable for factory automation, motor control, and process monitoring systems.

Telecommunications Infrastructure

With full PCI compliance and high-speed I/O support, the XC2S200-6FGG626C is well-suited for telecommunications equipment including protocol converters, interface bridges, and network processing units.

Digital Signal Processing

The dedicated carry logic and block RAM resources enable efficient implementation of DSP algorithms for audio processing, video encoding, and software-defined radio applications.

Embedded Computing

As a cost-effective ASIC replacement, the XC2S200-6FGG626C serves as an excellent platform for embedded systems, custom peripheral interfaces, and hardware acceleration units.

XC2S200-6FGG626C Ordering Information

Part Number Breakdown

Configuration and Programming Support

The XC2S200-6FGG626C supports multiple configuration modes:

• Master Serial mode with external PROM
• Slave Serial mode for daisy-chain configurations
• Slave Parallel mode for high-speed programming
• Boundary Scan (JTAG) IEEE 1149.1 compatible

Development Tools and Software Support

The XC2S200-6FGG626C is fully supported by AMD/Xilinx ISE Design Suite, providing:

• Automatic mapping, placement, and routing
• Comprehensive library of over 400 primitives and macros
• Timing-driven implementation tools
• In-system debugging capabilities
• Full EDIF netlist compatibility

Why Choose the XC2S200-6FGG626C FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG626C eliminates expensive ASIC development costs while maintaining production-grade reliability. Unlimited reprogrammability enables field upgrades and rapid design iterations.

Proven Technology

Built on the well-established Spartan-II architecture, this FPGA delivers time-tested performance with extensive third-party IP core availability and comprehensive documentation.

Flexible Integration

With support for 16 I/O standards and extensive routing resources, the XC2S200-6FGG626C integrates seamlessly into diverse system architectures.

Long-Term Availability

As part of AMD’s legacy FPGA portfolio, the XC2S200-6FGG626C remains available through authorized distributors and provides a stable platform for ongoing production requirements.